公开(公告)号：US06776692B1

公开(公告)日：2004-08-17

申请号：US09609426

申请日：2000-07-05

申请人： Steven Zuniga ,  Manoocher Birang

发明人： Steven Zuniga ,  Manoocher Birang

IPC分类号： B24B100

CPC分类号： B24B37/013 ,  B24B49/04 ,  B24B49/12 ,  B24B49/16

摘要： Techniques for polishing a wafer (10) include closed-loop control. The wafer can be held by a carrier head (100) having at least one chamber whose pressure is controlled to apply a downward force on the wafer. Thickness-related measurements of the wafer can be obtained during polishing and a thickness profile for the wafer is calculated based on the thickness-related measurements. The calculated thickness profile is compared to a target thickness profile. The pressure in at least one carrier head chamber is adjusted based on results of the comparison. The carrier head chamber pressures can be adjusted to control the amount of downward force applied to the wafer during polishing and/or to control the size of a loading area on the wafer against which the downward force is applied.

摘要翻译： 抛光晶片（10）的技术包括闭环控制。 晶片可以由具有至少一个室的承载头（100）保持，其压力被控制以在晶片上施加向下的力。 在抛光期间可以获得晶片的厚度相关测量，并且基于厚度相关测量计算晶片的厚度分布。 将计算出的厚度分布与目标厚度分布进行比较。 基于比较的结果调整至少一个载体头部腔室中的压力。 可以调节承载头室压力以控制在抛光期间施加到晶片的向下的力的量和/或控制施加向下的力的晶片上的装载区域的尺寸。

公开(公告)号：US06572446B1

公开(公告)日：2003-06-03

申请号：US09664603

申请日：2000-09-18

申请人： Thomas H. Osterheld ,  Manoocher Birang ,  Robert D. Tolles ,  Steven Zuniga ,  Charles C. Garretson

发明人： Thomas H. Osterheld ,  Manoocher Birang ,  Robert D. Tolles ,  Steven Zuniga ,  Charles C. Garretson

IPC分类号： B24B5100

CPC分类号： B24B37/20 ,  B24B37/26 ,  B24B53/017

摘要： A pad conditioning assembly includes a conditioner head with an end effector movable into contact with a polishing pad,a plurality of downwardly-projecting movable conditioning elements disposed at a bottom of the end effector; and a compliant backing member disposed above and adjacent the conditioning elements, wherein forces applied by the compliant backing member are transferred to the movable conditioning elements to move the conditioning elements. In one aspect, a pressurization circuit applies a pressure from a pressure source to the compliant backing member to flex the compliant backing member against the movable conditioning elements.

摘要翻译： 垫调节组件包括具有可与抛光垫接触的末端执行器的调节头，设置在末端执行器底部的多个向下突出的可移动调节元件; 以及设置在调节元件上方并与其相邻的柔顺背衬构件，其中由柔性背衬构件施加的力被传递到可移动调节元件以移动调节元件。 在一个方面，加压电路将来自压力源的压力施加到柔性背衬构件上，以使柔顺背衬构件抵靠可动调节元件弯曲。

公开(公告)号：US6159079A

公开(公告)日：2000-12-12

申请号：US149806

申请日：1998-09-08

申请人： Steven Zuniga ,  Hung Chen ,  Manoocher Birang

发明人： Steven Zuniga ,  Hung Chen ,  Manoocher Birang

IPC分类号： B24B37/30 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B37/30

摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane with a lip portion to engage a substrate to form a seal for improved vacuum-chucking.

公开(公告)号：US07018275B2

公开(公告)日：2006-03-28

申请号：US10886000

申请日：2004-07-06

申请人： Steven Zuniga ,  Manoocher Birang

发明人： Steven Zuniga ,  Manoocher Birang

IPC分类号： B24B11/00

CPC分类号： B24B37/013 ,  B24B49/04 ,  B24B49/12 ,  B24B49/16

摘要： Techniques for polishing a wafer (10) include closed-loop control. The wafer can be held by a carrier head (100) having at least one chamber whose pressure is controlled to apply a downward force on the wafer. Thickness-related measurements of the wafer can be obtained during polishing and a thickness profile for the wafer is calculated based on the thickness-related measurements. The calculated thickness profile is compared to a target thickness profile. The pressure in at least one carrier head chamber is adjusted based on results of the comparison. The carrier head chamber pressures can be adjusted to control the amount of downward force applied to the wafer during polishing and/or to control the size of a loading area on the wafer against which the downward force is applied.

