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公开(公告)号:US20210020695A1
公开(公告)日:2021-01-21
申请号:US16789546
申请日:2020-02-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junghoon BAK , Woojin KIM , Junghwan MOON , Seowon LEE , Nayoung JI
Abstract: A variable resistance memory device includes a first conductive line, a bipolar selection device on the first conductive line and electrically connected to the first conductive line, a second conductive line on the first conductive line and electrically connected to the bipolar selection device, a variable resistance layer on the second conductive line and electrically connected to the second conductive line, and a third conductive line on the variable resistance layer and electrically connected to the variable resistance layer.
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公开(公告)号:US20210050508A1
公开(公告)日:2021-02-18
申请号:US16829216
申请日:2020-03-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seowon LEE , Junghwan MOON , Junghoon BAK , Woojin KIM , Hyeongsun HONG
Abstract: A magnetic memory device includes a device isolation layer on a substrate and defining an active region, a source region and a drain region apart from each other in the active region of the substrate, a channel portion in the active region of the substrate and between the source region and the drain region, a spin orbit torque (SOT)-inducing layer on the channel portion of the substrate, a magnetic tunnel junction (MTJ) structure on the SOT-inducing layer, the MTJ structure including a free layer on the SOT-inducing layer, a tunnel barrier layer on the free layer, and a pinned layer on the tunnel barrier, a word line on the MTJ structure, a source line electrically connected to the source region, and a bit line electrically connected to the drain region.
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公开(公告)号:US20220350256A1
公开(公告)日:2022-11-03
申请号:US17672937
申请日:2022-02-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Byunghoon LEE , Maenghyo CHO , Changyoung JEONG , Muyoung KIM , Junghwan MOON , Sungwoo PARK , Hyungwoo LEE
IPC: G03F7/20 , G03F7/40 , H01L21/027 , G05B19/4099 , G06F30/25
Abstract: A lithography method using a multiscale simulation includes estimating a shape of a virtual resist pattern for a selected resist based on a multiscale simulation; forming a test resist pattern by performing an exposure process on a layer formed of the selected resist; determining whether an error range between the test resist pattern and the virtual resist pattern is in an allowable range; and forming a resist pattern on a patterning object using the selected resist when the error range is in the allowable range. The multiscale simulation may use molecular scale simulation, quantum scale simulation, and a continuum scale simulation, and may model a unit lattice cell of the resist by mixing polymer chains, a photo-acid generator (PAG), and a quencher.
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公开(公告)号:US20240204737A1
公开(公告)日:2024-06-20
申请号:US18380460
申请日:2023-10-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junghwan MOON , Youngyoon Woo , Minsik Jun
CPC classification number: H03F3/245 , H03F1/3241 , H04B1/0475 , H03F2200/451 , H04B2001/0425
Abstract: An electronic device may include: a processor; a power amplifier; a power supply configured to supply power to the power amplifier; a crest factor reduction (CFR) module; and a digital predistortion (DPD) module, wherein the processor is configured to: transmit a first radio frequency (RF) signal, based on a first state of each of the CFR module, the DPD module, and the power supply, in a first transmission interval, the first RF signal being generated from a first baseband signal; identify voltage information of a second RF signal associated with a second transmission interval after the first transmission interval; change a state of each of the CFR module, the DPD module, and the power supply from the first state to a second state, based on the voltage information, in a first reception interval between the first transmission interval and the second transmission interval; and transmit the second RF signal generated from a second baseband signal based on the second state of each of the CFR module, the DPD module, and the power supply, in the second transmission interval.
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