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1.发明申请SHIELDING SYSTEM FOR MOBILE DEVICE AND METHOD FOR ASSEMBLING THE SYSTEM 审中-公开用于移动设备的屏蔽系统和用于组装该系统的方法公开(公告)号：US20130153286A1
公开(公告)日：2013-06-20
申请号：US13710956
申请日：2012-12-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jeongung KIM , Jaewoo JEONG , Kuntak KIM , Hyunjoo HAN , Seyoung JANG
CPC classification number: H05K9/0007 , H05K3/00 , H05K9/0028 , Y10T29/49124
Abstract: A shielding system for a mobile device and a method for assembling the system are provided. The shielding system includes a Printed Circuit Board (PCB) with a first area and a thickness, and a shield enclosure, spaced apart and above a front side of the PCB at a certain distance, for enclosing components on the PCB. Parts of the shield enclosure are coupled to at least one of a lateral side and a back side of the PCB.
Abstract translation: 提供了一种用于移动设备的屏蔽系统和用于组装该系统的方法。 屏蔽系统包括具有第一区域和厚度的印刷电路板（PCB）和屏蔽外壳，隔离并且在PCB的正面上方一定距离，用于封装PCB上的部件。 屏蔽外壳的部分耦合到PCB的侧面和背面中的至少一个。
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2.发明申请公开(公告)号：US20200100390A1
公开(公告)日：2020-03-26
申请号：US16577835
申请日：2019-09-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyungha KOO , Kuntak KIM , Jihong KIM , Hongki MOON , Hajoong YUN , Haejin LEE , Seyoung JANG
Abstract: A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.
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公开(公告)号：US20160131541A1
公开(公告)日：2016-05-12
申请号：US14982802
申请日：2015-12-29
Applicant: Samsung Electronics Co. Ltd.
Inventor： Minsu KIM , Kuntak KIM , Kiyeon PARK , Chuleun YUN , Jubeam LEE , Seyoung JANG , Hyojae CHO , Bongsu CHUN , Younghee HA
IPC: G01K13/00
CPC classification number: G01K13/00 , G09G3/20 , G09G2320/041 , G09G2320/0626 , G09G2330/045 , G09G2340/0435 , H04M1/72569 , H04M2250/52 , H04N5/23241
Abstract: A temperature control system of a mobile device is provided. The system includes a memory for storing a set temperature value and a release temperature value, a temperature sensor for sensing an internal temperature of the mobile device; at least one module that emits heat, and a controller. The controller compares the output of the temperature sensor with the set temperature value in a normal mode in order to determine whether the mobile device is overheated, and controls, if the mobile device is overheated, the at least one module to operate in a heat generation suppressing mode, compares the output of the temperature sensor with the release temperature value in the heat generation suppressing mode in order to determine whether to release the heat generation suppressing mode, and executes the normal mode if the heat generation suppressing mode is released according to the comparison result.
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Patent Agency Ranking
公开(公告)号：US20210161034A1
公开(公告)日：2021-05-27
申请号：US16952595
申请日：2020-11-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chihwan JEONG , Kyungha KOO , Jihong KIM , Dongku KANG , Kuntak KIM , Yunjeong PARK , Kyuhwan LEE , Haejin LEE , Seyoung JANG , Hyuntae JANG
Abstract: The disclosure relates to a wireless charging device including a cooling fan, and the wireless charging device according to an embodiment of the disclosure includes: a housing including a holding portion configured to hold an external electronic device; a first bracket positioned in the holding portion; a conductive coil disposed in the first bracket; a second bracket positioned in the holding portion and including a penetrating hole; a first cooling fan positioned in the penetrating hole; a second cooling fan positioned in the penetrating hole and spaced apart from the first cooling fan; and a partition formed in the penetrating hole to isolate the first cooling fan and the second cooling fan from each other, the penetrating hole being divided into a first area having the first cooling fan disposed therein and a second area having the second cooling fan positioned therein, at least one protrusion having a volute shape formed on at least a portion of the second bracket or at least a portion of the partition, a first opening formed on at least an area of the first bracket to allow air cooled by the first cooling fan and/or the second cooling fan to move to the holding portion, and a second opening formed on at least an area of the holding portion to allow the air transmitted from the first opening to move outside the wireless charging device.
