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公开(公告)号：US20140253794A1
公开(公告)日：2014-09-11
申请号：US14155311
申请日：2014-01-14
IPC分类号： H04N5/225
CPC分类号： H04N5/2257 , H01L24/47 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2924/00014 , H04N5/2253 , H04N5/2254 , H01L2224/45015 , H01L2924/207
摘要： A camera module, in which a recessed portion that has a greater depth than the thickness of an imaging device is disposed on the surface (top surface) of an embedded-component substrate. An imaging device is bonded to a bottom of the recessed portion such that an opening is present between the surface (top surface) of the imaging device and the surface (top surface) of the embedded-component substrate. Connection pads on the imaging device are connected to conductor pads disposed on the surface (top surface) of the embedded-component substrate by bonding wires that go through the opening.
摘要翻译： 在嵌入式部件基板的表面（上表面）上设置相机模块，其中具有比成像装置的厚度更大的深度的凹部。 成像装置结合到凹部的底部，使得在成像装置的表面（顶表面）和嵌入部件基板的表面（顶表面）之间存在开口。 成像装置上的连接焊盘通过接合穿过开口的导线连接到设置在嵌入式组件衬底的表面（顶表面）上的导体焊盘。
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公开(公告)号：US20150070862A1
公开(公告)日：2015-03-12
申请号：US14101026
申请日：2013-12-09
IPC分类号： H05K1/18
CPC分类号： H05K1/186 , H01L24/19 , H01L2224/04105 , H01L2924/12042 , H01L2924/15151 , H05K1/185 , H05K3/4608 , H05K2201/09063 , H05K2201/09427 , H05K2201/09854 , H01L2924/00
摘要： There is provided a substrate with built-in component, including a metal core layer having a cavity for storing a component; a wiring layer that is laminated on the core layer and has a plurality of vias for an interlayer connection, the vias being formed at regions opposing to the cavity; and an electronic component including a plurality of terminals electrically connected to the plurality of vias, and a component body that is stored in the cavity and has a support surface for supporting the plurality of terminals, the plurality of terminals being disposed eccentrically from a center of the support surface to a first direction, and the component body being disposed eccentrically from a center of the cavity to a second direction opposite to the first direction.
摘要翻译： 提供了具有内置部件的基板，包括具有用于存储部件的空腔的金属芯层; 层叠在所述芯层上并具有多个用于层间连接的通孔的布线层，所述通孔形成在与所述空腔相对的区域处; 以及电子部件，包括电连接到所述多个通孔的多个端子，以及存储在所述空腔中并具有用于支撑所述多个端子的支撑表面的部件主体，所述多个端子偏离所述多个端子的中心 所述支撑表面朝向第一方向，并且所述部件主体从所述腔的中心偏心地设置到与所述第一方向相反的第二方向。
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3.发明申请SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT AND CORE BASE-MATERIAL FOR SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT 审中-公开具有内置电子元件的基板和具有内置电子元件的基板的芯基材料公开(公告)号：US20150068795A1
公开(公告)日：2015-03-12
申请号：US14103639
申请日：2013-12-11
IPC分类号： H05K1/18
CPC分类号： H05K3/4697 , H05K1/185
摘要： A substrate with built-in electronic component includes an electronic component, a first wiring layer, a second wiring layer, a via, and a core base-material. The first wiring layer has a first wiring portion. The second wiring layer has a second wiring portion. The via is configured to electrically connect the first wiring portion and the second wiring portion. The core base-material has a metal layer, at least one first storage portion, and a second storage portion, the metal layer being disposed between the first wiring layer and the second wiring layer, the at least one first storage portion being formed in the metal layer, the at least one first storage portion storing the electronic component, the second storage portion being formed on an outside of the first storage portion integrally with the first storage portion, the second storage portion storing the via.
