Semiconductor device
    1.
    发明授权

    公开(公告)号:US10522682B2

    公开(公告)日:2019-12-31

    申请号:US15869522

    申请日:2018-01-12

    Abstract: A semiconductor device is provided. The semiconductor device includes a fin type pattern, a field insulating film on a part of a sidewall of the fin-type pattern, and a gate electrode intersecting with the fin-type pattern, on the fin-type pattern and the field insulating film. The gate electrode on the field insulating film includes a first portion, a second portion, and a third portion on the field insulating film. A first width of the first portion increases as a first distance from the field insulating film, increases width of the second portion decreases as a second distance from the field insulating film increases, and a third width of the third portion increases or is substantially constant as a third distance from the field insulating film increases.

    METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
    3.
    发明申请
    METHOD OF FABRICATING A SEMICONDUCTOR DEVICE 有权
    制造半导体器件的方法

    公开(公告)号:US20160293417A1

    公开(公告)日:2016-10-06

    申请号:US14965255

    申请日:2015-12-10

    Abstract: Provided is a method of fabricating a semiconductor device. The method includes forming an anti-reflection layer on a lower layer, forming photoresist patterns on the anti-reflection layer, forming protection patterns to cover the photoresist patterns, respectively, etching the anti-reflection layer using the photoresist patterns covered with the protection patterns as an etch mask to form anti-reflection patterns, forming spacers to cover sidewalls of the anti-reflection patterns, and removing the anti-reflection patterns.

    Abstract translation: 提供一种制造半导体器件的方法。 该方法包括在下层上形成抗反射层,在抗反射层上形成光致抗蚀剂图案,分别形成保护图案以覆盖光致抗蚀剂图案,使用被保护图案覆盖的光刻胶图案蚀刻抗反射层 作为蚀刻掩模以形成抗反射图案,形成隔离物以覆盖抗反射图案的侧壁,以及去除防反射图案。

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