公开(公告)号：US20180144998A1

公开(公告)日：2018-05-24

申请号：US15626302

申请日：2017-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Won PARK ,  Jeong-Su HA ,  Sangbong PARK ,  Kwang Soo KIM ,  Byeong Kyu CHA

IPC: H01L21/66 ,  G01N21/88 ,  G01N21/95 ,  G06T7/00 ,  H04N7/18

CPC classification number: H01L22/20 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8887 ,  G06T7/0004 ,  G06T2207/10056 ,  G06T2207/30148 ,  H01L22/12 ,  H04N7/181

Abstract: Disclosed are an inspection apparatus and a method of manufacturing a semiconductor device using the same. The inspection apparatus includes a stage configured to receive a substrate, an objective lens on the stage and configured to enlarge the substrate optically, an ocular lens on the objective lens and configured to form at its image plane an image of the substrate, and a plurality of sensors above the ocular lens and in the image plane of the ocular lens.

公开(公告)号：US20240304501A1

公开(公告)日：2024-09-12

申请号：US18382998

申请日：2023-10-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jhong Kwon KIM ,  Yong Ju JEON ,  Ki Hun KIM ,  Da Young MYOUNG ,  Jeong-Su HA

IPC: H01L21/66 ,  G01N21/95

CPC classification number: H01L22/12 ,  G01N21/9501

Abstract: A method for fabricating a semiconductor device is provided. The method for fabricating the semiconductor device includes a first step of loading a first wafer including a plurality of semiconductor chips having the same pattern on a stage of a wafer inspection apparatus, a second step of inspecting the plurality of semiconductor chips using light having different wavelengths from each other, and a third step of unloading the first wafer from the stage of the wafer inspection apparatus, wherein inspecting of the plurality of semiconductor chips using the light includes inspecting patterns at the same first positions of the respective semiconductor chips, inspecting patterns at the same second positions of the respective semiconductor chips, inspecting patterns at the same k-th positions of the respective semiconductor chips, and determining the semiconductor chip having a pattern defect by combining pattern inspection results at each of the first to k-th positions.