摘要翻译： 具有内置电子部件的基板包括电子部件，第一布线层，第二布线层，通孔和芯基材。 第一布线层具有第一布线部。 第二布线层具有第二布线部。 通孔被配置为电连接第一布线部分和第二布线部分。 芯基材具有金属层，至少一个第一储存部分和第二存储部分，金属层设置在第一布线层和第二布线层之间，所述至少一个第一存储部分形成在 金属层，所述至少一个第一存储部分存储电子部件，所述第二存储部分与所述第一存储部分一体地形成在所述第一存储部分的外侧上，所述第二存储部分存储所述通孔。
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公开(公告)号：US20150098203A1
公开(公告)日：2015-04-09
申请号：US14566470
申请日：2014-12-10
CPC分类号： H05K1/185 , H05K1/0213 , H05K1/0271 , H05K1/0298 , H05K2201/09063 , H05K2203/1178
摘要： In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively.
摘要翻译： 在分别与具有穿过其的存储部分的芯层最靠近的第一导电层和第三导电层中，形成四个第一穿透孔和四个第一穿透孔，以与存储部分的开口边缘的一部分重叠 其分别投影到第一导电层和第三导电层上。
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公开(公告)号：US20150010694A1
公开(公告)日：2015-01-08
申请号：US14316382
申请日：2014-06-26
CPC分类号： H05K3/4697 , B05D3/12 , B05D5/12 , H05K1/185 , H05K3/0044 , H05K3/007 , H05K3/0094 , H05K3/04 , H05K3/06 , H05K3/30 , H05K3/42 , H05K3/445 , H05K3/4608 , H05K3/4647 , H05K2201/10204
摘要： The method of manufacturing a substrate includes: forming a penetrating hole in a base layer; inserting a metal dummy part in the penetrating hole; forming an insulating portion made of synthetic resin to fill a ring-shaped gap between the penetrating hole and the dummy part; forming lower insulating layers, covering the bottom surface of the dummy part, that are made of synthetic resin on the bottom surface of the base layer to be continuous with the insulating portion; forming upper insulating layers, covering the top surface of the dummy part, that are made of synthetic resin on the top surface of the base layer to be continuous with the insulating portion; forming an exposing hole by routing in the upper insulating layers to expose the top surface of the dummy part; and forming a cavity by removing the dummy part exposed through the exposing hole by etching.
摘要翻译： 制造基板的方法包括：在基层中形成贯通孔; 将金属虚设部件插入穿透孔中; 形成由合成树脂制成的绝缘部分，以填充所述穿透孔和所述虚拟部件之间的环形间隙; 在所述基底层的底面上形成覆盖所述虚拟部的底面的由合成树脂制成的下绝缘层，以与所述绝缘部连续; 在所述基底层的顶表面上形成覆盖所述虚拟部分的上表面的由合成树脂制成的上绝缘层，以与所述绝缘部分连续; 通过在上绝缘层中布线来形成暴露孔以暴露虚拟部分的顶表面; 并且通过蚀刻去除暴露在暴露孔中的虚拟部分来形成空腔。
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公开(公告)号：US20140252522A1
公开(公告)日：2014-09-11
申请号：US14155308
申请日：2014-01-14
IPC分类号： H01L27/146
CPC分类号： H01L27/14627 , H01L27/146 , H01L27/14605 , H01L27/14618 , H01L27/14625 , H01L27/14636 , H01L2224/48091 , H01L2224/48227 , H01L2924/15192 , H01L2924/19105 , H01L2924/00014
摘要： In a camera module, a planar part, which is for mitigating deformation of the surface of a second insulating portion on which an imaging device is mounted, is embedded in the second insulating portion of a substrate so as to face the imaging device mounted on the surface (top surface) of the second insulating portion.
摘要翻译： 在相机模块中，用于减轻其上安装有成像装置的第二绝缘部分的表面的变形的平面部分被嵌入到基板的第二绝缘部分中，以面对安装在基板上的成像装置 第二绝缘部分的表面（顶表面）。
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公开(公告)号：US20150049439A1
公开(公告)日：2015-02-19
申请号：US14090387
申请日：2013-11-26
发明人： Masaya SHIMAMURA , Kenzo KITAZAKI , Eiji MUGIYA , Tatsuro SAWATARI , Tetsuo SAJI , Hiroshi NAKAMURA
IPC分类号： H05K1/02
CPC分类号： H05K1/0216 , H01L21/561 , H01L23/3135 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H05K1/0218 , H05K3/107 , H05K3/284 , H05K2201/0715 , H05K2201/09036 , H05K2201/09827 , H05K2201/09972 , H01L2924/00
摘要： A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield.
