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公开(公告)号：US20210410268A1
公开(公告)日：2021-12-30
申请号：US17293280
申请日：2019-11-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hongki MOON , Yoonsun PARK , Seunghoon KANG , Kyungha KOO , Seyoung JANG , Woojune JUNG
Abstract: Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.
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公开(公告)号：US20200267828A1
公开(公告)日：2020-08-20
申请号：US16795223
申请日：2020-02-19
Applicant: Samsung Electronics Co, Ltd
Inventor： Hongki MOON , Yoonsun PARK , Seunghoon KANG , Kyungha KOO , Hajoong YUN , Seungjoo LEE , Yeonjoo LEE , Seyoung JANG
Abstract: An electronic device for improving heat transfer is provided. The electronic device includes a housing, a display mounted on at least one surface of the housing, a battery, a supporting member disposed adjacent to a back surface of the display and supporting the display, a printed circuit board on which electronic components are mounted, a shield can surrounding at least a portion of the electronic components, a shielding structure disposed on an outer surface of the shield can to shield the electronic components, and a first heat transfer member disposed on an outer surface of the shielding structure and including a partial area that faces at least one electronic component among the plurality of electronic components mounted on the printed circuit board and another partial area that is bent and faces another electronic component among the plurality of electronic components mounted on the printed circuit board.
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公开(公告)号：US20220330457A1
公开(公告)日：2022-10-13
申请号：US17435928
申请日：2021-09-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Joseph AHN , Kyungha KOO , Hongki MOON
Abstract: A vapor chamber and an electronic device are provided. The vapor chamber includes a first sheet including a first flat portion and a first bending portion bent, at an edge of the first flat portion, to be inclined at a first angle for the first flat portion, a second sheet including a second flat portion and a second bending portion bent, at an edge of the second flat portion, to be inclined at a second angle for the second flat portion, and a side portion formed by bonding the first bending portion and the second bending portion. A bonding surface between the first bending portion and the second bending portion may be disposed to be inclined from or perpendicular to an outer surface of the side portion.
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公开(公告)号：US20220167530A1
公开(公告)日：2022-05-26
申请号：US17534157
申请日：2021-11-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Joseph AHN , Kyungha KOO , Hongki MOON
IPC: H05K7/20 , B23K26/323 , F28D15/02 , B23K26/24
Abstract: An electronic device according to various embodiments may include: a housing, a printed circuit board disposed in the housing, an electrical element disposed on the printed circuit board, and a dissimilar metal structure disposed adjacent to the electrical element. The dissimilar metal structure may include a first metal portion comprising a first material, a second metal portion comprising a second material different from the first material, wherein at least a part of the second metal portion is bonded to the first metal portion, a vapor passage disposed in a space surrounded by the first metal portion and the second metal portion, and a wick disposed in contact with at least a part of the vapor passage in the space, wherein when viewed from above the dissimilar metal structure, a welded portion (e.g., bead) of the second metal portion, the welded portion being disposed at an interface between the first metal portion and the second metal portion, is disposed to surround at least a part of the first metal portion.
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公开(公告)号：US20210391636A1
公开(公告)日：2021-12-16
申请号：US17402055
申请日：2021-08-13
Applicant: Samsung Electronics Co., Ltd. , Amotech Co., Ltd.
Inventor： Seunghoon KANG , Jinhyoung LEE , Kyungha KOO , Jinmyoung KIM , Hongki MOON , Yoonsun PARK , Seyoung JANG , Seungjae HWANG
Abstract: An electronic device according to various embodiments of the present disclosure can comprise: a front plate facing a first direction; a rear plate facing a second direction, which is opposite to the first direction; at least one antenna module arranged between the front plate and the rear plate; and at least one heat dissipation sheet spaced from the at least one antenna module so as to be arranged to come in contact with the rear plate. The at least one heat dissipation sheet can comprise a ceramic filler and a binder resin mixed with the ceramic filler.
