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公开(公告)号：US10236280B2
公开(公告)日：2019-03-19
申请号：US15827843
申请日：2017-11-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yong Min Kwon , Kyoung Jun Kim
IPC: H01L29/06 , H01L25/075 , H01L25/16 , H01L33/06 , H01L33/30 , H01L33/32 , H01L33/62 , H01L27/02 , H01L33/58 , H01C7/12 , H01L49/02 , H01L29/866
Abstract: A light emitting device package is provided. The light emitting device package includes three light emitting diode (LED) chips configured to emit light having different wavelengths, each of the three LED chips including a light emitting structure having a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer; a through electrode portion disposed adjacent to the three LED chips; a molding portion encapsulating respective side surfaces of the three LED chips and the through electrode portion; a transparent electrode layer disposed on a first surface of the molding portion, the three LED chips, and the through electrode portion; and three individual electrodes exposed through a second surface of the molding portion and disposed on the three LED chips, respectively.
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公开(公告)号：US20140246648A1
公开(公告)日：2014-09-04
申请号：US14186540
申请日：2014-02-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sung Jun Im , Dong Hyun Cho , Jong Rak Sohn , Yong Min Kwon
IPC: H01L33/38
CPC classification number: H01L33/382 , H01L33/62 , H01L2224/13
Abstract: A light emitting device package, comprises a light emitting structure having first and second electrodes insulated from each other; and a support structure. The support structure comprises: a first support electrode electrically connected to the first electrode of the light emitting structure; a second support electrode electrically connected to the second electrode of the light emitting structure, the second support electrode spaced apart from, and electrically insulated from, the first support electrode; and a support connection portion between the first support electrode and the second support electrode. The light emitting structure includes a protrusion portion that protrudes in a horizontal direction beyond a sidewall of at least one of the first support electrode and the second support electrode so that a void is present below the protrusion portion and above a plane extending from bottoms of the first and second support electrodes.
Abstract translation: 发光器件封装，包括具有彼此绝缘的第一和第二电极的发光结构; 和支撑结构。 支撑结构包括：电连接到发光结构的第一电极的第一支撑电极; 电连接到所述发光结构的第二电极的第二支撑电极，所述第二支撑电极与所述第一支撑电极间隔开并与所述第一支撑电极电绝缘; 以及第一支撑电极和第二支撑电极之间的支撑连接部分。 发光结构包括突出部分，该突出部分在水平方向上突出超过第一支撑电极和第二支撑电极中的至少一个的侧壁，使得在突出部分的下方和从底部的底部延伸的平面之下存在空隙 第一和第二支撑电极。
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公开(公告)号：US09705041B2
公开(公告)日：2017-07-11
申请号：US14186540
申请日：2014-02-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sung Jun Im , Dong Hyun Cho , Jong Rak Sohn , Yong Min Kwon
CPC classification number: H01L33/382 , H01L33/62 , H01L2224/13
Abstract: A light emitting device package, comprises a light emitting structure having first and second electrodes insulated from each other; and a support structure. The support structure comprises: a first support electrode electrically connected to the first electrode of the light emitting structure; a second support electrode electrically connected to the second electrode of the light emitting structure, the second support electrode spaced apart from, and electrically insulated from, the first support electrode; and a support connection portion between the first support electrode and the second support electrode. The light emitting structure includes a protrusion portion that protrudes in a horizontal direction beyond a sidewall of at least one of the first support electrode and the second support electrode so that a void is present below the protrusion portion and above a plane extending from bottoms of the first and second support electrodes.
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公开(公告)号：US10256218B2
公开(公告)日：2019-04-09
申请号：US15941299
申请日：2018-03-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyoung Jun Kim , Yong Min Kwon , Geun Woo Ko , Pun Jae Choi , Dong Ho Kim
IPC: H01L25/075 , H01L33/62 , H01L33/56 , H01L33/54
Abstract: A light emitting device package includes: a plurality of light emitting chips configured to emit respective wavelength lights, each chip comprising electrodes at a bottom of the chip to form a flip-chip structure; a plurality of wirings directly connected to the electrodes of the chips, respectively; a plurality of electrode pads disposed below the chips and directly connected to the wirings, respectively; and a molding member integrally formed in a single layer structure to cover upper surfaces and side surfaces of the chips, and including a translucent material having a predetermined transmittance, wherein the wirings are disposed below a lower surface of the molding member.
