公开(公告)号：US20200053919A1

公开(公告)日：2020-02-13

申请号：US16535528

申请日：2019-08-08

Applicant: Samsung Electronics Co., Ltd

Inventor： Haejin LEE ,  Min Park ,  Jungje Bang ,  Kyungha Koo ,  Yunjeong Park

IPC: H05K9/00 ,  H05K1/02

Abstract: Provided is an electronic device including a printed circuit board (PCB) in which at least one electrical element is disposed; a shield can including a concave portion and an opening formed in part of the concave portion and configured to receive the at least one electrical element at an inside of the concave portion disposed on the PCB; a conductive plate configured to cover the opening at an outside of the concave portion; a support member disposed between the conductive plate and the outside of the concave portion; and a shielding member disposed between the support member and the outside of the concave portion and connected to at least part of the conductive plate extended in a direction of the opening from the support member and configured to cover the opening.

公开(公告)号：US20230199097A1

公开(公告)日：2023-06-22

申请号：US18110451

申请日：2023-02-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongkee JUNG ,  Kyuhwan LEE ,  Haejin LEE ,  Juhee HAN

IPC: H04M1/02 ,  G06F1/20

CPC classification number: H04M1/0268 ,  H04M1/0216 ,  G06F1/203

Abstract: According to various embodiments of the present disclosure, an electronic device may include a first housing, a second housing connected to the first housing via a hinge structure, an electronic component, a flexible display being configured to be foldable according to rotation, a heat dissipation sheet arranged under the flexible display, and a first adhesive layer configured to bond the flexible display and the heat dissipation sheet to each other. The heat dissipation sheet may include a first portion corresponding to the first housing, a second portion corresponding to the second housing, and a third portion interconnecting the first portion and the second portion and corresponding to the hinge structure. The third portion may include a structure that protrudes or is folded at least once with respect to the first portion and the second portion. The first adhesive layer may include a first opening corresponding to the third portion.

公开(公告)号：US20210392736A1

公开(公告)日：2021-12-16

申请号：US17286007

申请日：2019-10-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungha KOO ,  Hongki MOON ,  Chihwan JEONG ,  Kuntak KIM ,  Yunjeong PARK ,  Seungjoo LEE ,  Haejin LEE ,  Seyoung JANG

IPC: H05K1/02 ,  H05K1/14

Abstract: Various embodiments of the present invention relate to an electronic device including a stacked circuit board. The electronic device comprises: a first circuit board; a second circuit board; one or more circuit elements disposed on the second circuit board; and a connecting member disposed between the first circuit board and the second circuit board facing the first circuit board to form an internal space surrounding at least some of the one or more circuit elements, and to electrically connect the first and second circuit boards, wherein the internal space may be filled with a phase change material (PCM) that absorbs heat generated by the at least some circuit elements to change the state of the material. Various other embodiments of the present invention may be additionally provided.

公开(公告)号：US20210251110A1

公开(公告)日：2021-08-12

申请号：US17166248

申请日：2021-02-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haejin LEE ,  Dongku KANG ,  Jihong KIM ,  Min PARK ,  Yunjeong PARK ,  Kyuhwan LEE ,  Jinhwan JUNG ,  Ahreum HWANG ,  Kyungha KOO

IPC: H05K9/00 ,  H05K1/02

Abstract: A portable communication device is provided. A portable communication device includes a first nanofiber member having a first density, a second nanofiber member attached to the first nanofiber member and having a second density lower than the first density, a heat transfer member positioned on or above the second nanofiber member, and a conductive material coated on at least a portion of the first nanofiber member and the second nanofiber member. At least some of the conductive material may penetrate into the first nanofiber member or the second nanofiber member. Various other embodiments may be possible.

公开(公告)号：US20250021136A1

公开(公告)日：2025-01-16

申请号：US18902001

申请日：2024-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyuhwan LEE ,  Haejin LEE

IPC: G06F1/16 ,  G06F1/20

Abstract: An electronic apparatus includes: a first housing; a second housing coupled to the first housing such as to be slidable in a first direction away from the first housing and in a second direction opposite to the first direction; a roller including a rotation shaft oriented perpendicular to the first direction and the second direction, the roller being in at least one from among the second housing and the first housing; and a heat transfer sheet including a flexible and thermally conductive material, wherein one end portion of the heat transfer sheet is coupled to the roller, wherein the roller is configured to wind the heat transfer sheet in a case where the second housing slides in the second direction and unwind the heat transfer sheet in a case where the second housing slides in the first direction.

