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公开(公告)号：US20150155210A1
公开(公告)日：2015-06-04
申请号：US14337571
申请日：2014-07-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Byung Joon LEE , Masato KAJINAMI , Yoshiaki YUKIMORI , Sang-Yoon KIM , Hui-Jae KIM , Byeong-Kuk PARK , Seung Dae SEOK , Jae Bong SHIN , Byeong Kap CHOI
CPC classification number: H01L21/67259 , H01L21/67109 , H01L21/67144 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/73204 , H01L2224/75502 , H01L2224/7565 , H01L2224/75753 , H01L2224/75824 , H01L2224/7598 , H01L2224/81127 , H01L2224/81204 , H01L2224/81801 , H01L2224/83127 , H01L2224/83204 , H01L2224/8385 , H01L2224/92125 , H05K13/046 , H01L2924/00012 , H01L2924/00014
Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.
Abstract translation: 半导体制造装置可以包括：拾取单元，被配置为拾取半导体制造装置的第一区域中的芯片; 接合头，被配置为接收所拾取的芯片并且被配置为在所述半导体制造装置的第二区域中从所述第一区域移动到电路板的顶部; 和/或配置成在从第一区域移动到第二区域时检测电路板上的接合位置的光学单元。 半导体制造装置可以包括：接合头，包括用于加热芯片并将芯片接合到电路板上的加热器; 和/或与加热器相邻的冷却块，冷却液通过该冷却块流动。 当加热器产生热量时，冷却液体可从冷却块移除。 冷却液可以在加热器被冷却时供应到冷却块。
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公开(公告)号：US20240183657A1
公开(公告)日：2024-06-06
申请号：US18527700
申请日：2023-12-04
Applicant: Samsung Electronics Co., Ltd.
Inventor： Daisuke NAGATOMO , Shinji UEYAMA , Takamasa SUGIURA , Euisun CHOI , Fumitaka MOROISHI , Masanori IZUMITA , Takahiro TOKUMIYA , Tatsuya ISHIMOTO , Masato KAJINAMI
IPC: G01B11/30
CPC classification number: G01B11/303 , G01B11/306
Abstract: An optical device includes a monochromatic light source, a light distribution switching portion configured to transmit monochromatic light emitted from the monochromatic light source in one fan-shaped region among a plurality of fan-shaped regions centered on a central optical axis and block the monochromatic light in other fan-shaped regions, an objective lens, an aperture stop configured to collect reflected light from the object, an imaging lens, which has passed through the aperture stop, a light receiver on an imaging plane formed by the imaging lens and configured to receive the reflected light from the object and photoelectrically convert the received reflected light, and a controller configured to instruct the light distribution switching portion to change a region transmitting light over time, and calculate a normal direction of the object based on an electrical signal photoelectrically converted by the light receiver.
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3.发明申请公开(公告)号：US20200209164A1
公开(公告)日：2020-07-02
申请号：US16678226
申请日：2019-11-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Shinji UEYAMA , Fumitaka MOROISHI , Masato KAJINAMI
Abstract: A method for adjusting inclination between wafers may include providing a first infrared light onto a first grid pattern in a first region in a first wafer and a second grid pattern in a second wafer, the first and second grid patterns overlapping, calculating a first distance in the first region between the first and second wafers based on a first Moiré pattern from the overlapping first and second grid patterns, providing a second infrared light onto a third grid pattern in a second region in the first wafer and a fourth grid pattern in the second wafer, the third and fourth grid patterns overlapping, calculating a second distance in the second region between the first and second wafers based on a second Moiré pattern from the overlapping third and fourth grid patterns, and adjusting relative inclination between the first and second wafers based on the first and second distances.
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公开(公告)号：US20240186278A1
公开(公告)日：2024-06-06
申请号：US18457785
申请日：2023-08-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Masato KAJINAMI , Hansung CHO , Kazuya ONO , Byeongjin KIM , Daisuke NAGATOMO , Fumitaka MOROISHI , Masanori IZUMITA , Sungmin AHN
CPC classification number: H01L24/74 , H01L21/67259 , H01L21/681 , H01L24/80 , H01L2224/74 , H01L2224/80895 , H01L2924/40
Abstract: Provided are mounting devices and mounting methods configured to realize high-precision mounting. A mounting device including a bonding actuator having a housing, a slider accommodated in the housing in a non-contact state and provided with a head, a coil and a yoke in a non-contact state, two voice coil motors (VCMs) driven in an X-axis direction, three VCMs driven in a Y-axis direction, and one VCM driven in a Z-axis direction may be provided. The coil may be fixed to the housing and the yoke may be fixed to the slider. The bonding actuator may perform bonding while adjusting a relative position and parallelism of a chip and a wafer, by driving the slider in six axial directions, which include the X-axis direction, the Y-axis direction, the Z-axis direction, a Tx direction, a Ty direction, and a Tz direction.
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公开(公告)号：US20220157633A1
公开(公告)日：2022-05-19
申请号：US17385095
申请日：2021-07-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Masato KAJINAMI , Takamasa SUGIURA , Fumitaka MOROISHI
IPC: H01L21/68 , H01L21/683
Abstract: A wafer bonding apparatus may include a first chuck, a second chuck, and a pressure device. The first chuck may include a hole formed through a central portion of the first chuck. The second chuck may have a hole formed through a central portion of the second chuck. The pressure device may be configured to pressurize a wafer toward the second chuck through the holes. An air bearing may be interposed between the pressure device and the first chuck to suppress a dislocation of the pressure device.
