公开(公告)号：US20060202622A1

公开(公告)日：2006-09-14

申请号：US11194680

申请日：2005-08-02

Applicant: Sheng-Chieh Lung ,  Chien-Wei Chang ,  Hung-Ming Yang

Inventor： Sheng-Chieh Lung ,  Chien-Wei Chang ,  Hung-Ming Yang

IPC: H01J61/36 ,  H01J63/04

CPC classification number: F21V19/0085 ,  F21V19/04 ,  H01R33/09

Abstract: A lamp clamping and electrically connecting device includes a base, two flexible portions and two protrusions. The flexible portions are interspaced to be disposed on the base. The protrusions are correspondingly disposed on the inner sides of the flexible portions. In a natural state, the gap between the protrusions is smaller than the diameter of an electrode end of a lamp. When the electrode end is moved towards the base in the gap between the protrusions, the electrode end presses the protrusions so that the flexible portions swing outwardly. When the electrode end touches the base, the protrusions are restored to the natural state, so that the protrusions and the base clamp the electrode end, and that the electrode end is electrically connected to the device.

公开(公告)号：US07525242B2

公开(公告)日：2009-04-28

申请号：US11194680

申请日：2005-08-02

Applicant: Sheng-Chieh Lung ,  Chien-Wei Chang ,  Hung-Ming Yang

Inventor： Sheng-Chieh Lung ,  Chien-Wei Chang ,  Hung-Ming Yang

IPC: H01J17/18

CPC classification number: F21V19/0085 ,  F21V19/04 ,  H01R33/09

Abstract: A lamp clamping and electrically connecting device includes a base, two flexible portions and two protrusions. The flexible portions are interspaced to be disposed on the base. The protrusions are correspondingly disposed on the inner sides of the flexible portions. In a natural state, the gap between the protrusions is smaller than the diameter of an electrode end of a lamp. When the electrode end is moved towards the base in the gap between the protrusions, the electrode end presses the protrusions so that the flexible portions swing outwardly. When the electrode end touches the base, the protrusions are restored to the natural state, so that the protrusions and the base clamp the electrode end, and that the electrode end is electrically connected to the device.

Abstract translation: 灯夹持和电连接装置包括基座，两个柔性部分和两个突起。 柔性部分间隔设置在基座上。 这些突起相应地设置在柔性部分的内侧上。 在自然状态下，突起之间的间隙小于灯的电极端的直径。 当电极端部在突起之间的间隙中朝向底座移动时，电极端部按压突起，使得柔性部分向外摆动。 当电极端接触基部时，突起恢复到自然状态，使得突起和基部夹持电极端，并且电极端电连接到装置。

公开(公告)号：US20060215421A1

公开(公告)日：2006-09-28

申请号：US11208769

申请日：2005-08-22

Applicant: Chien-Wei Chang ,  Sheng-Chieh Lung ,  Hung-Ming Yang

Inventor： Chien-Wei Chang ,  Sheng-Chieh Lung ,  Hung-Ming Yang

IPC: F21V7/04

CPC classification number: G02F1/133604 ,  G02F2001/133612 ,  G02F2203/68

Abstract: A direct type backlight module comprises a front panel, a back cover and at least one light source. The back cover comprises an inner surface and an outer surface. The at least one light source is disposed on the inner surface of the back cover and comprises a power line for connecting to the at least one light source and the front panel. The direct type backlight provides a mechanism allowing the direct backlight module to be opened from rear. The direct type backlight prevents interfere between the power line and the front panel via the design of the mechanism. The display apparatus includes the direct type backlight module.

Abstract translation: 直接型背光模块包括前面板，后盖和至少一个光源。 后盖包括内表面和外表面。 所述至少一个光源设置在所述后盖的内表面上，并且包括用于连接至所述至少一个光源和所述前面板的电源线。 直接型背光源提供了一种允许直接背光模块从后方打开的机构。 直接型背光通过机构的设计防止电源线和前面板之间的干扰。 显示装置包括直接型背光模块。

公开(公告)号：USRE45298E1

公开(公告)日：2014-12-23

申请号：US13986414

申请日：2013-04-30

Applicant: Chien-Wei Chang ,  Chen-Ping Yang

Inventor： Chien-Wei Chang ,  Chen-Ping Yang

IPC: G09G5/08 ,  G06F3/033

CPC classification number: G06F3/017 ,  G06F3/011

Abstract: A multimedia playing device includes a central processing unit, a plurality of sensors electrically coupled to the central processing unit, and an output unit electrically coupled to the central processing unit. The plurality of sensors are operated together with the central processing unit, such that after the sensors detect different hand movements of a user, the central processing unit reads and determines the hand movement and transmits related control signals to the output unit according to different hand movements to achieve the effects of using a hand posture to control related functional movements and enhancing the convenience of using the multimedia playing device.

