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公开(公告)号：US20240431016A1
公开(公告)日：2024-12-26
申请号：US18754916
申请日：2024-06-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Joohan KIM , Yonglak CHO , Min PARK
Abstract: According to an embodiment, a printed circuit board (PCB) structure may include: a first PCB; an interposer; a second PCB; and a cover structure including a mounting layer which is connected to the second PCB and includes a base hole, a support layer which is on a surface of the mounting layer that faces away from the second PCB, and a visible layer which is connected to the support layer and includes a material having transparency.
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公开(公告)号：US20230156989A1
公开(公告)日：2023-05-18
申请号：US17986242
申请日：2022-11-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Haejin LEE , Min PARK , Kyuhwan LEE
CPC classification number: H05K9/0088 , H05K9/0024 , H05K1/0203 , H05K9/009 , H04M1/0277
Abstract: The disclosure relates to an electronic device including: a circuit board; a first component disposed on the circuit board; a shield can disposed to surround at least a part of the first component and including an opening; and a nanofiber film disposed on the shield can to cover the opening, wherein the nanofiber film includes a first layer, a second layer, and a third layer sequentially laminated in a first direction, the first layer or the third layer having a lower electrical resistance value than an electrical resistance value of the second layer in a second direction different from the first direction, and the second layer has a lower electrical resistance value than an electrical resistance value of the first layer or the third layer in the first direction.
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公开(公告)号：US20220173500A1
公开(公告)日：2022-06-02
申请号：US17457989
申请日：2021-12-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin LEE , Min PARK , Jinhwan JUNG
Abstract: According to various embodiments, an electronic device includes: a housing including a conductive part; an antenna module, including a substrate including a first substrate surface, a second substrate surface facing a direction opposite a direction of the first substrate surface, and a substrate side surrounding a space between the first substrate surface and the second substrate surface, at least one antenna element disposed in the substrate, wireless communication circuitry disposed in the substrate and configured to transmit and/or receive a radio signal in the direction toward which the first substrate surface is directed through the at least one antenna element, a protection member disposed on the second substrate surface, and a conductive shield layer disposed on at least an external surface of the protection member, as an antenna module disposed in an internal space of the housing; a conductive member disposed in at least a part of the conductive part and having at least a partial area thereof facing at least a part of the conductive shield layer; and a noise induction layer disposed between the antenna module and the conductive member to form a capacitor structure having a specified capacitance value between the conductive shield layer and the conductive member. Noise induced from the antenna module may be induced toward the conductive part through the capacitor structure.
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公开(公告)号：US20210136966A1
公开(公告)日：2021-05-06
申请号：US16638645
申请日：2018-07-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyun-Tae JANG , Min PARK , Byung Hoon LEE , Youngchul LEE , Changjoon LEE , Jiyoung JANG , Youngjun MOON , Minyoung PARK , Jeonggen YOON , Won CHOI , Siho JANG
Abstract: According to various embodiments, provided is an electrical element transfer apparatus comprising: a fixing jig in which each of a plurality of electrical elements is arranged at a predetermined interval; a movement jig movably arranged at an upper part of the fixing jig, and including a plurality of first accommodating grooves for accommodating at least a part of each of the plurality of electrical elements; and an attraction device arranged around the movable jig and attaching each of the plurality of electrical elements through the movable jig to the first accommodating groove of the movable jig through magnetic force. Additional various embodiments are possible.
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公开(公告)号：US20210098911A1
公开(公告)日：2021-04-01
申请号：US17061461
申请日：2020-10-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Minki KIM , Byunghoon LEE , Min PARK , Sungtae PARK , Jungmin PARK , Yongjae SONG , Hongshin SHIN , Woosung Jang , Chulwoo PARK , Chihyun CHO
Abstract: An electronic device includes a housing; a first circuit board, and a flexible circuit board. The first circuit board is disposed in an internal space of the housing and includes a plurality of first conductive terminals. The flexible circuit board includes a first connection portion including a plurality of second conductive terminals configured to connect to the plurality of first conductive terminals. The flexible circuit board also includes a connection portion extended from the first connection portion, and at least one conductive layer extended from the connection portion to at least a portion of the first connection portion. Additionally, the flexible circuit board includes at least one transmissive area in which light may be transmitted and the at least one conductive layer is at least partially omitted. At least some of the plurality of second conductive terminals are visible from the outside through the at least one transmissive area.
