公开(公告)号：US20160242291A1

公开(公告)日：2016-08-18

申请号：US15045480

申请日：2016-02-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Won PARK ,  Dong-Kyun YU ,  Ji-Heon YU ,  Seung-Yup LEE ,  Taek-Kyun CHOI

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0259 ,  H05K2201/10015

Abstract: Various embodiments related to a printed circuit board in which a capacitor is embedded are described. The capacitor may include: a plurality of first conductive layers that have a plurality of first via holes; a plurality of second conductive layers that have a plurality of second via holes, wherein the first and second conductive layers are alternately arranged in turns; and a plurality of dielectric layers that are arranged between the first and second conductive layers. Other various embodiments are possible.

Abstract translation: 描述与其中嵌入电容器的印刷电路板有关的各种实施例。 电容器可以包括：具有多个第一通孔的多个第一导电层; 具有多个第二通孔的多个第二导电层，其中所述第一和第二导电层依次交替布置; 以及布置在第一和第二导电层之间的多个电介质层。 其他各种实施例是可能的。

公开(公告)号：US20180358722A1

公开(公告)日：2018-12-13

申请号：US16002108

申请日：2018-06-07

Applicant: Samsung Electronics Co., Ltd. ,  HYUPJINCONNECTOR Co., Ltd

Inventor： Sung-Won PARK ,  Jae-Woon LEE ,  Yang-Jean PARK ,  Jong-Sun KIM ,  Jin-Woo PARK ,  Myung-Suk BAE ,  Seung-Yup LEE ,  Jae-Ryong HAN ,  Jang-Won HUR

IPC: H01R12/51 ,  H05K5/00

Abstract: According to an embodiment of the present disclosure, a connecting device included in an electronic device may comprise a movable part including at least one contacting part, an elastic part extending from the movable part and including a plurality of bends alternately arranged to allow the movable part to move in a first direction, and a support extending from the elastic part. Other various embodiments are also possible.

公开(公告)号：US20180144998A1

公开(公告)日：2018-05-24

申请号：US15626302

申请日：2017-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Won PARK ,  Jeong-Su HA ,  Sangbong PARK ,  Kwang Soo KIM ,  Byeong Kyu CHA

IPC: H01L21/66 ,  G01N21/88 ,  G01N21/95 ,  G06T7/00 ,  H04N7/18

CPC classification number: H01L22/20 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8887 ,  G06T7/0004 ,  G06T2207/10056 ,  G06T2207/30148 ,  H01L22/12 ,  H04N7/181

Abstract: Disclosed are an inspection apparatus and a method of manufacturing a semiconductor device using the same. The inspection apparatus includes a stage configured to receive a substrate, an objective lens on the stage and configured to enlarge the substrate optically, an ocular lens on the objective lens and configured to form at its image plane an image of the substrate, and a plurality of sensors above the ocular lens and in the image plane of the ocular lens.

公开(公告)号：US20170020012A1

公开(公告)日：2017-01-19

申请号：US15184292

申请日：2016-06-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Won PARK ,  Seungyup LEE ,  Sangil LEE ,  Won-Jea JANG

IPC: H05K5/02 ,  H05K5/00 ,  H04M1/18 ,  H01G2/10 ,  H04B1/3888 ,  H04M1/02 ,  G06F1/16 ,  H05K5/04

CPC classification number: H05K5/0247 ,  G06F1/1656 ,  H01G2/106 ,  H01G4/01 ,  H01G4/224 ,  H01G4/228 ,  H01M10/4264 ,  H01M16/00 ,  H04B1/3888 ,  H04M1/0277 ,  H04M1/185 ,  H05K5/0013 ,  H05K5/04 ,  H05K2201/0999

Abstract: An electronic device is provided. The electronic device includes a first metal plate of a metal bezel that forms the external appearance of the electronic device, a second metal plate that overlaps the first metal plate while being spaced apart from the first metal plate, a dielectric member interposed between the first metal plate and the second metal plate, and a substrate electrically connected to a contact terminal of the second metal plate to feed power. Other embodiments are possible.

