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    WATER MEASUREMENT APPARATUS
    2.
    发明申请
    WATER MEASUREMENT APPARATUS 审中-公开

    公开(公告)号：US20200217805A1

    公开(公告)日：2020-07-09

    申请号：US16583434

    申请日：2019-09-26

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Takamasa SUGIURA ,  Fumitaka MOROISHI ,  Masato KAJINAMI

    IPC: G01N21/95 ,  H01L21/687 ,  H01L21/67 ,  G01N21/64 ,  G01N21/88 ,  H04N5/235 ,  H04N5/225 ,  G06T7/00

    Abstract: A wafer measurement apparatus for measuring a bonding strength of a bonded wafer includes a wafer holder to hold a bonded wafer into which a blade is inserted and where a crack occurs, a lighting assembly including a light source, a light source controller to select the light source of the lighting assembly for detection of the crack reflected in the bonded wafer, on photographing conditions, a photographing assembly to photograph the bonded wafer by using the photographing conditions corresponding to a wavelength of the light source, on sensitivity of the wavelength of the light source, and a calculator to select one photographing condition, transmit the selected photographing condition, and calculate bonding strength, on a crack distance from a blade edge, extracted from an image of the bonded wafer, to a crack edge.

    OPTICAL DEVICE AND OPTICAL MEASUREMENT METHOD
    3.
    发明公开
    OPTICAL DEVICE AND OPTICAL MEASUREMENT METHOD 审中-公开

    公开(公告)号：US20240183657A1

    公开(公告)日：2024-06-06

    申请号：US18527700

    申请日：2023-12-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Daisuke NAGATOMO ,  Shinji UEYAMA ,  Takamasa SUGIURA ,  Euisun CHOI ,  Fumitaka MOROISHI ,  Masanori IZUMITA ,  Takahiro TOKUMIYA ,  Tatsuya ISHIMOTO ,  Masato KAJINAMI

    IPC: G01B11/30

    CPC classification number: G01B11/303 ,  G01B11/306

    Abstract: An optical device includes a monochromatic light source, a light distribution switching portion configured to transmit monochromatic light emitted from the monochromatic light source in one fan-shaped region among a plurality of fan-shaped regions centered on a central optical axis and block the monochromatic light in other fan-shaped regions, an objective lens, an aperture stop configured to collect reflected light from the object, an imaging lens, which has passed through the aperture stop, a light receiver on an imaging plane formed by the imaging lens and configured to receive the reflected light from the object and photoelectrically convert the received reflected light, and a controller configured to instruct the light distribution switching portion to change a region transmitting light over time, and calculate a normal direction of the object based on an electrical signal photoelectrically converted by the light receiver.

    WAFER BONDING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND APPARATUS THEREFOR
    4.
    发明申请
    WAFER BONDING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND APPARATUS THEREFOR 审中-公开

    公开(公告)号：US20200209164A1

    公开(公告)日：2020-07-02

    申请号：US16678226

    申请日：2019-11-08

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Shinji UEYAMA ,  Fumitaka MOROISHI ,  Masato KAJINAMI

    IPC: G01N21/95 ,  H01L21/68 ,  G03F9/00

    Abstract: A method for adjusting inclination between wafers may include providing a first infrared light onto a first grid pattern in a first region in a first wafer and a second grid pattern in a second wafer, the first and second grid patterns overlapping, calculating a first distance in the first region between the first and second wafers based on a first Moiré pattern from the overlapping first and second grid patterns, providing a second infrared light onto a third grid pattern in a second region in the first wafer and a fourth grid pattern in the second wafer, the third and fourth grid patterns overlapping, calculating a second distance in the second region between the first and second wafers based on a second Moiré pattern from the overlapping third and fourth grid patterns, and adjusting relative inclination between the first and second wafers based on the first and second distances.

