公开(公告)号：US20050186892A1

公开(公告)日：2005-08-25

申请号：US11029287

申请日：2005-01-05

申请人： Hung Chen ,  Steven Zuniga ,  Charles Garretson ,  Thomas Osterheld ,  Sen-Hou Ko ,  Mohsen Salek

发明人： Hung Chen ,  Steven Zuniga ,  Charles Garretson ,  Thomas Osterheld ,  Sen-Hou Ko ,  Mohsen Salek

IPC分类号： B24B37/16 ,  B24B41/047 ,  B24B1/00

CPC分类号： B24B37/16

摘要： A platen for chemical mechanical polishing of a substrate includes a surface upon which a polishing pad can be placed, a support structure, and a controller. The surface has a first region and a second region and is operable to exert force against the polishing pad during polishing. The support structure is located beneath the second region and is operable to cause the second region to exert more force than the first region. The controller is operable to adjust the amount of force that is exerted by the second region.

摘要翻译： 用于基板的化学机械抛光的压板包括可以放置抛光垫的表面，支撑结构和控制器。 表面具有第一区域和第二区域，并且可操作以在抛光期间对抛光垫施加力。 支撑结构位于第二区域下方并且可操作以使第二区域施加比第一区域更多的力。 控制器可操作以调节由第二区域施加的力的量。

公开(公告)号：US20050126708A1

公开(公告)日：2005-06-16

申请号：US10732966

申请日：2003-12-10

申请人： Hung Chen ,  Steven Zuniga

发明人： Hung Chen ,  Steven Zuniga

IPC分类号： B24B37/04 ,  B24B41/06 ,  H01L21/306

CPC分类号： B24B37/32

摘要： A retaining ring for chemical mechanical polishing has a generally annular body with a top surface, a bottom surface, an inner diameter surface, and an outer diameter surface. The bottom surface includes a plurality of channels, each channel extending from the inner diameter surface to the outer diameter surface and having a rounded ceiling.

摘要翻译： 用于化学机械抛光的保持环具有大致环形体，其具有顶表面，底表面，内径表面和外径表面。 底表面包括多个通道，每个通道从内径表面延伸到外径表面并且具有圆形天花板。

公开(公告)号：US06776692B1

公开(公告)日：2004-08-17

申请号：US09609426

申请日：2000-07-05

申请人： Steven Zuniga ,  Manoocher Birang

发明人： Steven Zuniga ,  Manoocher Birang

IPC分类号： B24B100

CPC分类号： B24B37/013 ,  B24B49/04 ,  B24B49/12 ,  B24B49/16

摘要： Techniques for polishing a wafer (10) include closed-loop control. The wafer can be held by a carrier head (100) having at least one chamber whose pressure is controlled to apply a downward force on the wafer. Thickness-related measurements of the wafer can be obtained during polishing and a thickness profile for the wafer is calculated based on the thickness-related measurements. The calculated thickness profile is compared to a target thickness profile. The pressure in at least one carrier head chamber is adjusted based on results of the comparison. The carrier head chamber pressures can be adjusted to control the amount of downward force applied to the wafer during polishing and/or to control the size of a loading area on the wafer against which the downward force is applied.

摘要翻译： 抛光晶片（10）的技术包括闭环控制。 晶片可以由具有至少一个室的承载头（100）保持，其压力被控制以在晶片上施加向下的力。 在抛光期间可以获得晶片的厚度相关测量，并且基于厚度相关测量计算晶片的厚度分布。 将计算出的厚度分布与目标厚度分布进行比较。 基于比较的结果调整至少一个载体头部腔室中的压力。 可以调节承载头室压力以控制在抛光期间施加到晶片的向下的力的量和/或控制施加向下的力的晶片上的装载区域的尺寸。

公开(公告)号：US06572446B1

公开(公告)日：2003-06-03

申请号：US09664603

申请日：2000-09-18

申请人： Thomas H. Osterheld ,  Manoocher Birang ,  Robert D. Tolles ,  Steven Zuniga ,  Charles C. Garretson

发明人： Thomas H. Osterheld ,  Manoocher Birang ,  Robert D. Tolles ,  Steven Zuniga ,  Charles C. Garretson

