发明申请
US20160172297A1 DESIGNED-BASED INTERCONNECT STRUCTURE IN SEMICONDUCTOR STRUCTURE
审中-公开
半导体结构中基于设计的互连结构
- 专利标题: DESIGNED-BASED INTERCONNECT STRUCTURE IN SEMICONDUCTOR STRUCTURE
- 专利标题(中): 半导体结构中基于设计的互连结构
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申请号: US15050087申请日: 2016-02-22
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公开(公告)号: US20160172297A1公开(公告)日: 2016-06-16
- 发明人: Chih-Liang CHEN , Chih-Ming LAI , Yung-Sung YEN , Kam-Tou SIO , Tsong-Hua OU , Chun-Kuang CHEN , Ru-Gun LIU , Shu-Hui SUNG , Charles Chew-Yuen YOUNG
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01L23/528
- IPC分类号: H01L23/528 ; H01L27/118 ; H01L27/02 ; H01L23/522
摘要:
Semiconductor structures are provided. The semiconductor structure includes a plurality of gate structures extending in a first direction formed over a substrate. The gate structures follow the following equation: 0.2 P gate min + 0.35 L gate min + 0.3 H gate min - 20 0.2 L gate min + 0.8 H gate min - 5 × 0.3 L gate min + 0.3 H gate min + 5 38 ≤ 0.32 Pgate min is the minimum value among gate pitches of the gate structures, and Lgate min is the minimum value among gate lengths of the gate structures. Hgate min is the minimum value among gate heights of the gate structures.
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