    CHIP PEELING APARATUS AND CHIP PEELING METHOD
    5.
    发明公开
    CHIP PEELING APARATUS AND CHIP PEELING METHOD 审中-公开

    公开(公告)号：US20230369078A1

    公开(公告)日：2023-11-16

    申请号：US18105653

    申请日：2023-02-03

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Tatsuya ISHIMOTO ,  Fumitaka MOROISHI ,  Masato KAJINAMI

    IPC: H01L21/67 ,  H01L21/683

    CPC classification number: H01L21/67132 ,  H01L21/6838 ,  H01L21/67242

    Abstract: A chip peeling apparatus is provided that includes a housing having a seating surface for mounting a wafer, a recessed portion and a first vacuum suction hole in the seating surface, and a second vacuum suction hole, a blow hole and a protrusion in the recessed portion. The chip peeling apparatus further includes: a vacuum suction source that evacuates the first vacuum suction hole and the second vacuum suction hole; a pressure detector that detects a degree of vacuum of the second vacuum suction hole; a pressurization source that sends a fluid to the blow hole; a flow rate control valve; and a controller that determines a flow rate of the fluid to be sent to the blow hole, based on the degree of vacuum, and controls, via the flow rate control valve, the fluid sent from the pressurization source to flow at the determined flow rate.

    FLUID PRESSURE ACTUATOR
    6.
    发明申请
    FLUID PRESSURE ACTUATOR 有权
    流体压力执行器

    公开(公告)号：US20150159681A1

    公开(公告)日：2015-06-11

    申请号：US14562179

    申请日：2014-12-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Masato KAJINAMI ,  Fumitaka MOROISHI ,  Keiji MURATA ,  Shinji UEYAMA ,  Tatsuya ISHIMOTO ,  Yoshiaki YUKIMORI

    IPC: F15B15/28 ,  F15B15/06

    CPC classification number: F15B15/088 ,  F15B15/063 ,  F15B15/1452 ,  F15B15/1461 ,  F15B15/2846 ,  F15B15/2876 ,  F15B2211/6336 ,  F15B2211/665 ,  F15B2211/6651 ,  F15B2211/8855

    Abstract: A fluid pressure actuator including a fluid pressure cylinder having a first position detector and a second position detector, a piston body having a piston head and a rod, the piston head mounted on the rod and slidably accommodated in the fluid pressure cylinder, the rod including a first scale and a second scale, the first scale facing the first position detector and the first position detector configured to detect a position in a sliding direction of the piston body, the second scale facing the second position detector and the second position detector configured to detect a position of the rod in a rotation direction of the piston body, and a controller configured to perform a first positioning control of a position of the rod in the sliding direction and a second positioning control of the rod in the rotation direction may be provided.

    Abstract translation: 一种流体压力致动器，包括具有第一位置检测器和第二位置检测器的流体压力缸，具有活塞头和杆的活塞体，所述活塞头安装在所述杆上并可滑动地容纳在所述流体压力缸中，所述杆包括 第一刻度和第二刻度，所述第一刻度面向所述第一位置检测器和所述第一位置检测器，所述第一位置检测器被配置为检测所述活塞体的滑动方向上的位置，所述第二刻度尺面向所述第二位置检测器，所述第二位置检测器被配置为 检测杆在活塞体的旋转方向上的位置，并且可以设置用于执行杆在滑动方向上的位置的第一定位控制和杆沿旋转方向的第二定位控制的控制器 。

    WAFER BONDING APPARATUS
    8.
    发明申请
    WAFER BONDING APPARATUS 有权

    公开(公告)号：US20220157633A1

    公开(公告)日：2022-05-19

    申请号：US17385095

    申请日：2021-07-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Masato KAJINAMI ,  Takamasa SUGIURA ,  Fumitaka MOROISHI

    IPC: H01L21/68 ,  H01L21/683

    Abstract: A wafer bonding apparatus may include a first chuck, a second chuck, and a pressure device. The first chuck may include a hole formed through a central portion of the first chuck. The second chuck may have a hole formed through a central portion of the second chuck. The pressure device may be configured to pressurize a wafer toward the second chuck through the holes. An air bearing may be interposed between the pressure device and the first chuck to suppress a dislocation of the pressure device.

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