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Patent Agency Ranking
公开(公告)号：US20230369078A1
公开(公告)日：2023-11-16
申请号：US18105653
申请日：2023-02-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Tatsuya ISHIMOTO , Fumitaka MOROISHI , Masato KAJINAMI
IPC: H01L21/67 , H01L21/683
CPC classification number: H01L21/67132 , H01L21/6838 , H01L21/67242
Abstract: A chip peeling apparatus is provided that includes a housing having a seating surface for mounting a wafer, a recessed portion and a first vacuum suction hole in the seating surface, and a second vacuum suction hole, a blow hole and a protrusion in the recessed portion. The chip peeling apparatus further includes: a vacuum suction source that evacuates the first vacuum suction hole and the second vacuum suction hole; a pressure detector that detects a degree of vacuum of the second vacuum suction hole; a pressurization source that sends a fluid to the blow hole; a flow rate control valve; and a controller that determines a flow rate of the fluid to be sent to the blow hole, based on the degree of vacuum, and controls, via the flow rate control valve, the fluid sent from the pressurization source to flow at the determined flow rate.
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公开(公告)号：US20230178394A1
公开(公告)日：2023-06-08
申请号：US18062830
申请日：2022-12-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Tatsuya ISHIMOTO , Naoyuki TAKADA , Takahiro TOKUMIYA , Masato KAJINAMI
IPC: H01L21/67
CPC classification number: H01L21/67132
Abstract: A chip peeling apparatus may include a peeling device. The peeling device may include a plurality of vacuum adsorption holes and a plurality of first air blow holes arranged around the plurality of vacuum adsorption holes. The peeling device may be configured to peel a chip off a tape when the peeling device is arranged below a region of the tape on which the chip is attached, vacuum pressure is applied through the plurality of vacuum adsorption holes to adsorb the peeling device to the region of the tape, and a first air blow is directed through the plurality of first air blow holes to the region of the tape.
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公开(公告)号：US20150159681A1
公开(公告)日：2015-06-11
申请号：US14562179
申请日：2014-12-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Masato KAJINAMI , Fumitaka MOROISHI , Keiji MURATA , Shinji UEYAMA , Tatsuya ISHIMOTO , Yoshiaki YUKIMORI
CPC classification number: F15B15/088 , F15B15/063 , F15B15/1452 , F15B15/1461 , F15B15/2846 , F15B15/2876 , F15B2211/6336 , F15B2211/665 , F15B2211/6651 , F15B2211/8855
Abstract: A fluid pressure actuator including a fluid pressure cylinder having a first position detector and a second position detector, a piston body having a piston head and a rod, the piston head mounted on the rod and slidably accommodated in the fluid pressure cylinder, the rod including a first scale and a second scale, the first scale facing the first position detector and the first position detector configured to detect a position in a sliding direction of the piston body, the second scale facing the second position detector and the second position detector configured to detect a position of the rod in a rotation direction of the piston body, and a controller configured to perform a first positioning control of a position of the rod in the sliding direction and a second positioning control of the rod in the rotation direction may be provided.
Abstract translation: 一种流体压力致动器，包括具有第一位置检测器和第二位置检测器的流体压力缸，具有活塞头和杆的活塞体，所述活塞头安装在所述杆上并可滑动地容纳在所述流体压力缸中，所述杆包括 第一刻度和第二刻度，所述第一刻度面向所述第一位置检测器和所述第一位置检测器，所述第一位置检测器被配置为检测所述活塞体的滑动方向上的位置，所述第二刻度尺面向所述第二位置检测器，所述第二位置检测器被配置为 检测杆在活塞体的旋转方向上的位置，并且可以设置用于执行杆在滑动方向上的位置的第一定位控制和杆沿旋转方向的第二定位控制的控制器 。
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公开(公告)号：US20220139755A1
公开(公告)日：2022-05-05
申请号：US17375263
申请日：2021-07-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Naoyuki TAKADA , Masato KAJINAMI , Tatsuya ISHIMOTO
IPC: H01L21/683
Abstract: A semiconductor manufacturing apparatus comprises an adsorption unit defining a plurality of pressing holes in the adsorption unit, the plurality of pressing holes configured to eject gas, and defining a plurality of suction holes in the adsorption unit, the plurality of suction holes configured to suction the gas and to handle a semiconductor chip through the gas. At least one of the suction holes is adjacent to at least one of an apex of the adsorption unit or an edge of the adsorption unit.
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公开(公告)号：US20200217805A1
公开(公告)日：2020-07-09
申请号：US16583434
申请日：2019-09-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Takamasa SUGIURA , Fumitaka MOROISHI , Masato KAJINAMI
Abstract: A wafer measurement apparatus for measuring a bonding strength of a bonded wafer includes a wafer holder to hold a bonded wafer into which a blade is inserted and where a crack occurs, a lighting assembly including a light source, a light source controller to select the light source of the lighting assembly for detection of the crack reflected in the bonded wafer, on photographing conditions, a photographing assembly to photograph the bonded wafer by using the photographing conditions corresponding to a wavelength of the light source, on sensitivity of the wavelength of the light source, and a calculator to select one photographing condition, transmit the selected photographing condition, and calculate bonding strength, on a crack distance from a blade edge, extracted from an image of the bonded wafer, to a crack edge.
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