公开(公告)号：US20140177186A1

公开(公告)日：2014-06-26

申请号：US14138220

申请日：2013-12-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Kwang SONG ,  Sung-Won PARK ,  Yong-Lak CHO

IPC: H05K9/00

CPC classification number: H04M1/0277 ,  H04B1/3888 ,  H04M1/19 ,  H05K9/0039

Abstract: An electronic device is provided including a mainboard having a ground; a conductive bracket coupled to the mainboard; and an elastic member coupled to the mainboard, and electrically connected with the ground of the mainboard; wherein the elastic member is in elastic contact with the conductive bracket; and wherein the elastic member is electrically connected to the conductive bracket.

Abstract translation: 提供一种电子设备，包括具有地面的主板; 耦合到主板的导电支架; 以及弹性构件，其联接到所述主板，并且与所述主板的地面电连接; 其中所述弹性构件与所述导电支架弹性接触; 并且其中所述弹性构件电连接到所述导电支架。