公开(公告)号：US10199341B2

公开(公告)日：2019-02-05

申请号：US15224767

申请日：2016-08-01

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Fang-Yu Liang ,  Hung-Hsien Chang ,  Yi-Che Lai ,  Wen-Tsung Tseng ,  Chen-Yu Huang

IPC: H01L23/00

Abstract: Provided is a substrate structure, including: a substrate body having a conductive contact; an insulating layer formed on the substrate body with the conductive contact exposed therefrom; and an insulating protection layer formed on a portion of a surface of the insulating layer, and having a plurality of openings corresponding to the conductive contact, wherein at least one of the openings is disposed at an outer periphery of the conductive contact. Accordingly, the insulating protection layer uses the openings to dissipate and disperse residual stresses in a manufacturing process of high operating temperatures.

公开(公告)号：US20170317040A1

公开(公告)日：2017-11-02

申请号：US15224767

申请日：2016-08-01

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Fang-Yu Liang ,  Hung-Hsien Chang ,  Yi-Che Lai ,  Wen-Tsung Tseng ,  Chen-Yu Huang

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L23/293 ,  H01L23/3157 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/13 ,  H01L2224/02126 ,  H01L2224/02145 ,  H01L2224/0215 ,  H01L2224/02205 ,  H01L2224/0221 ,  H01L2224/02373 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05557 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13022 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2224/81192 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/06 ,  H01L2924/014

Abstract: Provided is a substrate structure, including: a substrate body having a conductive contact; an insulating layer formed on the substrate body with the conductive contact exposed therefrom; and an insulating protection layer formed on a portion of a surface of the insulating layer, and having a plurality of openings corresponding to the conductive contact, wherein at least one of the openings is disposed at an outer periphery of the conductive contact. Accordingly, the insulating protection layer uses the openings to dissipate and disperse residual stresses in a manufacturing process of high operating temperatures.

公开(公告)号：US11289346B2

公开(公告)日：2022-03-29

申请号：US16919433

申请日：2020-07-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chen-Yu Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kong-Toon Ng ,  Rui-Feng Tai ,  Bo-Hao Ma

IPC: H01L21/44 ,  H01L21/56 ,  H01L23/31 ,  H01L23/522 ,  H01L25/065 ,  H01L23/00 ,  H01L25/16 ,  H01L23/48 ,  H01L23/538 ,  H01L21/48 ,  H01L21/683 ,  H01L21/3105

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

公开(公告)号：US20200335447A1

公开(公告)日：2020-10-22

申请号：US16919433

申请日：2020-07-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chen-Yu Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kong-Toon Ng ,  Rui-Feng Tai ,  Bo-Hao Ma

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/522 ,  H01L25/065 ,  H01L23/00 ,  H01L25/16 ,  H01L23/48

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

公开(公告)号：US10049975B2

公开(公告)日：2018-08-14

申请号：US15258303

申请日：2016-09-07

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Fang-Yu Liang ,  Hung-Hsien Chang ,  Yi-Che Lai ,  Wen-Tsung Tseng ,  Chen-Yu Huang

IPC: H05K7/10 ,  H05K7/12 ,  H01L23/498 ,  H01L23/00

Abstract: A substrate structure is provided, including a substrate body having a conductive pad, an insulation layer formed on the substrate body and exposing the conductive pad, a conductive pillar disposed on the conductive pad, and a metal pad disposed on the insulation layer and electrically connected to the conductive pillar. A conductive component can be coupled to the metal pad. During a high-temperature process, the conductive pillar and the metal pad disperse the remaining stress generated due to heat, thereby preventing the conductive component from being cracked.

公开(公告)号：US10741500B2

公开(公告)日：2020-08-11

申请号：US15971534

申请日：2018-05-04

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chen-Yu Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kong-Toon Ng ,  Rui-Feng Tai ,  Bo-Hao Ma

IPC: H01L23/48 ,  H01L23/538 ,  H01L23/31 ,  H01L23/522 ,  H01L25/065 ,  H01L23/00 ,  H01L25/16

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

公开(公告)号：US20190237374A1

公开(公告)日：2019-08-01

申请号：US15971534

申请日：2018-05-04

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chen-Yu Huang ,  Chee-Key Chung ,  Chang-Fu Lin ,  Kong-Toon Ng ,  Rui-Feng Tai ,  Bo-Hao Ma

IPC: H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01L25/065

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

公开(公告)号：US20170229386A1

公开(公告)日：2017-08-10

申请号：US15258303

申请日：2016-09-07

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Fang-Yu Liang ,  Hung-Hsien Chang ,  Yi-Che Lai ,  Wen-Tsung Tseng ,  Chen-Yu Huang

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49827 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/562 ,  H01L2224/73204 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A substrate structure is provided, including a substrate body having a conductive pad, an insulation layer formed on the substrate body and exposing the conductive pad, a conductive pillar disposed on the conductive pad, and a metal pad disposed on the insulation layer and electrically connected to the conductive pillar. A conductive component can be coupled to the metal pad. During a high-temperature process, the conductive pillar and the metal pad disperse the remaining stress generated due to heat, thereby preventing the conductive component from being cracked.