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Patent Agency Ranking
公开(公告)号：US20230413484A1
公开(公告)日：2023-12-21
申请号：US18461141
申请日：2023-09-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Joseph AHN , Kyungha KOO , Hongki MOON
CPC classification number: H05K7/20336 , H05K7/2099 , G06F1/203 , H04M1/0266 , G06F2200/201
Abstract: An electronic device according to various embodiments comprises: a housing including a heat source and a thermal management chamber thermally coupled to the heat source; and a display disposed on the housing on the opposite side from the heat source. The thermal management chamber includes a working fluid, and is configured to generate bubbles in the working fluid at or above the boiling critical temperature of the working fluid. The thermal management chamber may include: a first wall located adjacent to the heat source and having a first hydrophilic surface; a second wall located on the opposite side from the first wall and spaced apart from the heat source, and having a second hydrophobic surface, and a plurality of third walls located between the first wall and the second wall.
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7.发明公开公开(公告)号：US20230257884A1
公开(公告)日：2023-08-17
申请号：US18137062
申请日：2023-04-20
Applicant: SAMSUNG ELECTRONICS CO, LTD. , INTOPS CO, LTD.
Inventor： Chunghyo JUNG , Wonjun KO , Hyein PARK , Yongsub LEE , Jaedeok LIM , Bumjin CHO , Chiyoung YOON , Keunha KIM , Kyungha KOO , Hongki MOON
CPC classification number: C23C18/2013 , H05K5/0247 , B23C3/30 , C23C18/1651 , C23C18/1689 , B23K26/364
Abstract: The present disclosure provides electronic device and methods of manufacturing the electronic devices. In some embodiments, the electronic device includes an outer housing at least partially forming an exterior of the electronic device, a trench including at least one valley and at least one peak, a first conductive member, and a coating layer laminated on the outer housing and disposed on the first conductive member. Each of the at least one valley is concave with respect to a surface of the outer housing. Each of the at least one peak is convex with respect to the surface of the outer housing and has a partially removed end. The trench is plated with the first conductive member.
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公开(公告)号：US20230075973A1
公开(公告)日：2023-03-09
申请号：US18055271
申请日：2022-11-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hongki MOON , Kihyun KIM , Jae-Il SEO , Jihong KIM , Yoon-Sun PARK , Wooram LEE , Se-Young JANG , Jongchul HONG , Kyungha KOO
Abstract: According to various embodiments, a wireless charging device can comprise: a first housing, which includes a first surface facing a first direction and a second surface facing a second direction opposite to the first direction, and includes at least one hole; a second housing arranged on the second surface of the first housing in the second direction; a coil unit arranged between the first housing and the second housing and configured to transmit power to an external device; a shielding member arranged adjacent to the coil unit and including at least one hole; and a fan arranged adjacent to the coil unit and configured to rotate.
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公开(公告)号：US20220272868A1
公开(公告)日：2022-08-25
申请号：US17673099
申请日：2022-02-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hongki MOON , Kyungha KOO , Yoonsun PARK , Youngjae YOU , Hyunjoo LEE , Joseph AHN
IPC: H05K7/20
Abstract: An electronic device may include: a housing, a support member disposed in an internal space of the housing and including a first surface and a second surface facing a direction opposite the first surface, wherein the support member includes a through hole in at least a portion thereof, and a vapor chamber disposed through at least a portion of the through-hole, wherein the vapor chamber may include: a first plate including a first plate portion including a plurality of pillars and a first flange portion extending along an edge of the first plate portion to have a first width, a second plate having a size corresponding to the first plate portion and including a second plate portion including a recess and a second flange portion extending along an edge of the second plate portion to have a second width less than the first width, and at least one wick disposed in the recess, wherein the wick may be accommodated through a closed space defined through coupling of the first plate and the second plate.
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公开(公告)号：US20250155944A1
公开(公告)日：2025-05-15
申请号：US19023947
申请日：2025-01-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Joseph AHN , Kyungha KOO , Hongki MOON
Abstract: According to various embodiments of the disclosure, an electronic device may include: a housing, a display accommodated inside the housing, a support supporting the display and including a opening and a side wall surrounding the opening, and a heat dissipation structure at least a portion of which is positioned in the opening and bonded to the side wall, wherein the heat dissipation structure may include a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, is the second thermal conductivity being lower than the first thermal conductivity, the protective layer covering at least a portion of the heat dissipation layer.
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