公开(公告)号：US4537244A

公开(公告)日：1985-08-27

申请号：US585743

申请日：1984-03-02

Applicant: Scott C. Holden

Inventor： Scott C. Holden

IPC: H01J37/20 ,  H01J37/317 ,  H01L21/673 ,  F28F9/00

CPC classification number: H01L21/68721 ,  H01J37/20 ,  H01J37/317

Abstract: Conductive heat transfer between a thin deformable workpiece and heat sink is optimized by imposing a load over the workpiece resulting in a uniform contact pressure distribution in said workpiece which is also the maximum stress consistent with the elastic properties of the workpiece. The surface of the heat sink is given a contour determined by these criteria for a thin circular disk clamped thereto.

Abstract translation: 在薄的可变形工件和散热器之间的导电传热通过在工件上施加负载而得到优化，导致所述工件中的均匀的接触压力分布，其也是与工件的弹性性质一致的最大应力。 散热器的表面被给予由这些标准确定的轮廓，用于夹紧在其上的薄圆盘。

公开(公告)号：US4504194A

公开(公告)日：1985-03-12

申请号：US381289

申请日：1982-05-24

Applicant: Scott C. Holden

Inventor： Scott C. Holden

IPC: B25B11/00 ,  C23C14/00 ,  C23C14/22 ,  C23C14/24 ,  C23C14/48 ,  C23C14/56 ,  H01J37/18 ,  H01L21/265 ,  H01L21/677 ,  F04B37/14

CPC classification number: C23C14/566 ,  H01J37/18 ,  Y10T137/86187

Abstract: Method and apparatus for high speed vacuum pumping of an air lock. A vacuum pumped expansion tank having a volume larger than the volume of the air lock is coupled through a valve to the air lock. When evacuation of the air lock is desired, the valve is opened for a brief duration and the gas in the air lock rapidly expands into the expansion tank. Multiple pumping stages, each including a vacuum pumped expansion tank coupled through a valve to the air lock, can be utilized to decrease the final pressure in the air lock. The valves are sequentially opened to permit sequential expansion of the gas in the air lock into the expansion tanks. Multiple air locks can time share the same pumping system.

Abstract translation: 用于高速真空泵送气锁的方法和装置。 具有比空气锁的体积大的体积的真空泵送膨胀箱通过阀与气锁联接。 当需要抽空气锁时，阀打开一段持续时间，气锁中的气体迅速膨胀到膨胀箱中。 可以利用多个泵送级，每个泵级包括通过阀连接到气锁的真空泵送膨胀罐，以减小气锁中的最终压力。 顺序地打开阀，以允许将气锁中的气体顺序膨胀到膨胀罐中。 多个气闸可以共享同一个泵系统。

公开(公告)号：US4458746A

公开(公告)日：1984-07-10

申请号：US381670

申请日：1982-05-25

Applicant: Scott C. Holden ,  Peter R. Hanley

Inventor： Scott C. Holden ,  Peter R. Hanley

IPC: C23C14/50 ,  H01J37/317 ,  H01L21/203 ,  H01L21/265 ,  H01L21/302 ,  H01L21/31 ,  H01L21/673 ,  H01L21/683 ,  H01L21/687 ,  F28F9/00

CPC classification number: H01L21/68721 ,  H01J37/317 ,  H01L21/68735

Abstract: For enhanced heat conductive transfer from a semiconductor wafer during ion implantation, the wafer is clamped to a platen having a contour f(r,.theta.) computed to establish uniform contact pressure over said wafer for a number, n, of discrete clamping locii distributed along the periphery of the wafer. The available area of the wafer is thus maximized.

Abstract translation: 为了在离子注入期间从半导体晶片进行增强的导热转移，将晶片夹紧到具有计算的轮廓f（r，θ）的压板上，以在所述晶片上建立分布在一起的多个离散夹紧轨迹的数量的n个均匀的接触压力 晶圆的周边。 因此，晶片的可用面积最大化。

公开(公告)号：US5436790A

公开(公告)日：1995-07-25

申请号：US005030

申请日：1993-01-15

Applicant: Julian G. Blake ,  Weilin Tu ,  Dale K. Stone ,  Scott C. Holden

Inventor： Julian G. Blake ,  Weilin Tu ,  Dale K. Stone ,  Scott C. Holden

IPC: B23Q3/15 ,  G01R27/26 ,  H01L21/265 ,  H01L21/683 ,  H02N13/00

CPC classification number: H01L21/67259 ,  H01L21/6831

Abstract: A wafer position and clamp sensor. A circuit monitors capacitance between two electrodes within a wafer support. With no wafer on the support, the capacitance falls in one range, with the wafer in place but not clamped, the capacitance falls in a second range and with the wafer held in place by an electrostatic attraction the capacitance falls in a third range. The sensed capacitance is converted to a frequency and then a DC voltage level that can easily be sensed and used to confirm wafer placement and then confirm wafer clamping.

