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    Light emitting device package
    1.
    发明授权
    Light emitting device package 有权

    公开(公告)号：US10276629B2

    公开(公告)日：2019-04-30

    申请号：US15200616

    申请日：2016-07-01

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Dong Kuk Lee ,  Yong Min Kwon ,  Hyung Kun Kim

    IPC: H01L33/38 ,  H01L27/15 ,  H01L33/62 ,  H01L33/54 ,  H01L33/60 ,  H01L33/50 ,  H01L33/46 ,  H01L33/20

    Abstract: A light emitting device package and a method of manufacturing the light emitting device package are provided. The light emitting package includes a light emitting stack including a first conductivity-type semiconductor layer, an active layer, a second conductivity-type semiconductor layer sequentially stacked, and having a first surface provided by the first conductivity-type semiconductor layer and a second surface provided by the second conductivity-type semiconductor layer and opposing the first surface; a first electrode structure disposed on a portion of the first surface and connected to the first conductivity-type semiconductor layer; a sealing portion disposed adjacent to the light emitting stack; an insulating layer disposed between the light emitting stack and the sealing portion; and a first metal pad disposed on the second surface and passing through the insulating layer at a side of the light emitting stack to connect to the first electrode structure.

    LIGHT EMITTING DIODE PACKAGE
    3.
    发明申请
    LIGHT EMITTING DIODE PACKAGE 审中-公开
    发光二极管封装

    公开(公告)号：US20160329376A1

    公开(公告)日：2016-11-10

    申请号：US14990124

    申请日：2016-01-07

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyung Kun Kim

    IPC: H01L27/15 ,  H01L33/64 ,  H01L33/62

    CPC classification number: H01L27/156 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/62 ,  H01L33/644

    Abstract: A light emitting diode (LED) package includes a package board having a first surface having a plurality of chip mounting regions and a second surface opposing the first surface, and including a plurality of first and second through electrodes disposed in the plurality of chip mounting regions, a plurality of LED chips disposed in the plurality of chip mounting regions of the first surface of the package board and each having one surface on which first and second electrodes are disposed, wherein the first and second electrodes are connected to the first and second through electrodes positioned in the chip mounting regions, and a connection electrode disposed on at least one of the first surface and the second surface of the package board, and connecting the first and second through electrodes.

    Abstract translation: 发光二极管（LED）封装包括具有第一表面的封装板，第一表面具有多个芯片安装区域和与第一表面相对的第二表面，并且包括设置在多个芯片安装区域中的多个第一和第二通孔 ，多个LED芯片，其布置在所述封装板的所述第一表面的所述多个芯片安装区域中，并且每个具有设置有第一和第二电极的一个表面，其中所述第一和第二电极连接到所述第一和第二通孔 位于芯片安装区域中的电极，以及设置在封装板的第一表面和第二表面中的至少一个上并连接第一和第二贯通电极的连接电极。

    Method of manufacturing substrate for mounting electronic device
    5.
    发明授权
    Method of manufacturing substrate for mounting electronic device 有权
    制造电子装置用基板的方法

    公开(公告)号：US08748312B2

    公开(公告)日：2014-06-10

    申请号：US13722456

    申请日：2012-12-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jong Wan Seo ,  Hyung Kun Kim

    IPC: H01L21/44

    CPC classification number: H01L21/50 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/49827 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method of manufacturing a substrate for mounting an electronic device, includes forming at least one through-hole in a plate-shaped substrate body in a thickness direction thereof. An electrode substrate having at least one core on an upper surface thereof is formed such that the at least one core corresponds to the at least one through-hole. The electrode substrate is coupled to the substrate body by inserting the at least one core into the at least one through-hole. A portion of the coupled electrode substrate is removed except for the at least one core.

    Abstract translation: 一种制造用于安装电子装置的基板的方法，包括在板状基板主体的厚度方向上形成至少一个通孔。 在其上表面上具有至少一个芯的电极基板形成为使得至少一个芯对应于至少一个通孔。 通过将至少一个芯插入到至少一个通孔中，将电极基板连接到基板主体。 除了至少一个芯之外，除去耦合的电极基板的一部分。

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