Abstract translation: 多媒体播放设备包括中央处理单元，电耦合到中央处理单元的多个传感器，以及电耦合到中央处理单元的输出单元。 多个传感器与中央处理单元一起操作，使得在传感器检测到用户的不同的手部移动之后，中央处理单元根据不同的手部移动读取并确定手的移动并将相关的控制信号发送到输出单元 以实现使用手势来控制相关的功能运动和增强使用多媒体播放装置的便利性的效果。

公开(公告)号：US20100170088A1

公开(公告)日：2010-07-08

申请号：US12725460

申请日：2010-03-17

Applicant: Chien-Wei Chang ,  Ting-Hao Lin ,  Jen-Fang Chang ,  Yu-Te Lu ,  Chia-Chi Lo

Inventor： Chien-Wei Chang ,  Ting-Hao Lin ,  Jen-Fang Chang ,  Yu-Te Lu ,  Chia-Chi Lo

IPC: H05K3/10

CPC classification number: H05K3/4602 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165

Abstract: Structure and method of making a board having plating though hole (PTH) core layer substrate and stacked multiple layers of blind vias. More stacking layers of blind vias than conventional methods can be achieved. The fabrication method of the board having high-density core layer includes the following: after the making of the PTH, the filling material filled inside the PTH of the core layer is partially removed until the PTH has reached an appropriate flattened depression using etching; then image transfer and pattern plating are performed to fill and to level the depression portion up to a desired thickness to form a copper pad (overplating) as the core layer substrate is forming a circuit layer; finally using electroless copper deposition and the pattern plating to make the product.

Abstract translation: 制造具有电镀通孔（PTH）芯层衬底和层叠多层盲孔的板的结构和方法。 可以实现比常规方法更多的盲孔堆叠层。 具有高密度芯层的板的制造方法包括以下：在制造PTH之后，填充在芯层的PTH内部的填充材料被部分地去除，直到PTH已经通过蚀刻达到适当的平坦凹陷; 然后进行图像转印和图案电镀，以在芯层基板正在形成电路层时填充并使凹陷部分达到所需厚度以形成铜焊盘（过镀层）; 最后使用无电镀铜和图案电镀制成产品。

公开(公告)号：US20090308527A1

公开(公告)日：2009-12-17

申请号：US12137553

申请日：2008-06-12

Applicant: Chien-Wei Chang ,  Ting-Hao Lin ,  Bo-Yu Tseng

Inventor： Chien-Wei Chang ,  Ting-Hao Lin ,  Bo-Yu Tseng

IPC: B32B38/10

CPC classification number: H05K3/427 ,  B32B37/025 ,  B32B38/10 ,  B32B2038/0016 ,  B32B2305/076 ,  B32B2311/00 ,  B32B2457/08 ,  C22C1/002 ,  H05K3/025 ,  H05K3/108 ,  H05K3/382 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2203/0361 ,  H05K2203/0384

Abstract: A method for fabricating a circuit trace on a core board having a buried hole is provided. The method includes: providing a carrier plate having a detachable metal layer, an etching barrier layer, and a metal layer sequentially stacked thereon; roughening the metal layer which can be completely roughened; laminating the bonded metal layer, the etching barrier layer, the detachable metal layer and the carrier plate onto a dielectric, wherein the metal layer faces and contacts with the dielectric; and then removing the carrier plate therefrom. As such, even if the dielectric is difficult to be completely roughened, the roughened metal layer can enhance the bondability between the metal layer and the dielectric. The metal layer is processed to become the circuit trace later.

Abstract translation: 提供了一种用于在具有掩埋孔的芯板上制造电路迹线的方法。 该方法包括：提供具有可分离的金属层，蚀刻阻挡层和顺序堆叠在其上的金属层的载体板; 使可以完全粗糙化的金属层变粗糙; 将接合的金属层，蚀刻阻挡层，可拆卸金属层和载体板层压到电介质上，其中金属层面对并与电介质接触; 然后从其移除载体板。 因此，即使电介质难以完全粗糙化，粗糙化的金属层也可以提高金属层与电介质的结合性。 金属层后处理成电路迹线。

公开(公告)号：US20090283809A1

公开(公告)日：2009-11-19

申请号：US12153350

申请日：2008-05-16

Applicant: Chung-Hsien Hsin ,  Chun-Hua Chuang ,  Chen-pin Peng ,  Chien-Wei Chang ,  Chien-Hen Lin

Inventor： Chung-Hsien Hsin ,  Chun-Hua Chuang ,  Chen-pin Peng ,  Chien-Wei Chang ,  Chien-Hen Lin

IPC: H01L31/113

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14683 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An image sensor structure and an integrated lens module thereof are provided. In the image sensor structure with the integrated lens module, the image sensor structure comprises a chip and a lens module. The chip has light-sensing elements, first conducting pads, and a conducting channel. The light-sensing elements are electrically connected to the first conducting pads and the first conducting pads are electrically connected to one end of the conducting channel passing through the chip. The lens module comprises a holder and at least one lens. The holder has a through hole and the lens is embedded in the through hole and integrated with the holder. By using the integrated lens and holder, a manufacturing process of the image sensor structure is simplified and a manufacturing cost of the image sensor structure is reduced.