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Patent Agency Ranking
公开(公告)号：US20210350109A1
公开(公告)日：2021-11-11
申请号：US17277787
申请日：2019-09-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yunjang JIN , Youjin KIM , Suna KIM , Min PARK , Bongjae RHEE , Yongwon LEE
Abstract: Various embodiments disclosed in the present document relate to: a protective film configured to be attached to a display glass equipped with an ultrasonic fingerprint sensor; and an electronic device including the same. According to the various embodiments disclosed in the present document, a protective film can be provided, which is configured to be attached to an electronic device provided with an ultrasonic fingerprint sensor, the protective film comprising: a first adhesive layer configured to be attached on a front plate of the electronic device; and a first substrate layer stacked and disposed on one surface side of the first adhesive layer, integrated with the first adhesive layer, and covering the front plate.
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公开(公告)号：US20210251110A1
公开(公告)日：2021-08-12
申请号：US17166248
申请日：2021-02-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin LEE , Dongku KANG , Jihong KIM , Min PARK , Yunjeong PARK , Kyuhwan LEE , Jinhwan JUNG , Ahreum HWANG , Kyungha KOO
Abstract: A portable communication device is provided. A portable communication device includes a first nanofiber member having a first density, a second nanofiber member attached to the first nanofiber member and having a second density lower than the first density, a heat transfer member positioned on or above the second nanofiber member, and a conductive material coated on at least a portion of the first nanofiber member and the second nanofiber member. At least some of the conductive material may penetrate into the first nanofiber member or the second nanofiber member. Various other embodiments may be possible.
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8.发明申请公开(公告)号：US20210059076A1
公开(公告)日：2021-02-25
申请号：US16988980
申请日：2020-08-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ohhyuck KWON , Min PARK , Jaeyoung HUH , Daesuk KANG , Ji EOM , Ewidon JEONG , Sungchul PARK
Abstract: A composite heat dissipation member and an electronic device comprising the composite heat dissipation member. The composite head dissipation member may include a first heat dissipation sheet disposed to be overlapped with an antenna module, and a second heat dissipation sheet disposed adjacent to the first heat dissipation sheet without an overlap with the first heat dissipation sheet, thermally connected to the first heat dissipation sheet, and having a higher thermal conductivity than the first heat dissipation sheet.
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9.发明申请公开(公告)号：US20200383247A1
公开(公告)日：2020-12-03
申请号：US16766363
申请日：2018-11-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Gyeongmin JIN , Min PARK , Jaedeok LIM , Jungje BANG , Jaeheung YE , Yongwon LEE , Seyoung JANG
Abstract: The disclosure provides an electronic device having an electromagnetic shielding structure for preventing an antenna performance degradation. The disclosed electronic device may include: an antenna disposed in some areas of the electronic device; a printed circuit board; and a display module including a display panel, one or more signal lines coupled to the display panel, and a flexible substrate on which the one or more signal lines are disposed. The flexible substrate may include: a conductive layer coupled to the printed circuit board in a curved state and configured to shield an electromagnetic wave radiated from the one or more signal lines to the antenna; and a stress neutralization layer of which a material can be deformed over time in response to a shape of the flexible substrate coupled in a curved state. The stress neutralization layer may be disposed between the flexible substrate and the conductive layer.
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公开(公告)号：US20200321229A1
公开(公告)日：2020-10-08
申请号：US16761905
申请日：2018-12-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Changjoon LEE , Byunghoon LEE , Min PARK , Kyungwoon JANG , Jeonggen YOON , Hyuntae JANG
IPC: H01L21/67 , H01L25/075 , B65G47/90
Abstract: Introduced is a micro-chip gripper comprising: a pin plate of which one surface is coupled to another apparatus; a hole plate of which one surface faces the other surface of the pin plate while being disposed to be spaced apart therefrom by a fixed distance, and which is driven together with the drive of the pin plate, and in which a plurality of holes making a fixed pattern are formed; pins which are inserted into the holes of the hole plate and of which one end part is supported by the pin plate; and an adhesion layer which covers the other surface of the hole plate. Other embodiments are possible.
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