摘要翻译： 抛光晶片（10）的技术包括闭环控制。 晶片可以由具有至少一个室的承载头（100）保持，其压力被控制以在晶片上施加向下的力。 在抛光期间可以获得晶片的厚度相关测量，并且基于厚度相关测量计算晶片的厚度分布。 将计算出的厚度分布与目标厚度分布进行比较。 基于比较的结果调整至少一个载体头部腔室中的压力。 可以调节承载头室压力以控制在抛光期间施加到晶片的向下的力的量和/或控制施加向下的力的晶片上的装载区域的尺寸。

公开(公告)号：US20050020185A1

公开(公告)日：2005-01-27

申请号：US10886000

申请日：2004-07-06

申请人： Steven Zuniga ,  Manoocher Birang

发明人： Steven Zuniga ,  Manoocher Birang

IPC分类号： B24B37/013 ,  B24B49/04 ,  B24B49/12 ,  B24B49/16 ,  H01L21/304 ,  B24B49/00 ,  B24B1/00 ,  B24B51/00

CPC分类号： B24B37/013 ,  B24B49/04 ,  B24B49/12 ,  B24B49/16

摘要： Techniques for polishing a wafer (10) include closed-loop control. The wafer can be held by a carrier head (100) having at least one chamber whose pressure is controlled to apply a downward force on the wafer. Thickness-related measurements of the wafer can be obtained during polishing and a thickness profile for the wafer is calculated based on the thickness-related measurements. The calculated thickness profile is compared to a target thickness profile. The pressure in at least one carrier head chamber is adjusted based on results of the comparison. The carrier head chamber pressures can be adjusted to control the amount of downward force applied to the wafer during polishing and/or to control the size of a loading area on the wafer against which the downward force is applied.

摘要翻译： 抛光晶片（10）的技术包括闭环控制。 晶片可以由具有至少一个室的承载头（100）保持，其压力被控制以在晶片上施加向下的力。 在抛光期间可以获得晶片的厚度相关测量，并且基于厚度相关测量计算晶片的厚度分布。 将计算出的厚度分布与目标厚度分布进行比较。 基于比较的结果调整至少一个载体头部腔室中的压力。 可以调节承载头室压力以控制在抛光期间施加到晶片的向下的力的量和/或控制施加向下的力的晶片上的装载区域的尺寸。

公开(公告)号：US06514124B1

公开(公告)日：2003-02-04

申请号：US09693618

申请日：2000-10-20

申请人： Steven Zuniga ,  Hung Chen ,  Manoocher Birang

发明人： Steven Zuniga ,  Hung Chen ,  Manoocher Birang

IPC分类号： B24B100

CPC分类号： B24B37/30

摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane with a lip portion to engage a substrate to form a seal for improved vacuum-chucking.

摘要翻译： 用于化学机械抛光装置的载体头包括具有唇部的柔性膜，以接合基底以形成用于改善真空吸附的密封。

公开(公告)号：US20050037698A1

公开(公告)日：2005-02-17

申请号：US10946186

申请日：2004-09-20

申请人： Steven Zuniga ,  Manoocher Birang ,  Hung Chen ,  Sen-Hou Ko

发明人： Steven Zuniga ,  Manoocher Birang ,  Hung Chen ,  Sen-Hou Ko

IPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B37/30 ,  B24B37/32

摘要： A carrier head for a chemical mechanical polishing apparatus is described. The carrier head has a base, a rigid body, a membrane and a pressurizing structure. The rigid body is movable relative to the base and includes a downwardly-extending projection. The membrane has a mounting surface for a substrate. The membrane extends below the base to provide a chamber between the base and the membrane. The pressurizing structure applies a downward pressure on the rigid body to cause a lower surface of the rigid body to press on an inner surface of the membrane.