Abstract translation: 提供电子设备。 电子设备包括形成电子设备的外观的金属边框的第一金属板，与第一金属板重叠的第二金属板，同时与第一金属板间隔开;电介质构件，介于第一金属 板和第二金属板，以及电连接到第二金属板的接触端子以供电的基板。 其他实施例是可能的。

公开(公告)号：US20140177186A1

公开(公告)日：2014-06-26

申请号：US14138220

申请日：2013-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Kwang SONG ,  Sung-Won PARK ,  Yong-Lak CHO

IPC: H05K9/00

CPC classification number: H04M1/0277 ,  H04B1/3888 ,  H04M1/19 ,  H05K9/0039

Abstract: An electronic device is provided including a mainboard having a ground; a conductive bracket coupled to the mainboard; and an elastic member coupled to the mainboard, and electrically connected with the ground of the mainboard; wherein the elastic member is in elastic contact with the conductive bracket; and wherein the elastic member is electrically connected to the conductive bracket.

Abstract translation: 提供一种电子设备，包括具有地面的主板; 耦合到主板的导电支架; 以及弹性构件，其联接到所述主板，并且与所述主板的地面电连接; 其中所述弹性构件与所述导电支架弹性接触; 并且其中所述弹性构件电连接到所述导电支架。

公开(公告)号：US20190137884A1

公开(公告)日：2019-05-09

申请号：US16053192

申请日：2018-08-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myung-Ho JUNG ,  Ji-Hoon KANG ,  Sean PARK ,  Sung-Won PARK ,  Jae-Min LEE

IPC: G03F7/20 ,  G01N21/95

Abstract: Inspection system for a device under test (DUT) includes an image sensor, N image obtaining devices, K switches, M image processing devices, and at least one added image processing device. The image obtaining devices are connected to the image sensor, and each of the N image obtaining devices receives image data of the image of the DUT captured by the image sensor. Each of the K switches is connected to a respective one of the image obtaining devices. Each of the M image processing devices is connected to a respective one of the switches, receives the image data that is output from one of the N image obtaining devices and is distributed by one of the K switches, and generates processed image data in real-time. The added image processing device is connected to one of the switches, receives the image data, and generates additional processed image data in real-time.

公开(公告)号：US20180299929A1

公开(公告)日：2018-10-18

申请号：US15948799

申请日：2018-04-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min-Soo KIM ,  Kyujin KWAK ,  Soo-Gyu LEE ,  Sung-Won PARK ,  Joon Won CHANG ,  Jin-Wan AN ,  Janghoon LEE

IPC: G06F1/16 ,  H05K1/02 ,  H05K7/14 ,  H05K5/03 ,  H05K1/18

CPC classification number: G06F1/1658 ,  G06F1/1626 ,  G06F1/1635 ,  G06F1/1637 ,  G06F1/1643 ,  G06F1/1656 ,  G06F1/1698 ,  G06F1/20 ,  G06F1/203 ,  G06F2203/04105 ,  H01Q1/243 ,  H02J7/0052 ,  H04M1/0277 ,  H05K1/028 ,  H05K1/05 ,  H05K1/144 ,  H05K1/148 ,  H05K1/181 ,  H05K5/03 ,  H05K7/1427 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09227 ,  H05K2201/10166

Abstract: An electronic device is provided. The electronic device includes a housing comprising a first plate, a second plate apart from the first plate while facing the first plate, and a side member which surrounds a space between the first plate and the second plate, a touchscreen display exposed through the first plate, a printed circuit board (PCB) disposed between the touchscreen display and the second plate, a mid-plate disposed between the touchscreen display and the PCB, and extending from the side member, and at least one integrated circuit (IC) mounted on the PCB and relating to power, wherein the mid-plate can include at least one conductive path formed on a surface facing the PCB and electrically connected to the at least one IC, and the at least one conductive path can be formed with the same metallic material as the mid-plate.

公开(公告)号：US20180062275A1

公开(公告)日：2018-03-01

申请号：US15692828

申请日：2017-08-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ki-Jung KIM ,  Jung-Youel BANG ,  Hyung-Bin NOH ,  Sung-Won PARK

IPC: H01Q21/28 ,  G06Q20/32 ,  H01Q1/22 ,  H04B5/00

CPC classification number: H01Q21/28 ,  G06Q20/327 ,  H01Q1/2208 ,  H01Q1/273 ,  H01Q7/00 ,  H04B5/0031

Abstract: Disclosed is an electronic device having an enhanced emission capability and including battery, at least one first antenna provided at a front of the battery, and at least one second antenna provided at a rear of the battery, wherein the at least one first antenna and the at least one second antenna may include a magnetic body and a conducting wire that is wound around the magnetic body multiple times.