发明申请
- 专利标题： SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT
- 专利标题（中）： 带有内置电子元件的基板
-
申请号： US13909880申请日： 2013-06-04
-
公开(公告)号： US20140133120A1公开(公告)日： 2014-05-15
- 发明人: Tatsuro SAWATARI , Yuichi SUGIYAMA , Hiroshi NAKAMURA , Masaki NAGANUMA , Tetsuo SAJI
- 申请人： TAIYO YUDEN CO., LTD.
- 优先权： JP2012-247417 20121109
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H05K1/02
摘要：
In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively.
公开/授权文献
- US08923009B2 Substrate with built-in electronic component 公开/授权日：2014-12-30
信息查询