摘要翻译： 电路模块包括电路基板，安装部件，密封体和屏蔽件。 电路基板包括安装表面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有从密封体的主表面到安装表面形成的沟槽。 沟槽包括由安装表面侧的第一侧壁和主表面侧的第二侧壁构成的侧壁。 连接第一点和第二点的直线具有比靠着安装表面的第一斜坡更缓和的第二斜率。 屏蔽罩覆盖密封体并具有形成在沟槽内的内屏蔽部分和设置在主表面和内屏蔽上的外屏蔽部分。
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公开(公告)号：US20140355232A1
公开(公告)日：2014-12-04
申请号：US14461245
申请日：2014-08-15
发明人： Tatsuro SAWATARI , Yuichi SUGIYAMA
CPC分类号： H05K1/0216 , H05K1/0231 , H05K1/0298 , H05K1/183 , H05K1/185 , H05K3/4697 , H05K2201/0187 , H05K2201/10522
摘要： A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and a plurality of electronic components that each include a first terminal and a second terminal and are stored in the cavity, the plurality of electronic components each having one end portion and the other end portion, the first terminal being formed at the one end portion and connected to the ground wiring, the second terminal being formed at the other end portion and connected to the signal wiring, the plurality of electronic components having at least one of arrangements in which the first terminals face each other and in which the second terminals face each other.
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公开(公告)号：US20140133120A1
公开(公告)日：2014-05-15
申请号：US13909880
申请日：2013-06-04
CPC分类号： H05K1/185 , H05K1/0213 , H05K1/0271 , H05K1/0298 , H05K2201/09063 , H05K2203/1178
摘要： In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively.
摘要翻译： 在分别与具有穿过其的存储部分的芯层最靠近的第一导电层和第三导电层中，形成四个第一穿透孔和四个第一穿透孔，以与存储部分的开口边缘的一部分重叠 其分别投影到第一导电层和第三导电层上。
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公开(公告)号：US20140307402A1
公开(公告)日：2014-10-16
申请号：US14133372
申请日：2013-12-18
CPC分类号： H05K1/183 , H01L24/19 , H01L2224/04105 , H01L2924/12042 , H01L2924/19105 , H05K1/0298 , H05K1/185 , H05K3/4602 , H05K2201/0209 , H05K2201/068 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , H01L2924/00
摘要： Provided is a substrate with built-in electronic component including a component storage layer and two buildup layers. The component storage layer includes an electronic component and a cover portion having an insulating property. The electronic component includes a terminal surface and a main body. The cover portion includes a first surface formed to be flush with the terminal surface, covers the main body of the electronic component, and has a first linear expansion coefficient. The two buildup layers each include an insulating layer and a via portion. The insulating layer is adjacent to the cover portion and has a second linear expansion coefficient larger than the first linear expansion coefficient. The via portion is provided in the insulating layer and connected to the terminal surface. The insulating layer of one of the two buildup layers is formed to be in contact with the terminal surface and the first surface.
摘要翻译： 提供了具有内置电子部件的基板，包括部件存储层和两个累积层。 部件存储层包括电子部件和具有绝缘性的盖部。 电子部件包括终端面和主体。 盖部包括形成为与端子表面齐平的第一表面，覆盖电子部件的主体，并且具有第一线性膨胀系数。 两个堆积层各自包括绝缘层和通孔部分。 绝缘层与盖部相邻，并且具有大于第一线膨胀系数的第二线膨胀系数。 通孔部分设置在绝缘层中并连接到端子表面。 两个堆积层之一的绝缘层形成为与端子表面和第一表面接触。
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