公开(公告)号：US20160242291A1

公开(公告)日：2016-08-18

申请号：US15045480

申请日：2016-02-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Won PARK ,  Dong-Kyun YU ,  Ji-Heon YU ,  Seung-Yup LEE ,  Taek-Kyun CHOI

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0259 ,  H05K2201/10015

Abstract: Various embodiments related to a printed circuit board in which a capacitor is embedded are described. The capacitor may include: a plurality of first conductive layers that have a plurality of first via holes; a plurality of second conductive layers that have a plurality of second via holes, wherein the first and second conductive layers are alternately arranged in turns; and a plurality of dielectric layers that are arranged between the first and second conductive layers. Other various embodiments are possible.

Abstract translation: 描述与其中嵌入电容器的印刷电路板有关的各种实施例。 电容器可以包括：具有多个第一通孔的多个第一导电层; 具有多个第二通孔的多个第二导电层，其中所述第一和第二导电层依次交替布置; 以及布置在第一和第二导电层之间的多个电介质层。 其他各种实施例是可能的。