公开(公告)号：US09997670B2

公开(公告)日：2018-06-12

申请号：US15410033

申请日：2017-01-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ki Won Park ,  Yong Min Kwon ,  Hyung Kun Kim ,  Dong Kuk Lee ,  Dae Yeop Han

IPC: H01L33/22 ,  H01L33/06 ,  H01L33/32 ,  H01L33/62 ,  H01L33/54 ,  H01L33/50 ,  H01L33/38 ,  H01L27/15 ,  H01L33/00

CPC classification number: H01L33/22 ,  H01L27/153 ,  H01L33/0025 ,  H01L33/0075 ,  H01L33/06 ,  H01L33/325 ,  H01L33/38 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0041 ,  H01L2933/005

Abstract: A semiconductor light emitting device package includes a light emitting structure having a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, a first surface, and a second surface, a first electrode and a second electrode disposed on the second surface of the light emitting structure; an insulating layer, a first metal pad and a second metal pad disposed on the insulating layer, and each having a surface with a first fine uneven pattern so as to have a first surface roughness, a first bonding pad and a second bonding pad disposed on the first metal pad and the second metal pad, respectively, and each having a surface with a second fine uneven pattern so as to have a second surface roughness, and an encapsulant encapsulating the first bonding pad, the second bonding pad, the first metal pad, and the second metal pad.