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    Substrate structure
    1.
    发明授权
    Substrate structure 有权

    公开(公告)号：US10199341B2

    公开(公告)日：2019-02-05

    申请号：US15224767

    申请日：2016-08-01

    Applicant: Siliconware Precision Industries Co., Ltd.

    Inventor： Fang-Yu Liang ,  Hung-Hsien Chang ,  Yi-Che Lai ,  Wen-Tsung Tseng ,  Chen-Yu Huang

    IPC: H01L23/00

    Abstract: Provided is a substrate structure, including: a substrate body having a conductive contact; an insulating layer formed on the substrate body with the conductive contact exposed therefrom; and an insulating protection layer formed on a portion of a surface of the insulating layer, and having a plurality of openings corresponding to the conductive contact, wherein at least one of the openings is disposed at an outer periphery of the conductive contact. Accordingly, the insulating protection layer uses the openings to dissipate and disperse residual stresses in a manufacturing process of high operating temperatures.

    ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
    3.
    发明申请
    ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF 审中-公开
    电子封装及其制造方法

    公开(公告)号：US20170053859A1

    公开(公告)日：2017-02-23

    申请号：US14982099

    申请日：2015-12-29

    Applicant: Siliconware Precision Industries Co., Ltd.

    Inventor： Fang-Yu Liang ,  Hung-Hsien Chang ,  Yi-Che Lai

    IPC: H01L23/498 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31 ,  H01L23/053

    CPC classification number: H01L21/78 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2221/68331 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/18161

    Abstract: A method for fabricating an electronic package is provided, including the steps of: providing an interposer having a plurality of conductive vias and at least an opening formed at a periphery of the conductive vias; disposing at least an electronic element on the interposer; and bonding a cover plate to the electronic element and forming an encapsulant between the cover plate and the interposer so as to encapsulate the electronic element and fill the opening, thus allowing the encapsulant in the opening to come into contact with air. As such, during a subsequent high temperature process, evaporated solvents can flow out of the encapsulant through the opening without forming bubbles in the encapsulant, thereby preventing a bubble explosion from occurring. The invention further provides an electronic package.

    Abstract translation: 提供一种制造电子封装的方法，包括以下步骤：提供具有多个导电通孔和形成在导电通孔周边的至少一个开口的插入件; 将至少一个电子元件设置在所述插入器上; 并将盖板接合到电子元件上，并在盖板和插入件之间形成密封剂，以封装电子元件并填充开口，从而允许开口中的密封剂与空气接触。 因此，在随后的高温过程中，蒸发的溶剂可以通过开口流出密封剂，而不会在密封剂中形成气泡，从而防止发生气泡爆炸。 本发明还提供一种电子封装。

    Substrate structure
    4.
    发明授权
    Substrate structure 有权

    公开(公告)号：US10049975B2

    公开(公告)日：2018-08-14

    申请号：US15258303

    申请日：2016-09-07

    Applicant: Siliconware Precision Industries Co., Ltd.

    Inventor： Fang-Yu Liang ,  Hung-Hsien Chang ,  Yi-Che Lai ,  Wen-Tsung Tseng ,  Chen-Yu Huang

    IPC: H05K7/10 ,  H05K7/12 ,  H01L23/498 ,  H01L23/00

    Abstract: A substrate structure is provided, including a substrate body having a conductive pad, an insulation layer formed on the substrate body and exposing the conductive pad, a conductive pillar disposed on the conductive pad, and a metal pad disposed on the insulation layer and electrically connected to the conductive pillar. A conductive component can be coupled to the metal pad. During a high-temperature process, the conductive pillar and the metal pad disperse the remaining stress generated due to heat, thereby preventing the conductive component from being cracked.

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