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公开(公告)号:US20160064322A1
公开(公告)日:2016-03-03
申请号:US14476349
申请日:2014-09-03
发明人: Chih-Liang CHEN , Chih-Ming LAI , Yung-Sung YEN , Kam-Tou SIO , Tsong-Hua OU , Chun-Kuang CHEN , Ru-Gun LIU , Shu-Hui SUNG , Charles Chew-Yuen YOUNG
IPC分类号: H01L23/528 , H01L23/522 , H01L27/118
CPC分类号: H01L23/528 , H01L23/5226 , H01L27/0207 , H01L27/11803 , H01L2924/0002 , H01L2924/00
摘要: Semiconductor structures are provided. The semiconductor structure includes a plurality of gate structures extending in a first direction formed over a substrate and a contact formed adjacent to the gate structures over the substrate. The semiconductor structure further includes a plurality of metal layers formed over the gate structures. In addition, some of the metal layers include metal lines extending in the first direction, and some of the metal layers include metal lines extending in a second direction substantially perpendicular to the first direction. Furthermore, the gate structures follow the following equation: 0.2 P gate min + 0.35 L gate min + 0.3 H gate min - 20 0.2 L gate min + 0.8 H gate min - 5 × 0.3 L gate min + 0.3 H gate min + 5 38 ≤ 0.32 Pgate min is the minimum value among gate pitches of the gate structures. Lgate min is the minimum value among gate lengths of the gate structures. Hgate min is the minimum value among gate heights of the gate structures.
摘要翻译: 提供半导体结构。 半导体结构包括沿着形成在衬底上的第一方向延伸的多个栅极结构以及与衬底上的栅极结构相邻形成的触点。 半导体结构还包括形成在栅极结构上的多个金属层。 此外,一些金属层包括在第一方向上延伸的金属线,并且一些金属层包括沿基本上垂直于第一方向的第二方向延伸的金属线。 此外,栅极结构遵循以下公式:0.2P门min + 0.35min min min H门槛最小 - 5×0.3L门min + 0.3H门min + 5 38≤0.32 P门min是门结构的栅间距中的最小值。 Lgate min是门结构的栅极长度之间的最小值。 Hgate min是门结构栅极高度的最小值。
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公开(公告)号:US20160320706A1
公开(公告)日:2016-11-03
申请号:US15189311
申请日:2016-06-22
发明人: Chin-Hsiung HSU , Huang-Yu CHEN , Tsong-Hua OU , Wen-Hao CHEN
IPC分类号: G03F7/20 , G06F17/50 , G03F1/70 , H01L21/3213
CPC分类号: G03F7/2022 , G03F1/70 , G06F17/5068 , H01L21/3213 , H05K3/0005 , H05K3/0082 , H05K3/06 , H05K3/068 , H05K2201/09781 , H05K2203/0557 , H05K2203/1476 , Y10T29/49156
摘要: A method includes patterning a layer over a substrate with a first metal pattern; using a cut mask in a first position relative to the substrate to perform a first cut patterning for removing material from a first region within the first pattern; and using the same cut mask to perform a second cut patterning while in a second position relative to the same layer over the substrate, for removing material from a second region in a second metal pattern of the same layer over the substrate.
摘要翻译: 一种方法包括用第一金属图案在衬底上图案化层; 在相对于所述基板的第一位置使用切割掩模,以执行用于从所述第一图案内的第一区域去除材料的第一切割图案; 并且使用相同的切割掩模在相对于衬底上的相同层的第二位置执行第二切割图案,用于从衬底上的相同层的第二金属图案中的第二区域去除材料。
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3.
