公开(公告)号：US20170020012A1

公开(公告)日：2017-01-19

申请号：US15184292

申请日：2016-06-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Won PARK ,  Seungyup LEE ,  Sangil LEE ,  Won-Jea JANG

IPC: H05K5/02 ,  H05K5/00 ,  H04M1/18 ,  H01G2/10 ,  H04B1/3888 ,  H04M1/02 ,  G06F1/16 ,  H05K5/04

CPC classification number: H05K5/0247 ,  G06F1/1656 ,  H01G2/106 ,  H01G4/01 ,  H01G4/224 ,  H01G4/228 ,  H01M10/4264 ,  H01M16/00 ,  H04B1/3888 ,  H04M1/0277 ,  H04M1/185 ,  H05K5/0013 ,  H05K5/04 ,  H05K2201/0999

Abstract: An electronic device is provided. The electronic device includes a first metal plate of a metal bezel that forms the external appearance of the electronic device, a second metal plate that overlaps the first metal plate while being spaced apart from the first metal plate, a dielectric member interposed between the first metal plate and the second metal plate, and a substrate electrically connected to a contact terminal of the second metal plate to feed power. Other embodiments are possible.

Abstract translation: 提供电子设备。 电子设备包括形成电子设备的外观的金属边框的第一金属板，与第一金属板重叠的第二金属板，同时与第一金属板间隔开;电介质构件，介于第一金属 板和第二金属板，以及电连接到第二金属板的接触端子以供电的基板。 其他实施例是可能的。

公开(公告)号：US20140318851A1

公开(公告)日：2014-10-30

申请号：US14260708

申请日：2014-04-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Jea JANG ,  Dong-In HA ,  Jin-Young KWAK ,  Gi-Heung KIM ,  Jung-Yoon SEO ,  Jae-Joon YOO ,  Byoung-Hee LEE ,  Sung-Jin CHOI

IPC: H05K9/00

CPC classification number: H05K9/0035 ,  H05K9/0028

Abstract: A shield reinforcing apparatus is provided. The shield reinforcing apparatus includes a printed circuit board, a shield member that covers the printed circuit board, and at least one shield reinforcing part provided in the printed circuit board and configured to contact the shield member to be pressed.

Abstract translation: 提供了屏蔽加强装置。 屏蔽增强装置包括印刷电路板，覆盖印刷电路板的屏蔽构件和设置在印刷电路板中并被配置为接触要被按压的屏蔽构件的至少一个屏蔽加强部。