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公开(公告)号：US20130120630A1
公开(公告)日：2013-05-16
申请号：US13658258
申请日：2012-10-23
Applicant: Samsung Electronics Co. Ltd.
Inventor： Minsu KIM , Kuntak KIM , Kiyeon PARK , Chuleun YUN , Jubeam LEE , Seyoung JANG , Hyojae CHO , Bongsu CHUN , Younghee HA
CPC classification number: G01K13/00 , H04M1/72569 , H04M2250/52 , H04N5/23241
Abstract: A temperature control system of a mobile device is provided. The system includes a memory for storing a set temperature value and a release temperature value, a temperature sensor for sensing an internal temperature of the mobile device; at least one module that emits heat, and a controller. The controller compares the output of the temperature sensor with the set temperature value in a normal mode in order to determine whether the mobile device is overheated, and controls, if the mobile device is overheated, the at least one module to operate in a heat generation suppressing mode, compares the output of the temperature sensor with the release temperature value in the heat generation suppressing mode in order to determine whether to release the heat generation suppressing mode, and executes the normal mode if the heat generation suppressing mode is released according to the comparison result.
Abstract translation: 提供了一种移动设备的温度控制系统。 该系统包括用于存储设定温度值和释放温度值的存储器，用于感测移动设备的内部温度的温度传感器; 至少一个发热的模块和一个控制器。 控制器在正常模式下将温度传感器的输出与设定温度值进行比较，以便确定移动设备是否过热，并且如果移动设备过热，则控制至少一个模块以发热 将发热抑制模式中的温度传感器的输出与释放温度值进行比较，以便确定是否释放发热抑制模式，并且如果根据产生抑制模式释放发热抑制模式，则执行正常模式 比较结果。
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公开(公告)号：US20220107674A1
公开(公告)日：2022-04-07
申请号：US17554389
申请日：2021-12-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Heetae KIM , Kuntak KIM , Mansu YANG , Seungchul CHOI , Kyungha KOO , Soongyu KWON , Soohyun MOON , Kyungsoo SEO , Myungkee LEE , Jihwan LIM , Hyuntae JANG , Kyejeong JEONG
IPC: G06F1/20 , G06F1/3296 , G06F1/324
Abstract: A method of an electronic device are provided in which current consumption for one or more components of the electronic device is compared with a predetermined current. A first surface temperature of the electronic device is determined based on the comparison and power consumption of the one or more components. A location is detected where heat corresponding to the first surface temperature is generated. A second surface temperature of the electronic device is obtained based on power consumption of a component disposed in the electronic device corresponding to the location where the heat is generated. A target temperature is set based on the obtained second surface temperature. The component is controlled to reduce the power consumption of the component based on the target temperature.
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公开(公告)号：US20210392736A1
公开(公告)日：2021-12-16
申请号：US17286007
申请日：2019-10-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyungha KOO , Hongki MOON , Chihwan JEONG , Kuntak KIM , Yunjeong PARK , Seungjoo LEE , Haejin LEE , Seyoung JANG
Abstract: Various embodiments of the present invention relate to an electronic device including a stacked circuit board. The electronic device comprises: a first circuit board; a second circuit board; one or more circuit elements disposed on the second circuit board; and a connecting member disposed between the first circuit board and the second circuit board facing the first circuit board to form an internal space surrounding at least some of the one or more circuit elements, and to electrically connect the first and second circuit boards, wherein the internal space may be filled with a phase change material (PCM) that absorbs heat generated by the at least some circuit elements to change the state of the material. Various other embodiments of the present invention may be additionally provided.
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公开(公告)号：US20210373625A1
公开(公告)日：2021-12-02
申请号：US15734060
申请日：2020-09-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungha KOO , Kuntak KIM , Hajoong YUN , Seungjoo LEE , Seyoung JANG , Hyuntae JANG
Abstract: An electronic device and method of operating an electronic device are provided. The electronic device includes a temperature measurement unit configured to measure a temperature of each of multiple components of the electronic device, and a controller configured to change, based on a first reference temperature, an operating frequency of the controller to a first operating frequency when a temperature of the controller, measured by the temperature measurement unit, reaches the first reference temperature and change, based on a third reference temperature that is lower than the first reference temperature, the operating frequency of the controller to a second operating frequency when a temperature of at least one component of the multiple components reaches a second reference temperature while the controller operates at the first operating frequency.
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