Abstract translation: 晶圆位置和钳位传感器。 电路监测晶片支架内的两个电极之间的电容。 在支撑体上没有晶片的情况下，电容落在一个范围内，晶片就位，但没有被夹紧，电容下降到第二范围，并且晶片通过静电吸引保持在适当的位置，电容落在第三范围内。 感测到的电容被转换成一个频率，然后转换成一个直流电压电平，可以很容易地被感测并用于确认晶片放置，然后确认晶片钳位。

公开(公告)号：US20080042078A1

公开(公告)日：2008-02-21

申请号：US11778335

申请日：2007-07-16

Applicant: Jonathan Gerald ENGLAND ,  Richard Stephen Muka ,  Scott C. Holden

Inventor： Jonathan Gerald ENGLAND ,  Richard Stephen Muka ,  Scott C. Holden

IPC: H01J37/08

CPC classification number: H01J37/20 ,  H01J2237/2001 ,  H01J2237/2065 ,  H01J2237/31701 ,  H01J2237/336 ,  H01L21/67109 ,  H01L21/67213

Abstract: Techniques for temperature-controlled ion implantation are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus for high-temperature ion implantation. The apparatus may comprise a platen to hold a wafer in a single-wafer process chamber during ion implantation, the platen having a wafer interface to provide a predetermined thermal contact between the wafer and the platen. The apparatus may also comprise an array of heating elements to heat the wafer while the wafer is held on the platen to achieve a predetermined temperature profile on the wafer during ion implantation, the heating elements being external to the platen. The apparatus may further comprise a post-implant cooling station to cool down the wafer after ion implantation of the wafer.

Abstract translation: 公开了用于温度控制离子注入的技术。 在一个特定的示例性实施例中，这些技术可以被实现为用于高温离子注入的装置。 该装置可以包括在离子注入期间将晶片保持在单晶片处理室中的压板，压板具有晶片界面以在晶片和压板之间提供预定的热接触。 该装置还可以包括加热元件的阵列，以将晶片保持在压板上，以在离子注入期间在晶片上实现预定的温度分布，加热元件在压板外部。 该装置还可以包括植入物后冷却台，以在晶片的离子注入之后冷却晶片。

公开(公告)号：US5911896A

公开(公告)日：1999-06-15

申请号：US882367

申请日：1997-06-25

Applicant: Scott C. Holden ,  Mehran Asdigha ,  Lawrence R. Moschini ,  Darius Dilmaghani ,  Mario Valenza

Inventor： Scott C. Holden ,  Mehran Asdigha ,  Lawrence R. Moschini ,  Darius Dilmaghani ,  Mario Valenza

IPC: H05B3/86 ,  F27D11/02 ,  H01L21/00 ,  H05B3/00 ,  H05B3/10 ,  H05B3/12 ,  H05B3/68 ,  C23C16/00 ,  H05B3/16 ,  H05B3/26

CPC classification number: H01L21/67115 ,  H01L21/67109 ,  H05B3/00 ,  H05B3/12 ,  H05B2203/003 ,  H05B2203/013 ,  H05B2203/017

Abstract: A substrate heating apparatus having a housing forming a substrate receiving chamber and a heater located inside the chamber. The heater has a thin film flat ribbon heater element sandwiched between two glass-ceramic panels.

Abstract translation: 一种基板加热装置，其具有形成基板容纳室的壳体和位于所述室内的加热器。 加热器具有夹在两块玻璃陶瓷板之间的薄膜扁平带状加热器元件。

公开(公告)号：US4542298A

公开(公告)日：1985-09-17

申请号：US502812

申请日：1983-06-09

Applicant: Scott C. Holden

Inventor： Scott C. Holden

IPC: H01J37/18 ,  H01L21/683 ,  G01N21/00

CPC classification number: H01J37/18 ,  H01L21/6838

Abstract: Methods and apparatus for differential pumping of a thermal transfer gas used to transfer thermal energy between a semiconductor wafer and a platen during processing in a vacuum chamber. Housing structure defines an intermediate region adjacent to and surrounding the platen. The gas, which is introduced into a thermal transfer region behind the wafer, is restricted from flowing into the intermediate region by intimate contact between the wafer and the platen. A clamping ring, which clamps the wafer to the platen, and a bellows coupled between the clamping ring and the housing restrict flow of gas from the intermediate region to the vacuum chamber. The intermediate region is vacuum pumped to a pressure lower than the pressure in the thermal transfer region whereby leakage of the gas into the vacuum chamber is reduced.

