公开(公告)号：US20220380643A1

公开(公告)日：2022-12-01

申请号：US17884077

申请日：2022-08-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungchul YOO ,  Byunghoon LEE ,  Myungjun KIM ,  Jikang KIM ,  Jeonghwan MIN ,  Kyoungchae SEO ,  Changyoung JEONG

IPC: C09J163/00 ,  G03F1/82 ,  G03F1/22 ,  B08B3/04

Abstract: An adhesive for an EUV mask includes an epoxy resin composition in an amount of 50 wt % to 80 wt % based on a total weight of the adhesive, the epoxy resin composition including an epoxy resin, a hardener, a toughening agent, a filler, and a curing accelerator, and an inorganic filler in an amount of 20 wt % to 50 wt % based on the total weight of the adhesive, the inorganic filler including one or more of aluminum hydroxide or calcium carbonate.

公开(公告)号：US20170088755A1

公开(公告)日：2017-03-30

申请号：US15254701

申请日：2016-09-01

Applicant: Samsung Electronics Co., Ltd. ,  FINE SEMITECH CORP.

Inventor： Byungchul YOO ,  Sungyong CHO ,  Jaehyuck CHOI ,  Jeongsu Yang ,  Donghoon CHUNG ,  Han-Shin LEE ,  Myungjun KIM ,  Ikjun KIM ,  Jikang KIM ,  Jeonghwan MIN ,  Kyoungchae SEO

IPC: C09J133/10 ,  G03F1/82 ,  B08B1/00 ,  C09J133/06 ,  B08B3/08 ,  B08B3/12 ,  G03F1/64 ,  C09J133/08

CPC classification number: C09J133/10 ,  C08F6/02 ,  C08F8/44 ,  C08F220/06 ,  C09J133/02 ,  C09J133/068 ,  C09J133/08 ,  C09J133/26 ,  G03F1/64 ,  G03F1/82

Abstract: A pellicle including a water-soluble adhesive and a photomask assembly including the pellicle are provided. A pellicle may include a membrane, a pellicle frame, and a water-soluble adhesive disposed on the pellicle frame. The water-soluble adhesive may be prepared by a mixture including a water-soluble acrylic adhesive material in an amount of about 40% to about 55% by weight of the mixture, water or a solution of water and alcohol in an amount of about 40% to about 55% by weight of the mixture, and an additive in an amount of about 1% to about 5% by weight of the mixture.

公开(公告)号：US20240304565A1

公开(公告)日：2024-09-12

申请号：US18435107

申请日：2024-02-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungbok LEE ,  Dongkee JUNG ,  Kyuhwan LEE ,  Haejin LEE ,  Jieun HWANG ,  Myungjun KIM ,  Min PARK ,  Sunga YANG

IPC: H01L23/552 ,  H01L23/367 ,  H05K7/20 ,  H05K9/00

CPC classification number: H01L23/552 ,  H01L23/3675 ,  H05K7/20445 ,  H05K9/0032

Abstract: According to an embodiment, an electronic device includes: an electronic component, a shield can including an opening aligned with the electronic component, a shielding sheet disposed on the shield-can, wherein heat generated from the electronic component is configured to be transferred to the shielding sheet, and a thermal interface material (TIM) configured to transfer heat generated from the electronic component to the shielding sheet and extending from the electronic component to the shielding sheet through at least a portion of the opening. The thermal interface material includes a phase change material (PCM), and is included at least partially in the shielding sheet.

公开(公告)号：US20220394870A1

公开(公告)日：2022-12-08

申请号：US17847315

申请日：2022-06-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seongyu HWANG ,  Sangmin LEE ,  Myungjun KIM ,  Jongchul CHOI

IPC: H05K5/04 ,  G06F1/16 ,  H05K5/02

Abstract: According to an embodiment of the disclosure, an electronic device may include: a housing defining at least one surface of the electronic device. The housing may include: a metal plate comprising at least one penetration hole, a first nonmetallic part combined with the metal plate and surrounding at least a part of a side surface of the metal plate, and a second nonmetallic part at least partially disposed in the at least one penetration hole and providing a part of the one surface.

公开(公告)号：US20210032514A1

公开(公告)日：2021-02-04

申请号：US16801677

申请日：2020-02-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungchul YOO ,  Byunghoon LEE ,  Myungjun KIM ,  Jikang KIM ,  Jeonghwan MIN ,  Kyoungchae SEO ,  Changyoung JEONG

IPC: C09J163/00 ,  G03F1/22 ,  G03F1/82

Abstract: An adhesive for an EUV mask includes an epoxy resin composition in an amount of 50 wt % to 80 wt % based on a total weight of the adhesive, the epoxy resin composition including an epoxy resin, a hardener, a toughening agent, a filler, and a curing accelerator, and an inorganic filler in an amount of 20 wt % to 50 wt % based on the total weight of the adhesive, the inorganic filler including one or more of aluminum hydroxide or calcium carbonate.