公开(公告)号：US20240188218A1

公开(公告)日：2024-06-06

申请号：US18438124

申请日：2024-02-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yonglak CHO ,  Joohan KIM ,  Juho KIM ,  Min PARK ,  Eunsoo PARK ,  Insun AN ,  Byungwoo LEE ,  Sangtae LEE ,  Haejin LEE

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/144 ,  H05K3/284 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/10378 ,  H05K2201/10545

Abstract: A circuit board module includes a first substrate, a second substrate provided above the first substrate and including a first inlet, a first interposer provided between the first substrate and the second substrate, the first interposer connecting the first substrate and the second substrate and providing a first space between the first substrate and the second substrate, a sealing member covering the first inlet, and a filler provided between the first substrate and the second substrate, where the sealing member includes an insertion area configured to receive a nozzle that injects the filler to be inserted into the first inlet and at least one of the first substrate, the second substrate and the first interposer includes a first opening configured to introduce air into the first space and a second opening configured to exhaust air from the first space.

公开(公告)号：US20210341229A1

公开(公告)日：2021-11-04

申请号：US17375626

申请日：2021-07-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haejin LEE ,  Kyungha KOO ,  Chunghyo JUNG ,  Se-Young JANG ,  Jungje BANG ,  Jaeheung YE ,  Chi-Hyun CHO

IPC: F28D15/02 ,  G06F1/20 ,  H04M1/02 ,  H05K7/20 ,  H05K9/00 ,  H01L23/427

Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

公开(公告)号：US20210161034A1

公开(公告)日：2021-05-27

申请号：US16952595

申请日：2020-11-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chihwan JEONG ,  Kyungha KOO ,  Jihong KIM ,  Dongku KANG ,  Kuntak KIM ,  Yunjeong PARK ,  Kyuhwan LEE ,  Haejin LEE ,  Seyoung JANG ,  Hyuntae JANG

IPC: H05K7/20 ,  H02J7/02 ,  H02J7/00 ,  H02J50/10

Abstract: The disclosure relates to a wireless charging device including a cooling fan, and the wireless charging device according to an embodiment of the disclosure includes: a housing including a holding portion configured to hold an external electronic device; a first bracket positioned in the holding portion; a conductive coil disposed in the first bracket; a second bracket positioned in the holding portion and including a penetrating hole; a first cooling fan positioned in the penetrating hole; a second cooling fan positioned in the penetrating hole and spaced apart from the first cooling fan; and a partition formed in the penetrating hole to isolate the first cooling fan and the second cooling fan from each other, the penetrating hole being divided into a first area having the first cooling fan disposed therein and a second area having the second cooling fan positioned therein, at least one protrusion having a volute shape formed on at least a portion of the second bracket or at least a portion of the partition, a first opening formed on at least an area of the first bracket to allow air cooled by the first cooling fan and/or the second cooling fan to move to the holding portion, and a second opening formed on at least an area of the holding portion to allow the air transmitted from the first opening to move outside the wireless charging device.

公开(公告)号：US20240304565A1

公开(公告)日：2024-09-12

申请号：US18435107

申请日：2024-02-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungbok LEE ,  Dongkee JUNG ,  Kyuhwan LEE ,  Haejin LEE ,  Jieun HWANG ,  Myungjun KIM ,  Min PARK ,  Sunga YANG

IPC: H01L23/552 ,  H01L23/367 ,  H05K7/20 ,  H05K9/00

CPC classification number: H01L23/552 ,  H01L23/3675 ,  H05K7/20445 ,  H05K9/0032

Abstract: According to an embodiment, an electronic device includes: an electronic component, a shield can including an opening aligned with the electronic component, a shielding sheet disposed on the shield-can, wherein heat generated from the electronic component is configured to be transferred to the shielding sheet, and a thermal interface material (TIM) configured to transfer heat generated from the electronic component to the shielding sheet and extending from the electronic component to the shielding sheet through at least a portion of the opening. The thermal interface material includes a phase change material (PCM), and is included at least partially in the shielding sheet.

公开(公告)号：US20230156902A1

公开(公告)日：2023-05-18

申请号：US18091368

申请日：2022-12-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyuhwan LEE ,  Min PARK ,  Haejin LEE ,  Jaeheung YE ,  Yeonkyung CHUNG

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H05K2201/10378

Abstract: An electronic device includes a printed circuit board (“PCB”) structure which accommodates a thermal interface material (“TIM”). The PCB structure includes a base plate, a first component on the base plate, a second component on the base plate and apart from the first component, an interposer connected to the base plate and surrounding the first component and the second component, a cover plate connected to the interposer and covering the first component and the second component, and an accommodation part which is between the base plate and a heat conduction plate and accommodates the TIM.