Abstract translation: 提供了一种图像传感器结构及其集成透镜模块。 在具有集成透镜模块的图像传感器结构中，图像传感器结构包括芯片和透镜模块。 该芯片具有光敏元件，第一导电焊盘和导电沟道。 光敏元件电连接到第一导电焊盘，并且第一导电焊盘电连接到穿过芯片的导电沟道的一端。 透镜模块包括保持器和至少一个透镜。 支架具有通孔，透镜嵌入通孔并与支架一体化。 通过使用集成的透镜和支架，简化了图像传感器结构的制造过程，降低了图像传感器结构的制造成本。

公开(公告)号：US20050032273A1

公开(公告)日：2005-02-10

申请号：US10932874

申请日：2004-09-01

Applicant: Chien-Wei Chang ,  Sheng-Chuan Huang

Inventor： Chien-Wei Chang ,  Sheng-Chuan Huang

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H05K3/34 ,  H05K3/38 ,  H05K3/46 ,  H01L21/50 ,  H01L21/28 ,  H01L21/44

CPC classification number: H05K3/3452 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/18301 ,  H05K3/385 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2201/2081 ,  H05K2203/0315 ,  H01L2924/00

Abstract: The present invention relates to a Fine Pitch flip chip substrate. A black oxide dam is made on the metal circuit between bump pads to replace the conventional solder resist so that the bump pads will not be buried in the solder resist. A small vias is dilled by laser drilling and plated filled with copper to be used as the connection between the circuits. By this way, the density and the flexibility of routing could be improved. A mesh pattern can be made in the limited space to increase the stiffness of the substrate.

Abstract translation: 本发明涉及一种精细间距倒装芯片。 在凸块焊盘之间的金属电路上形成黑色氧化物隔离层以代替常规的阻焊剂，使得凸块焊盘不会被埋在阻焊剂中。 一个小孔通过激光钻孔和电镀填充铜作为电路之间的连接。 通过这种方式，可以提高路由密度和灵活性。 可以在有限的空间中制造网格图案以增加基底的刚度。

公开(公告)号：US06759318B1

公开(公告)日：2004-07-06

申请号：US10414597

申请日：2003-04-15

Applicant: Chien-Wei Chang

Inventor： Chien-Wei Chang

IPC: H01L2144

CPC classification number: H05K3/243 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/0035 ,  H05K3/3473 ,  H05K3/385 ,  H05K3/427 ,  H05K3/4652 ,  H05K2201/09436 ,  H05K2201/09481 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/09918 ,  H05K2203/0315 ,  H01L2924/00

Abstract: A method for a manufacturing process of micro bump pitch IC substrates uses a dielectric layer to replace the conventional solder resist, then uses CCD high precision alignment laser drill to open up the defined bump pad lands, and fills them with via plating filled metal accompanied by etching to enlarge the bump pads, and finally plates the bum pads with Sn/Pb. This can simultaneously solve the problems of insufficient strength of bump pads, limitation of printing technology and being unable to apply the solder in the conventional technologies. The method can provide a higher packaging density, higher yield rate, and provides a total solution to the next generation high density IC design.

Abstract translation: 微凸块间距IC基板的制造工序的方法使用电介质层来代替常规的阻焊剂，然后使用CCD高精度定位激光钻孔机来打开定义的凸块焊盘区域，并通过电镀填充金属填充它们，伴随着 蚀刻以扩大凸块，最后用Sn / Pb涂覆凸块。 这可以同时解决凸起焊盘强度不足，印刷技术的局限性和传统技术中不能应用焊料的问题。 该方法可以提供更高的封装密度，更高的产率，并为下一代高密度IC设计提供全面的解决方案。

公开(公告)号：US08460934B2

公开(公告)日：2013-06-11

申请号：US13438436

申请日：2012-04-03

Applicant: Chien-Wei Chang ,  Lori Hennessy ,  Dennis Wang

Inventor： Chien-Wei Chang ,  Lori Hennessy ,  Dennis Wang

IPC: C07H21/04

CPC classification number: C12Q1/6888 ,  C12Q1/68 ,  C12Q1/6806 ,  C12Q1/686 ,  C12Q2527/125

Abstract: The present teachings relate to improved methods, kits, and reaction mixtures for amplifying nucleic acids. In some embodiments a novel direct buffer formulation is provided which allows for the direct amplification of the nucleic acids in a crude sample with minimal sample purification.