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公开(公告)号：US09997670B2
公开(公告)日：2018-06-12
申请号：US15410033
申请日：2017-01-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ki Won Park , Yong Min Kwon , Hyung Kun Kim , Dong Kuk Lee , Dae Yeop Han
IPC: H01L33/22 , H01L33/06 , H01L33/32 , H01L33/62 , H01L33/54 , H01L33/50 , H01L33/38 , H01L27/15 , H01L33/00
CPC classification number: H01L33/22 , H01L27/153 , H01L33/0025 , H01L33/0075 , H01L33/06 , H01L33/325 , H01L33/38 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2933/0016 , H01L2933/0041 , H01L2933/005
Abstract: A semiconductor light emitting device package includes a light emitting structure having a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, a first surface, and a second surface, a first electrode and a second electrode disposed on the second surface of the light emitting structure; an insulating layer, a first metal pad and a second metal pad disposed on the insulating layer, and each having a surface with a first fine uneven pattern so as to have a first surface roughness, a first bonding pad and a second bonding pad disposed on the first metal pad and the second metal pad, respectively, and each having a surface with a second fine uneven pattern so as to have a second surface roughness, and an encapsulant encapsulating the first bonding pad, the second bonding pad, the first metal pad, and the second metal pad.
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Patent Agency Ranking
公开(公告)号：US09391250B2
公开(公告)日：2016-07-12
申请号：US14251170
申请日：2014-04-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sung Jun Im , Min Young Son , Yong Min Kwon , Hak Hwan Kim
IPC: H01L21/48 , H01L23/49 , H01L33/62 , H01L33/54 , H01L23/538 , H01L23/498 , H01L33/48
CPC classification number: H01L33/62 , H01L21/486 , H01L23/49827 , H01L23/5384 , H01L33/486 , H01L33/54 , H01L2224/0557 , H01L2224/13 , H01L2225/06541 , H01L2225/06548 , H01L2933/0033
Abstract: There is provided an electronic device package including an electronic device including a first electrode and a second electrode disposed on a surface thereof, a package substrate having a first surface having the electronic device mounted thereon and a second surface opposed to the first surface. The package substrate includes a first electrode pattern and a second electrode pattern electrically connected to the first electrode and the second electrode on the first surface, respectively. The package substrate further includes at least one via hole disposed outside of a region for mounting the electronic device and an irregular portion disposed on the first surface to be adjacent to the via hole.
Abstract translation: 提供了一种电子器件封装，其包括电子器件，其包括设置在其表面上的第一电极和第二电极，具有安装在其上的电子器件的第一表面和与第一表面相对的第二表面的封装衬底。 封装衬底包括分别电连接到第一电极和第一表面上的第二电极的第一电极图案和第二电极图案。 封装基板还包括设置在用于安装电子器件的区域的外侧的至少一个通孔和设置在与通孔相邻的第一表面上的不规则部分。
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公开(公告)号：US09059149B2
公开(公告)日：2015-06-16
申请号：US14063806
申请日：2013-10-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yong Min Kwon , Seo Hyun Moon , Sung Jun Im , Min Young Son
IPC: H01L23/48
CPC classification number: H01L23/481 , H01L23/49827 , H01L23/49838 , H01L33/38 , H01L2924/0002 , Y02E10/50 , H01L2924/00
Abstract: The present application provides an electronic device package. The package includes a packaging substrate having first and second surfaces opposing one another. First and second electrode patterns are formed on the first surface and first and second external terminals connected to the first and second electrode patterns. The second electrode pattern is electrically insulated from the first electrode pattern and surrounds the first electrode pattern An electronic device is mounted on the first surface of the packaging substrate and includes first and second electrodes disposed on a surface thereof facing the packaging substrate. The first and second electrodes are positioned on the first and second electrode patterns, respectively.