摘要翻译： 描述了用于化学机械抛光装置的载体头。 承载头具有底座，刚体，膜和加压结构。 刚体相对于基座可移动并包括向下延伸的突出部。 膜具有用于基底的安装表面。 膜延伸到底部下方以在基底和膜之间提供腔室。 加压结构向刚体施加向下的压力，以使刚体的下表面压在膜的内表面上。

公开(公告)号：US07775852B2

公开(公告)日：2010-08-17

申请号：US11099789

申请日：2005-04-05

申请人： Manoocher Birang ,  Nils Johansson ,  Allan Gleason

发明人： Manoocher Birang ,  Nils Johansson ,  Allan Gleason

IPC分类号： B24B49/12

CPC分类号： H01L22/12 ,  B24B37/013 ,  B24B37/205 ,  B24B47/12 ,  B24B49/04 ,  B24B49/12 ,  B24B51/00 ,  G01B11/0683

摘要： An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.

摘要翻译： 使用用于在CMP处理期间原地确定终止该过程的端点的装置的晶片的化学机械抛光（CMP）的装置和方法。 该装置包括能够产生朝向晶片的激光束并检测从晶片反射的光的激光干涉仪，以及邻近通过压板形成的孔布置的窗口。 该窗口在晶片覆盖窗口的至少部分时间内为激光束提供通路。

公开(公告)号：US07731566B2

公开(公告)日：2010-06-08

申请号：US11838808

申请日：2007-08-14

申请人： Manoocher Birang ,  Grigory Pyatigorsky

发明人： Manoocher Birang ,  Grigory Pyatigorsky

IPC分类号： B24B49/00

CPC分类号： B24B37/205 ,  B24B37/013 ,  B24B47/12 ,  B24B49/04 ,  B24B49/12 ,  B24B51/00 ,  G01B11/06 ,  G01B11/0683

摘要： A method of polishing a substrate includes holding the substrate on a polishing pad with a polishing head, wherein the polishing pad is supported by a platen, creating relative motion between the substrate and the polishing pad to polish a side of the substrate, generating a light beam and directing the light beam towards the substrate to cause the light beam to impinge on the side of the substrate being polished. Light reflected from the substrate is at a detector to generate an interference signal. A measure of uniformity is computed from the interference signal.

摘要翻译： 抛光衬底的方法包括：将抛光垫保持在具有抛光头的抛光垫上，其中抛光垫由压板支撑，在衬底和抛光垫之间产生相对运动以抛光衬底的侧面，产生光 光束并将光束引向基板，以使光束撞击正在抛光的基板的侧面。 从基板反射的光在检测器处产生干涉信号。 从干扰信号计算均匀度的度量。

公开(公告)号：US07727364B2

公开(公告)日：2010-06-01

申请号：US11362432

申请日：2006-02-24

申请人： Saravjeet Singh ,  Hooman Hafezi ,  Manoocher Birang ,  Aron Rosenfeld ,  Joseph Behnke

发明人： Saravjeet Singh ,  Hooman Hafezi ,  Manoocher Birang ,  Aron Rosenfeld ,  Joseph Behnke

IPC分类号： C25D17/12 ,  C25D7/12

CPC分类号： C25D17/10 ,  C25D5/04 ,  C25D5/18 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/007 ,  C25D17/02 ,  H01L21/2885

摘要： A method and apparatus for plating a metal onto a substrate. One embodiment of the invention provides an apparatus for electrochemically plating a substrate. The apparatus comprises a fluid basin configured to retain a plating solution therein, an anode assembly disposed in the fluid basin, a substrate support member configured to support the substrate and contact the substrate electrically, and an encased auxiliary electrode assembly disposed in the fluid basin. The encased auxiliary electrode assembly generally comprises an auxiliary electrode disposed in a protective tube.

摘要翻译： 一种用于将金属电镀到基底上的方法和装置。 本发明的一个实施例提供了一种用于对基底进行电化学电镀的装置。 该装置包括被配置为在其中保持电镀溶液的流体池，设置在流体池中的阳极组件，被配置为支撑基板并电连接基板的基板支撑构件以及设置在流体池中的封装辅助电极组件。 包封的辅助电极组件通常包括设置在保护管中的辅助电极。