SEMICONDUCTOR DEVICE
    3.
    发明申请

    公开(公告)号:US20250133746A1

    公开(公告)日:2025-04-24

    申请号:US18745377

    申请日:2024-06-17

    Abstract: A semiconductor device includes a capacitor structure including a bottom electrode, a first dielectric layer on the bottom electrode, a second dielectric layer on the first dielectric layer, a third dielectric layer on the second dielectric layer, and a top electrode on the third dielectric layer, where each of the first dielectric layer and the third dielectric layer includes zirconium oxide, the second dielectric layer includes hafnium-zirconium oxide, and each of the first dielectric layer, the second dielectric layer, and the third dielectric layer includes a first crystal phase and a second crystal phase.

    SEMICONDUCTOR DEVICE
    5.
    发明申请

    公开(公告)号:US20190013391A1

    公开(公告)日:2019-01-10

    申请号:US15995049

    申请日:2018-05-31

    Abstract: Disclosed is a semiconductor device including a bottom electrode, a dielectric layer, and a top electrode that are sequentially disposed on a substrate. The dielectric layer includes a hafnium oxide layer including hafnium oxide having a tetragonal crystal structure, and an oxidation seed layer including an oxidation seed material. The oxidation seed material has a lattice constant having a lattice mismatch of 6% or less with one of a horizontal lattice constant and a vertical lattice constant of the hafnium oxide having the tetragonal crystal structure.

    CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE CAPACITOR STRUCTURE

    公开(公告)号:US20240304663A1

    公开(公告)日:2024-09-12

    申请号:US18417150

    申请日:2024-01-19

    CPC classification number: H01L28/91 H10B12/033

    Abstract: The capacitor structure includes a lower electrode on a substrate; a support layer on a sidewall of the lower electrode, the support layer including an insulating material; an interface structure having a first interface pattern on the sidewall of the lower electrode, the first interface pattern including a first metal, and a second interface pattern including a first portion on an outer sidewall of the first interface pattern and a second portion on a surface of the support layer, the second interface pattern including an oxide of a second metal, a dielectric pattern on the interface structure; and an upper electrode on the dielectric pattern, wherein the second portion of the second interface pattern further includes the first metal.

    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20210384194A1

    公开(公告)日:2021-12-09

    申请号:US17172131

    申请日:2021-02-10

    Abstract: A semiconductor device includes conductive pillars on a semiconductor substrate, a first support pattern that contacts first portions of lateral surfaces of the conductive pillars and connects the conductive pillars to each other, the first support pattern including first support holes that expose second portions of the lateral surfaces of the conductive pillars, a capping conductive pattern that contacts the second portions of the lateral surfaces of the conductive pillars and exposes the first support pattern, the second portions of the lateral surfaces of the conductive pillars being in no contact with the first support pattern, and a dielectric layer that covers the first support pattern and the capping conductive pattern, the dielectric layer being spaced apart from the conductive pillars.

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