公开(公告)号：US09705041B2

公开(公告)日：2017-07-11

申请号：US14186540

申请日：2014-02-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Jun Im ,  Dong Hyun Cho ,  Jong Rak Sohn ,  Yong Min Kwon

IPC: H01L33/38 ,  H01L33/62

CPC classification number: H01L33/382 ,  H01L33/62 ,  H01L2224/13

Abstract: A light emitting device package, comprises a light emitting structure having first and second electrodes insulated from each other; and a support structure. The support structure comprises: a first support electrode electrically connected to the first electrode of the light emitting structure; a second support electrode electrically connected to the second electrode of the light emitting structure, the second support electrode spaced apart from, and electrically insulated from, the first support electrode; and a support connection portion between the first support electrode and the second support electrode. The light emitting structure includes a protrusion portion that protrudes in a horizontal direction beyond a sidewall of at least one of the first support electrode and the second support electrode so that a void is present below the protrusion portion and above a plane extending from bottoms of the first and second support electrodes.

公开(公告)号：US20140246648A1

公开(公告)日：2014-09-04

申请号：US14186540

申请日：2014-02-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Jun Im ,  Dong Hyun Cho ,  Jong Rak Sohn ,  Yong Min Kwon

IPC: H01L33/38

CPC classification number: H01L33/382 ,  H01L33/62 ,  H01L2224/13

Abstract: A light emitting device package, comprises a light emitting structure having first and second electrodes insulated from each other; and a support structure. The support structure comprises: a first support electrode electrically connected to the first electrode of the light emitting structure; a second support electrode electrically connected to the second electrode of the light emitting structure, the second support electrode spaced apart from, and electrically insulated from, the first support electrode; and a support connection portion between the first support electrode and the second support electrode. The light emitting structure includes a protrusion portion that protrudes in a horizontal direction beyond a sidewall of at least one of the first support electrode and the second support electrode so that a void is present below the protrusion portion and above a plane extending from bottoms of the first and second support electrodes.

Abstract translation: 发光器件封装，包括具有彼此绝缘的第一和第二电极的发光结构; 和支撑结构。 支撑结构包括：电连接到发光结构的第一电极的第一支撑电极; 电连接到所述发光结构的第二电极的第二支撑电极，所述第二支撑电极与所述第一支撑电极间隔开并与所述第一支撑电极电绝缘; 以及第一支撑电极和第二支撑电极之间的支撑连接部分。 发光结构包括突出部分，该突出部分在水平方向上突出超过第一支撑电极和第二支撑电极中的至少一个的侧壁，使得在突出部分的下方和从底部的底部延伸的平面之下存在空隙 第一和第二支撑电极。

公开(公告)号：US09391250B2

公开(公告)日：2016-07-12

申请号：US14251170

申请日：2014-04-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Jun Im ,  Min Young Son ,  Yong Min Kwon ,  Hak Hwan Kim

IPC: H01L21/48 ,  H01L23/49 ,  H01L33/62 ,  H01L33/54 ,  H01L23/538 ,  H01L23/498 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/5384 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/0557 ,  H01L2224/13 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2933/0033

Abstract: There is provided an electronic device package including an electronic device including a first electrode and a second electrode disposed on a surface thereof, a package substrate having a first surface having the electronic device mounted thereon and a second surface opposed to the first surface. The package substrate includes a first electrode pattern and a second electrode pattern electrically connected to the first electrode and the second electrode on the first surface, respectively. The package substrate further includes at least one via hole disposed outside of a region for mounting the electronic device and an irregular portion disposed on the first surface to be adjacent to the via hole.

Abstract translation: 提供了一种电子器件封装，其包括电子器件，其包括设置在其表面上的第一电极和第二电极，具有安装在其上的电子器件的第一表面和与第一表面相对的第二表面的封装衬底。 封装衬底包括分别电连接到第一电极和第一表面上的第二电极的第一电极图案和第二电极图案。 封装基板还包括设置在用于安装电子器件的区域的外侧的至少一个通孔和设置在与通孔相邻的第一表面上的不规则部分。

公开(公告)号：US09059149B2

公开(公告)日：2015-06-16

申请号：US14063806

申请日：2013-10-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong Min Kwon ,  Seo Hyun Moon ,  Sung Jun Im ,  Min Young Son

IPC: H01L23/48

CPC classification number: H01L23/481 ,  H01L23/49827 ,  H01L23/49838 ,  H01L33/38 ,  H01L2924/0002 ,  Y02E10/50 ,  H01L2924/00

Abstract: The present application provides an electronic device package. The package includes a packaging substrate having first and second surfaces opposing one another. First and second electrode patterns are formed on the first surface and first and second external terminals connected to the first and second electrode patterns. The second electrode pattern is electrically insulated from the first electrode pattern and surrounds the first electrode pattern An electronic device is mounted on the first surface of the packaging substrate and includes first and second electrodes disposed on a surface thereof facing the packaging substrate. The first and second electrodes are positioned on the first and second electrode patterns, respectively.

Abstract translation: 本申请提供了一种电子设备包装。 该包装包括具有彼此相对的第一和第二表面的包装衬底。 第一和第二电极图案形成在第一表面上，第一和第二外部端子连接到第一和第二电极图案。 第二电极图案与第一电极图案电绝缘并且包围第一电极图案电子器件安装在封装基板的第一表面上，并且包括设置在面向封装基板的表面上的第一和第二电极。 第一和第二电极分别位于第一和第二电极图案上。