Abstract translation: 本申请提供了一种电子设备包装。 该包装包括具有彼此相对的第一和第二表面的包装衬底。 第一和第二电极图案形成在第一表面上，第一和第二外部端子连接到第一和第二电极图案。 第二电极图案与第一电极图案电绝缘并且包围第一电极图案电子器件安装在封装基板的第一表面上，并且包括设置在面向封装基板的表面上的第一和第二电极。 第一和第二电极分别位于第一和第二电极图案上。
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公开(公告)号：US10276629B2
公开(公告)日：2019-04-30
申请号：US15200616
申请日：2016-07-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dong Kuk Lee , Yong Min Kwon , Hyung Kun Kim
Abstract: A light emitting device package and a method of manufacturing the light emitting device package are provided. The light emitting package includes a light emitting stack including a first conductivity-type semiconductor layer, an active layer, a second conductivity-type semiconductor layer sequentially stacked, and having a first surface provided by the first conductivity-type semiconductor layer and a second surface provided by the second conductivity-type semiconductor layer and opposing the first surface; a first electrode structure disposed on a portion of the first surface and connected to the first conductivity-type semiconductor layer; a sealing portion disposed adjacent to the light emitting stack; an insulating layer disposed between the light emitting stack and the sealing portion; and a first metal pad disposed on the second surface and passing through the insulating layer at a side of the light emitting stack to connect to the first electrode structure.
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公开(公告)号：US09887332B2
公开(公告)日：2018-02-06
申请号：US15056117
申请日：2016-02-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Pun Jae Choi , Geun Woo Ko , Yong Min Kwon , Ah Young Woo , Jun Ho Lee , Jin Wook Chung
CPC classification number: H01L33/62 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L33/56 , H01L33/60
Abstract: A semiconductor light-emitting device package includes: a light-emitting structure having a first surface, a second surface opposite to the first surface and side surfaces disposed between the first and the second surfaces, the light-emitting structure comprising a first light-emitting laminate and a second light-emitting laminate, each of the first and the second light emitting laminates including: a first conductivity-type semiconductor layer; an active layer, and a second conductivity-type semiconductor layer, an interconnector provided on the second surface of the light-emitting structure and configured to electrically connect the first and the second light-emitting laminates; a metal guide surrounding the side surfaces of the light-emitting structure; and an encapsulant surrounding the metal guide and the second and the side surfaces of the light-emitting structure and exposing the first surface of the light-emitting structure.
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公开(公告)号：US09419172B2
公开(公告)日：2016-08-16
申请号：US14606954
申请日：2015-01-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Min Ki Kim , Jung Jin Kim , Yong Min Kwon
CPC classification number: H01L33/005 , G01J2001/4252 , G01J2003/466 , G01R31/2635 , H01L24/97 , H01L33/0095 , H01L33/486 , H01L33/62 , H01L2224/14 , H01L2224/16225 , H01L2933/0033 , H01L2933/0041
Abstract: A method of manufacturing a light emitting device package includes forming a plurality of light emitting devices by growing a plurality of semiconductor layers on a wafer, and measuring color characteristics of light emitted from each of the plurality of light emitting devices. For each of the plurality of light emitting devices, a type and an amount of wavelength conversion material is determined for color compensating the light emitting device based on a difference between the measured color characteristics and target color characteristics. A wavelength conversion layer is formed on at least two light emitting devices among the plurality of light emitting devices, the wavelength conversion layer having the type and the amount of wavelength conversion material determined for the at least two light emitting devices. The plurality of light emitting devices is then divided into individual light emitting device packages.
Abstract translation: 制造发光器件封装的方法包括通过在晶片上生长多个半导体层来形成多个发光器件，并测量从多个发光器件中的每个发射的光的颜色特性。 对于多个发光器件中的每一个，基于测量的颜色特性和目标颜色特性之间的差异，确定波长转换材料的类型和量用于对发光器件进行颜色补偿。 波长转换层形成在多个发光器件中的至少两个发光器件上，波长转换层具有为至少两个发光器件确定的类型和波长转换材料的量。 然后将多个发光器件分成单独的发光器件封装。
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