Abstract translation: 用于在真空室中处理期间用于在半导体晶片和压板之间传递热能的热传递气体的差分泵浦的方法和装置。 壳体结构限定了邻近并围绕压板的中间区域。 通过晶片和压板之间的紧密接触，被引入到晶片后面的热传递区域中的气体被限制流入中间区域。 将晶片夹紧到压板的夹紧环和耦合在夹紧环和壳体之间的波纹管限制气体从中间区域流到真空室。 中间区域被真空泵送到低于热传递区域中的压力的​​压力，从而减少了进入真空室的气体泄漏。

公开(公告)号：US4475045A

公开(公告)日：1984-10-02

申请号：US520765

申请日：1983-08-08

Applicant: Scott C. Holden ,  Norman L. Turner

Inventor： Scott C. Holden ,  Norman L. Turner

IPC: H01J37/18 ,  H01J37/317 ,  H01J5/02 ,  H01J7/16 ,  H01J7/26

CPC classification number: H01J37/3171 ,  H01J37/18

Abstract: Articles for irradiation are introduced from atmospheric pressure through a vacuum lock to a high vacuum environment for processing. The maintenance of low operating pressures while water vapor is released from the surfaces of the lock and the article is principally achieved by a separate pumping device operating in the high vacuum enclosure, which device preferably takes the form of a large cryo-panel. The cryo-panel can be electrically isolated from ground to provide a charge collection surface within a Faraday cage for ion implantation processing of the article.

Abstract translation: 用于照射的制品通过真空锁从大气压引入高真空环境进行处理。 当水蒸汽从锁和制品的表面释放时，维持低操作压力主要通过在高真空外壳中操作的单独的泵送装置实现，该装置优选地采用大型冷冻面板的形式。 冷冻面板可以与地面电隔离，以在法拉第笼内提供电荷收集表面，用于制品的离子注入处理。

公开(公告)号：US20090303306A1

公开(公告)日：2009-12-10

申请号：US12132939

申请日：2008-06-04

Applicant: Roger B. Fish ,  Samuel M. Barsky ,  Scott C. Holden ,  Arthur P. Riaf ,  Steven M. Anella

Inventor： Roger B. Fish ,  Samuel M. Barsky ,  Scott C. Holden ,  Arthur P. Riaf ,  Steven M. Anella

IPC: B41J2/315

CPC classification number: H01L21/26513 ,  H01J37/20 ,  H01J37/3171 ,  H01J2237/2001 ,  H01L21/26593

Abstract: Techniques for changing temperature of a platen are disclosed. In one particular exemplary embodiment, the techniques may be realized as an apparatus for changing temperature of a platen comprising a platen and one or more movable thermal pads comprising one or more thermal fluid channels to carry a thermal fluid configured to affect a temperature of the platen.

Abstract translation: 公开了改变压板温度的技术。 在一个特定的示例性实施例中，技术可以被实现为用于改变包括压板的压板和包括一个或多个热流体通道的一个或多个可移动热垫的温度的装置，以承载构造成影响压板温度的热流体 。

公开(公告)号：US20090196717A1

公开(公告)日：2009-08-06

申请号：US12361582

申请日：2009-01-29

Applicant: Scott C. Holden

Inventor： Scott C. Holden

IPC: H01L21/677 ,  B25J9/16 ,  B25J13/00 ,  B25J19/02

CPC classification number: H01L21/67259 ,  H01J37/20 ,  H01J37/3171 ,  H01J37/32743 ,  H01J2237/20207 ,  H01J2237/20292 ,  H01J2237/204 ,  H01J2237/24528 ,  H01J2237/2482 ,  H01L21/68742

Abstract: An apparatus and method of handling substrates is disclosed. A detecting system, capable of determining whether a substrate is tilted in relation to the platen, is positioned proximate to the substrate. In some embodiments, the detecting system is a distance measuring system. In other embodiments, it is an angle sensor. The detecting system is in communication with a controller, which, in turn, is in communication with a substrate handling robot. If, based on information received from the detecting system, the controller determines that the substrate is tilted beyond an acceptable range, it is assumed that the substrate has remained attached to the platen. In such a case, the substrate handling robot does not attempt to remove it from the platen. In this way, the substrate is not damaged.

Abstract translation: 公开了一种处理衬底的装置和方法。 能够确定衬底相对于压板倾斜的检测系统位于靠近衬底的位置。 在一些实施例中，检测系统是距离测量系统。 在其它实施例中，它是角度传感器。 检测系统与控制器通信，控制器又与衬底处理机器人连通。 如果基于从检测系统接收的信息，控制器确定衬底倾斜超过可接受的范围，则假设衬底保持附着在压板上。 在这种情况下，基板处理机器人不会试图将其从压板上移除。 这样就不会损坏基板。