IPC分类号： B24B5100

CPC分类号： B24B37/20 ,  B24B37/26 ,  B24B53/017

摘要： A pad conditioning assembly includes a conditioner head with an end effector movable into contact with a polishing pad,a plurality of downwardly-projecting movable conditioning elements disposed at a bottom of the end effector; and a compliant backing member disposed above and adjacent the conditioning elements, wherein forces applied by the compliant backing member are transferred to the movable conditioning elements to move the conditioning elements. In one aspect, a pressurization circuit applies a pressure from a pressure source to the compliant backing member to flex the compliant backing member against the movable conditioning elements.

摘要翻译： 垫调节组件包括具有可与抛光垫接触的末端执行器的调节头，设置在末端执行器底部的多个向下突出的可移动调节元件; 以及设置在调节元件上方并与其相邻的柔顺背衬构件，其中由柔性背衬构件施加的力被传递到可移动调节元件以移动调节元件。 在一个方面，加压电路将来自压力源的压力施加到柔性背衬构件上，以使柔顺背衬构件抵靠可动调节元件弯曲。

公开(公告)号：US6159079A

公开(公告)日：2000-12-12

申请号：US149806

申请日：1998-09-08

申请人： Steven Zuniga ,  Hung Chen ,  Manoocher Birang

发明人： Steven Zuniga ,  Hung Chen ,  Manoocher Birang

IPC分类号： B24B37/30 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B37/30

摘要： A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane with a lip portion to engage a substrate to form a seal for improved vacuum-chucking.

公开(公告)号：US20070197141A1

公开(公告)日：2007-08-23

申请号：US11707651

申请日：2007-02-15

申请人： Steven Zuniga ,  Peter McReynolds ,  Erik Rondum ,  Benjamin Bonner ,  Henry Au ,  Gregory Menk ,  Gopalakrishna Prabhu ,  Anand Iyer ,  Garlen Leung

发明人： Steven Zuniga ,  Peter McReynolds ,  Erik Rondum ,  Benjamin Bonner ,  Henry Au ,  Gregory Menk ,  Gopalakrishna Prabhu ,  Anand Iyer ,  Garlen Leung

IPC分类号： B24B7/30 ,  B24B7/00 ,  B24B5/00 ,  B24D11/00

CPC分类号： B24B21/06 ,  B24B21/04 ,  B24B21/12 ,  B24B37/12 ,  B24B37/205 ,  B24B37/26 ,  B24D11/001

摘要： A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad having a groove formed therein, and a vacuum source connected to the groove of the subpad and configured to apply a vacuum sufficient to pull portions of the polishing sheet into the groove of the subpad to induce a groove in the polishing surface.

摘要翻译： 描述了抛光装置。 抛光装置包括可旋转压板，驱动机构，用于逐渐推进具有沿着线性方向的研磨表面的抛光片横过压板，压板上的子垫以支撑抛光片，子板具有形成在其中的凹槽，以及 真空源连接到子垫的凹槽，并被配置为施加足以将抛光片的一部分拉入到子垫的凹槽中以在抛光表面中引起凹槽的真空。

公开(公告)号：US20070082589A1

公开(公告)日：2007-04-12

申请号：US11245867

申请日：2005-10-06

申请人： Steven Zuniga ,  Hung Chen ,  Thomas Brezoczky ,  Steven Mear

发明人： Steven Zuniga ,  Hung Chen ,  Thomas Brezoczky ,  Steven Mear

IPC分类号： B24B29/00

CPC分类号： B24B37/30 ,  B24B49/16

摘要： A system for chemical mechanical polishing having a carrier head with pressurizeable chambers that can be configured into pressure zones is described. The system includes a carrier head with a membrane for contacting a substrate during polishing. Pressurizeable chambers behind the membrane are in communication with pressure inputs. The pressure inputs can each supply a different pressure to the pressurizeable chambers. Some of the pressurizeable chambers can be in communication with more than one pressure input. Zones of pressure can be arranged, where each zone includes one or more pressurizeable chambers. The zones can be configurable by altering the pressurizeable chambers that make up each zone.

