公开(公告)号：US20130153286A1

公开(公告)日：2013-06-20

申请号：US13710956

申请日：2012-12-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongung KIM ,  Jaewoo JEONG ,  Kuntak KIM ,  Hyunjoo HAN ,  Seyoung JANG

IPC: H05K9/00 ,  H05K3/00

CPC classification number: H05K9/0007 ,  H05K3/00 ,  H05K9/0028 ,  Y10T29/49124

Abstract: A shielding system for a mobile device and a method for assembling the system are provided. The shielding system includes a Printed Circuit Board (PCB) with a first area and a thickness, and a shield enclosure, spaced apart and above a front side of the PCB at a certain distance, for enclosing components on the PCB. Parts of the shield enclosure are coupled to at least one of a lateral side and a back side of the PCB.

Abstract translation: 提供了一种用于移动设备的屏蔽系统和用于组装该系统的方法。 屏蔽系统包括具有第一区域和厚度的印刷电路板（PCB）和屏蔽外壳，隔离并且在PCB的正面上方一定距离，用于封装PCB上的部件。 屏蔽外壳的部分耦合到PCB的侧面和背面中的至少一个。