知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

13 records (took 0.025 seconds)

    Modified calcium carbonate-filled adhesive compositions and methods for use thereof
    1.
    发明授权
    Modified calcium carbonate-filled adhesive compositions and methods for use thereof 有权
    改性碳酸钙填充的粘合剂组合物及其使用方法

    公开(公告)号：US08530573B2

    公开(公告)日：2013-09-10

    申请号：US11801412

    申请日：2007-05-09

    Applicant: Stephen Dershem

    Inventor： Stephen Dershem

    IPC: C09J135/04

    CPC classification number: C09J4/00 ,  Y10T428/31721

    Abstract: The invention is based on the discovery that modified calcium carbonates can be used as fillers for the preparation of non-abrasive adhesive formulations that are useful in microelectronic applications. The modified calcium carbonate fillers possess functional groups, which form strong bonds to the thermoset matrix. Invention compositions display excellent rheological properties, in addition to a low coefficient of thermal expansion.

    Abstract translation: 本发明基于以下发现：改性碳酸钙可用作制备用于微电子应用的非研磨性粘合剂制剂的填料。 改性碳酸钙填料具有与热固性基体形成强键的官能团。 本发明组合物除了具有低的热膨胀系数之外还显示优异的流变性能。

    Maleimide compositions and methods for use thereof
    2.
    发明授权
    Maleimide compositions and methods for use thereof 有权
    马来酰亚胺组合物及其使用方法

    公开(公告)号：US08043534B2

    公开(公告)日：2011-10-25

    申请号：US11786441

    申请日：2007-04-12

    Applicant: Stephen Dershem

    Inventor： Stephen Dershem

    IPC: H01B1/20 ,  C09K3/00 ,  C09J4/00 ,  C09J4/02 ,  C09J201/00 ,  B32B27/28 ,  C08L35/06 ,  C08F265/10

    CPC classification number: C07D207/452 ,  C07C2/28 ,  C07C2531/10 ,  C08F290/06 ,  C08F290/14 ,  C09J4/00 ,  Y10T428/31855 ,  C07C15/50

    Abstract: The invention is based on the discovery that compositions containing certain maleimide compounds and aromatic diene compounds are useful as thermosetting resins for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways, with or without a catalyst. In some embodiments, the well-known “ene” reaction can be used to cure the compositions described herein, and therefore no catalyst is required.

    Abstract translation: 本发明基于以下发现：含有某些马来酰亚胺化合物和芳族二烯化合物的组合物可用作电子包装工业的热固性树脂。 本文所述的本发明组合物可以以各种方式固化，具有或不具有催化剂。 在一些实施方案中，公知的“烯”反应可用于固化本文所述的组合物，因此不需要催化剂。

    Olefin oligomers containing pendant maleimide groups
    3.
    发明申请
    Olefin oligomers containing pendant maleimide groups 有权
    含有侧链马来酰亚胺基团的烯属低聚物

    公开(公告)号：US20060142517A1

    公开(公告)日：2006-06-29

    申请号：US11184305

    申请日：2005-07-18

    Applicant: Stephen Dershem

    Inventor： Stephen Dershem

    IPC: C08F136/00

    CPC classification number: H05K3/285 ,  C08F210/00 ,  C08F210/10 ,  C08F212/08 ,  C08F226/02

    Abstract: The invention is based on the discovery that certain crosslinkable functional groups can be incorporated into olefin oligomers, thereby making these functionalized olefin oligomers useful as thermosetting resin compositions. In particular, there are provided olefin oligomers containing pendant maleimide groups. These materials are readily prepared via cationic co-polymerization of cationically polymerizable olefin monomers and maleimide monomers containing a cationically polymerizable functional group.

    Abstract translation: 本发明是基于以下发现：某些可交联的官能团可以并入烯烃低聚物中，从而使这些官能化烯烃低聚物可用作热固性树脂组合物。 特别地，提供了含有侧链马来酰亚胺基团的烯烃低聚物。 这些材料可以通过阳离子聚合的烯烃单体和含有阳离子可聚合官能团的马来酰亚胺单体的阳离子共聚来容易地制备。

    Compositions containing maleimide-substituted silsesquioxanes and methods for use thereof
    5.
    发明申请
    Compositions containing maleimide-substituted silsesquioxanes and methods for use thereof 审中-公开
    含有马来酰亚胺取代倍半硅氧烷的组合物及其使用方法

    公开(公告)号：US20060009578A1

    公开(公告)日：2006-01-12

    申请号：US11176107

    申请日：2005-07-07

    Applicant: Stephen Dershem

    Inventor： Stephen Dershem

    IPC: C08L83/04 ,  C08G77/04 ,  B32B27/00

    CPC classification number: C08G77/388 ,  C09J183/08 ,  G03F7/0755 ,  Y10T428/31663

    Abstract: The present invention is based on the discovery that maleimide-substituted polyhedralsilsesquioxane compounds are useful as components in photosensistive resin compositions. These compounds can be readily prepared from available precursors, and are easily incorporated into resin compositions by appropriate formulating conditions. The incorporation of a variety of polyhedralsilsesquioxane frameworks into a photosensitive resin composition is readily accomplished via the crosslinkable maleimide moiety, which crosslinks under a variety of conditions (e.g., chemically and radiatively). Indeed, the compounds described herein contain at least one maleimide moiety attached to a polyhedralsilsesquioxane framework.