公开(公告)号:US20160172297A1
公开(公告)日:2016-06-16
申请号:US15050087
申请日:2016-02-22
发明人: Chih-Liang CHEN , Chih-Ming LAI , Yung-Sung YEN , Kam-Tou SIO , Tsong-Hua OU , Chun-Kuang CHEN , Ru-Gun LIU , Shu-Hui SUNG , Charles Chew-Yuen YOUNG
IPC分类号: H01L23/528 , H01L27/118 , H01L27/02 , H01L23/522
CPC分类号: H01L23/528 , H01L23/5226 , H01L27/0207 , H01L27/11803 , H01L2924/0002 , H01L2924/00
摘要: Semiconductor structures are provided. The semiconductor structure includes a plurality of gate structures extending in a first direction formed over a substrate. The gate structures follow the following equation: 0.2 P gate min + 0.35 L gate min + 0.3 H gate min - 20 0.2 L gate min + 0.8 H gate min - 5 × 0.3 L gate min + 0.3 H gate min + 5 38 ≤ 0.32 Pgate min is the minimum value among gate pitches of the gate structures, and Lgate min is the minimum value among gate lengths of the gate structures. Hgate min is the minimum value among gate heights of the gate structures.
摘要翻译: 提供半导体结构。 半导体结构包括沿着形成在衬底上的第一方向延伸的多个栅极结构。 门结构遵循以下公式:0.2P门min + 0.35min min min min 最小 - 5×0.3英尺L门槛最小+ 0.3H门min + 5 38≤0.32 Pgate min是栅极结构的栅间距中的最小值,Lgate min是 栅极结构的栅极长度。 Hgate min是门结构栅极高度的最小值。
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公开(公告)号:US20140259658A1
公开(公告)日:2014-09-18
申请号:US13924681
申请日:2013-06-24
发明人: Chin-Hsiung HSU , Huang-Yu CHEN , Tsong-Hua OU , Wen-Hao CHEN
IPC分类号: H05K3/08
CPC分类号: G03F7/2022 , G03F1/70 , G06F17/5068 , H01L21/3213 , H05K3/0005 , H05K3/0082 , H05K3/06 , H05K3/068 , H05K2201/09781 , H05K2203/0557 , H05K2203/1476 , Y10T29/49156
摘要: A method includes patterning a layer over a substrate with a first metal pattern; using a cut mask in a first position relative to the substrate to perform a first cut patterning for removing material from a first region within the first pattern; and using the same cut mask to perform a second cut patterning while in a second position relative to the same layer over the substrate, for removing material from a second region in a second metal pattern of the same layer over the substrate.
摘要翻译: 一种方法包括用第一金属图案在衬底上图案化层; 在相对于所述基板的第一位置使用切割掩模,以执行用于从所述第一图案内的第一区域去除材料的第一切割图案; 并且使用相同的切割掩模在相对于衬底上的相同层的第二位置执行第二切割图案,用于从衬底上的相同层的第二金属图案中的第二区域去除材料。
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5.
公开(公告)号:US20140237435A1
公开(公告)日:2014-08-21
申请号:US14267013
申请日:2014-05-01
发明人: Huang-Yu CHEN , Tsong-Hua OU , Ken-Hsien HSIEH , Chin-Hsiung HSU
IPC分类号: G06F17/50
CPC分类号: G06F17/5081 , G06F17/5072 , G06F2217/12
摘要: A method identifies, as an independent node, any node representing a circuit pattern in any odd loop of a layout of a region of a layer of an IC that is not included in any other odd loop of the layout. The layer is to have a plurality of circuit patterns to be patterned using at least three photomasks. The method identifies, as a safe independent node, any independent node not closer than a threshold distance from any other independent nodes in another odd loop of the layout. The layout is modified, if the circuit patterns in the layout include any odd loop without any safe independent node, so that that after the modifying, each odd loop has at least one safe independent node.
摘要翻译: 一种方法将作为独立节点的任何节点表示在不包括在布局的任何其它奇数循环中的IC层的区域的布局的任何奇数循环中的电路图案。 该层将具有使用至少三个光掩模进行图案化的多个电路图案。 该方法将安全独立节点识别为距离布局的另一个奇数循环中任何其他独立节点不超过阈值距离的任何独立节点。 布局被修改,如果布局中的电路图案包括没有任何安全独立节点的任何奇数循环,使得在修改之后,每个奇数循环至少有一个安全独立节点。
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