SPUTTERING APPARATUS AND METHOD OF MANUFACTURING MAGNETIC MEMORY DEVICE USING THE SAME

    公开(公告)号:US20190136368A1

    公开(公告)日:2019-05-09

    申请号:US15980348

    申请日:2018-05-15

    Abstract: Provided are sputtering apparatuses and methods of manufacturing magnetic memory devices. The sputtering apparatus includes a process chamber, a stage in the process chamber and configured to load a substrate thereon, and a first sputter gun above the substrate in the process chamber. The first sputter gun is horizontally spaced apart from the substrate. The first sputter gun includes a first target including a first end and a second end, the first end being horizontally closer to the substrate than the second end. A first surface of the first target is inclined relative to a top surface of the substrate. A height of the second end of the first target relative to the top surface of the substrate is greater than that of the first end of the first target.

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