    Abstract translation: 本发明基于马来酰亚胺取代的多面体倍半硅氧烷化合物可用作光敏树脂组合物中的组分的发现。 这些化合物可以容易地由可用的前体制备，并且通过适当的配制条件容易地并入到树脂组合物中。 通过可交联的马来酰亚胺部分容易地实现将多种多面体倍半硅氧烷骨架结合到感光性树脂组合物中，该交联性马来酰亚胺部分在各种条件（例如化学和辐射）下交联。 实际上，本文所述的化合物含有连接到多面体倍半硅氧烷骨架的至少一个马来酰亚胺部分。

    Functionalized urethanes and methods for use thereof
    6.
    发明申请
    Functionalized urethanes and methods for use thereof 审中-公开
    官能化聚氨酯及其使用方法

    公开(公告)号：US20050267254A1

    公开(公告)日：2005-12-01

    申请号：US11120004

    申请日：2005-05-02

    Applicant: Farhad Mizori ,  Stephen Dershem

    Inventor： Farhad Mizori ,  Stephen Dershem

    IPC: C08G18/28 ,  C08G18/67 ,  C08G18/75 ,  C08G18/81 ,  C08K3/00 ,  C09J175/16

    CPC classification number: C08G18/755 ,  C08G18/2845 ,  C08G18/285 ,  C08G18/672 ,  C08G18/8175 ,  C09J175/16

    Abstract: The invention is based on the discovery that certain functionalized urethane compounds are useful as thermosetting resins for the electronic packaging industry. The functionalized urethane compounds described herein can be cured in a variety of ways, depending on the polymerizable moiety present in the urethane compound. In addition, the functionalized urethane compounds described herein exhibit increased thermal stability relative to known urethane compounds. The functionalized urethane compounds are readily prepared by contacting a hydroxyl-bearing compound with an isocyanate, thereby resulting in a functionalized urethane compound. In addition, the methods described herein for preparing invention urethane compounds are environmentally friendly, requiring no solvent or catalyst.

    Abstract translation: 本发明基于以下发现：某些官能化氨基甲酸酯化合物可用作电子包装工业的热固性树脂。 根据存在于氨基甲酸酯化合物中的可聚合部分，可以以各种方式固化本文所述的官能化氨基甲酸酯化合物。 此外，本文所述的官能化氨基甲酸酯化合物相对于已知的氨基甲酸酯化合物显示出增加的热稳定性。 通过使带羟基的化合物与异氰酸酯接触来容易地制备官能化的氨基甲酸酯化合物，从而得到官能化的氨基甲酸酯化合物。 此外，本文描述的用于制备发明的氨基甲酸酯化合物的方法是环境友好的，不需要溶剂或催化剂。

    Modified calcium carbonate-filled adhesive compositions and methods for use thereof
    7.
    发明申请
    Modified calcium carbonate-filled adhesive compositions and methods for use thereof 有权
    改性碳酸钙填充的粘合剂组合物及其使用方法

    公开(公告)号：US20080075963A1

    公开(公告)日：2008-03-27

    申请号：US11801412

    申请日：2007-05-09

    Applicant: Stephen Dershem

    Inventor： Stephen Dershem

    IPC: C09J135/04

    CPC classification number: C09J4/00 ,  Y10T428/31721

    Abstract: The invention is based on the discovery that modified calcium carbonates can be used as fillers for the preparation of non-abrasive adhesive formulations that are useful in microelectronic applications. The modified calcium carbonate fillers possess functional groups, which form strong bonds to the thermoset matrix. Invention compositions display excellent rheological properties, in addition to a low coefficient of thermal expansion.

    Abstract translation: 本发明基于以下发现：改性碳酸钙可用作制备用于微电子应用的非研磨性粘合剂制剂的填料。 改性碳酸钙填料具有与热固性基体形成强键的官能团。 本发明组合物除了具有低的热膨胀系数之外还显示优异的流变性能。

    Maleimide compositions and methods for use thereof
    9.
    发明申请
    Maleimide compositions and methods for use thereof 有权
    马来酰亚胺组合物及其使用方法

    公开(公告)号：US20080075965A1

    公开(公告)日：2008-03-27

    申请号：US11786441

    申请日：2007-04-12

    Applicant: Stephen Dershem

    Inventor： Stephen Dershem

    IPC: C08F22/40 ,  B32B27/34 ,  C09J139/04 ,  C07D403/08

    CPC classification number: C07D207/452 ,  C07C2/28 ,  C07C2531/10 ,  C08F290/06 ,  C08F290/14 ,  C09J4/00 ,  Y10T428/31855 ,  C07C15/50

    Abstract: The invention is based on the discovery that compositions containing certain maleimide compounds and aromatic diene compounds are useful as thermosetting resins for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways, with or without a catalyst. In some embodiments, the well-known “ene” reaction can be used to cure the compositions described herein, and therefore no catalyst is required.

    Abstract translation: 本发明基于以下发现：含有某些马来酰亚胺化合物和芳族二烯化合物的组合物可用作电子包装工业的热固性树脂。 本文所述的本发明组合物可以以各种方式固化，具有或不具有催化剂。 在一些实施方案中，公知的“烯”反应可用于固化本文所述的组合物，因此不需要催化剂。

Patent Agency Ranking