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公开(公告)号：US20140307402A1
公开(公告)日：2014-10-16
申请号：US14133372
申请日：2013-12-18
CPC分类号： H05K1/183 , H01L24/19 , H01L2224/04105 , H01L2924/12042 , H01L2924/19105 , H05K1/0298 , H05K1/185 , H05K3/4602 , H05K2201/0209 , H05K2201/068 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , H01L2924/00
摘要： Provided is a substrate with built-in electronic component including a component storage layer and two buildup layers. The component storage layer includes an electronic component and a cover portion having an insulating property. The electronic component includes a terminal surface and a main body. The cover portion includes a first surface formed to be flush with the terminal surface, covers the main body of the electronic component, and has a first linear expansion coefficient. The two buildup layers each include an insulating layer and a via portion. The insulating layer is adjacent to the cover portion and has a second linear expansion coefficient larger than the first linear expansion coefficient. The via portion is provided in the insulating layer and connected to the terminal surface. The insulating layer of one of the two buildup layers is formed to be in contact with the terminal surface and the first surface.
摘要翻译： 提供了具有内置电子部件的基板，包括部件存储层和两个累积层。 部件存储层包括电子部件和具有绝缘性的盖部。 电子部件包括终端面和主体。 盖部包括形成为与端子表面齐平的第一表面，覆盖电子部件的主体，并且具有第一线性膨胀系数。 两个堆积层各自包括绝缘层和通孔部分。 绝缘层与盖部相邻，并且具有大于第一线膨胀系数的第二线膨胀系数。 通孔部分设置在绝缘层中并连接到端子表面。 两个堆积层之一的绝缘层形成为与端子表面和第一表面接触。
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