A light emitting device package is provided. The light emitting device package includes three light emitting diode (LED) chips configured to emit light having different wavelengths, each of the three LED chips including a light emitting structure having a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer; a through electrode portion disposed adjacent to the three LED chips; a molding portion encapsulating respective side surfaces of the three LED chips and the through electrode portion; a transparent electrode layer disposed on a first surface of the molding portion, the three LED chips, and the through electrode portion; and three individual electrodes exposed through a second surface of the molding portion and disposed on the three LED chips, respectively.