公开(公告)号：US20240186278A1

公开(公告)日：2024-06-06

申请号：US18457785

申请日：2023-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Masato KAJINAMI ,  Hansung CHO ,  Kazuya ONO ,  Byeongjin KIM ,  Daisuke NAGATOMO ,  Fumitaka MOROISHI ,  Masanori IZUMITA ,  Sungmin AHN

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68

CPC classification number: H01L24/74 ,  H01L21/67259 ,  H01L21/681 ,  H01L24/80 ,  H01L2224/74 ,  H01L2224/80895 ,  H01L2924/40

Abstract: Provided are mounting devices and mounting methods configured to realize high-precision mounting. A mounting device including a bonding actuator having a housing, a slider accommodated in the housing in a non-contact state and provided with a head, a coil and a yoke in a non-contact state, two voice coil motors (VCMs) driven in an X-axis direction, three VCMs driven in a Y-axis direction, and one VCM driven in a Z-axis direction may be provided. The coil may be fixed to the housing and the yoke may be fixed to the slider. The bonding actuator may perform bonding while adjusting a relative position and parallelism of a chip and a wafer, by driving the slider in six axial directions, which include the X-axis direction, the Y-axis direction, the Z-axis direction, a Tx direction, a Ty direction, and a Tz direction.

公开(公告)号：US20180076058A1

公开(公告)日：2018-03-15

申请号：US15481686

申请日：2017-04-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Hyun PARK ,  Kazuya ONO ,  Jung Jae KIM

IPC: H01L21/67 ,  B08B1/04 ,  B08B3/02

CPC classification number: H01L21/67046 ,  B08B1/04 ,  B08B3/02 ,  B08B2203/0288 ,  G03F7/70716 ,  G03F7/70758 ,  H01L21/67051

Abstract: A substrate processing apparatus includes a substrate stage that supports a substrate, a follower stage disposed on a same plane as the substrate stage, a first driving unit that moves the follower stage in parallel with a first direction, and a second driving unit that moves the substrate stage in parallel with the first direction. The second driving unit includes a voice magnet member disposed on the substrate stage, and a voice coil member disposed on the follower stage and spaced apart from the voice magnet member.

公开(公告)号：US20240139972A1

公开(公告)日：2024-05-02

申请号：US18206635

申请日：2023-06-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daeho Min ,  Minwoo Rhee ,  Juno Kim ,  Kazuya ONO ,  Kangsan Lee ,  Kyeongbin Lim

IPC: B25J15/06 ,  B25J11/00

CPC classification number: B25J15/0658 ,  B25J11/0095

Abstract: A non-contact type gripper may include a gripping plate, a plurality of blowing holes, a plurality of suction holes and a cavity. The blowing holes may be formed at the gripping plate to inject a gas to an object. The suction holes may be formed at the gripping plate to suck the gas. The cavity may be extended from at least one of the blowing holes to suppress a pressure drop of the gas. The gas flowing through the cavities extended from the corner suction hole and the blowing holes between the adjacent suction holes may receive a low flow resistance. Thus, a pressure drop of the gas injected from the blowing holes may be suppressed by the cavities to maintain a pressure of the gas, thereby preventing a deflection of the corner portion of the object such as the semiconductor chip by a strong suction force. As a result, the non-contact type gripper may grip the object in the non-contact manner to prevent a contamination of the object.