摘要翻译： 描述了一种用于化学机械抛光的系统，该系统具有可被构造成压力区的具有可加压室的载体头。 该系统包括具有用于在抛光期间接触基底的膜的载体头部。 膜后面的可加压室与压力输入连通。 压力输入可以为可加压室提供不同的压力。 一些可加压室可以与多于一个的压力输入连通。 可以布置压力区域，其中每个区域包括一个或多个可加压室。 这些区域可以通过改变构成每个区域的可加压室来配置。

公开(公告)号：US20060154580A1

公开(公告)日：2006-07-13

申请号：US11321006

申请日：2005-12-28

申请人： Hung Chen ,  Jeonghoon Oh ,  Steven Zuniga

发明人： Hung Chen ,  Jeonghoon Oh ,  Steven Zuniga

IPC分类号： B24B29/00

CPC分类号： B24B37/30

摘要： A flexible membrane for use with a carrier head of a substrate chemical mechanical polishing apparatus has a central portion with an outer surface providing a substrate receiving surface, a perimeter portion for connecting the central portion to a base of the carrier head, and at least one flap extending from an inner surface of the central portion. The flap includes a laterally extending first section and a vertically extending second section connecting the laterally extending first section to the central portion.

摘要翻译： 用于与基底化学机械抛光装置的载体头一起使用的柔性膜具有中心部分，其外表面提供基底接收表面，周边部分用于将中心部分连接到载体头部的基部，以及至少一个 翼片从中心部分的内表面延伸。 翼片包括横向延伸的第一部分和将横向延伸的第一部分连接到中心部分的垂直延伸的第二部分。

公开(公告)号：US06857931B2

公开(公告)日：2005-02-22

申请号：US10640127

申请日：2003-08-12

申请人： Hung Chih Chen ,  Ming Kuei Tseng ,  Steven Zuniga

发明人： Hung Chih Chen ,  Ming Kuei Tseng ,  Steven Zuniga

IPC分类号： B24B47/22 ,  B24B49/00 ,  B25J15/06 ,  H01L21/304 ,  H01L21/306 ,  B24B51/00

CPC分类号： B24B37/30 ,  B24B47/22 ,  B24B49/00 ,  B25J15/0616 ,  H01L21/30625

摘要： A carrier head has a base, a flexible membrane, and a valve in the carrier head that forms part of a substrate detection system. The valve includes a valve stem that contacts an upper surface of the flexible membrane so that if a substrate is attached to the lower surface of the flexible membrane when the first chamber is evacuated, the valve is actuated to generate a signal to the substrate detection system.

摘要翻译： 载体头具有基底，柔性膜和载体头中的形成基底检测系统的一部分的阀。 所述阀包括与所述柔性膜的上表面接触的阀杆，使得如果在所述第一室被抽真空时将所述基板附接到所述柔性膜的下表面，则所述阀被致动以产生到所述基板检测系统的信号 。

公开(公告)号：US06663466B2

公开(公告)日：2003-12-16

申请号：US09441928

申请日：1999-11-17

申请人： Hung Chih Chen ,  Ming Kuei Tseng ,  Steven Zuniga

发明人： Hung Chih Chen ,  Ming Kuei Tseng ,  Steven Zuniga

IPC分类号： B24B4900

CPC分类号： B24B37/30 ,  B24B47/22 ,  B24B49/00 ,  B25J15/0616 ,  H01L21/30625

摘要： A carrier head has a base, a flexible membrane, and a valve in the carrier head that forms part of a substrate detection system. The valve includes a valve stem that contacts an upper surface of the flexible membrane so that if a substrate is attached to the lower surface of the flexible membrane when the first chamber is evacuated, the valve is actuated to generate a signal to the substrate detection system.

摘要翻译： 载体头具有基底，柔性膜和载体头中的形成基底检测系统的一部分的阀。 所述阀包括与所述柔性膜的上表面接触的阀杆，使得如果在所述第一室被抽真空时将所述基板附接到所述柔性膜的下表面，则所述阀被致动以产生到所述基板检测系统的信号 。