公开(公告)号：US11948814B2

公开(公告)日：2024-04-02

申请号：US17747270

申请日：2022-05-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kangmin Park ,  Hyungho Kim ,  Dongwoo Wi ,  Hyunsoo Chun ,  Jiho Uh

IPC: H01L21/67 ,  F16K3/18 ,  F16K3/314 ,  F16K51/02 ,  H01L21/677 ,  F16K3/02

CPC classification number: H01L21/67126 ,  F16K51/02 ,  H01L21/67017 ,  H01L21/67739 ,  F16K3/0281 ,  F16K3/18 ,  F16K3/314

Abstract: A process chamber door for closing or opening an entrance of a process chamber through which a substrate to be process is loaded includes a seal plate including a front surface and a rear surface opposite to each other in a first direction, a connection block connected to the rear surface of the seal plate and including a central portion and two side portions connected to the rear surface of the seal plate, and a shaft connected to the central portion of the connection block. The connection block includes a first hinge groove and a second hinge groove. The first hinge groove is exposed at a bottom surface and a side surface of the connection block and the second hinge groove is exposed at an upper surface and the side surface of the connection block.

公开(公告)号：US20240213053A1

公开(公告)日：2024-06-27

申请号：US18601017

申请日：2024-03-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kangmin Park ,  Hyungho Kim ,  Dongwoo Wi ,  Hyunsoo Chun ,  Jiho Uh

IPC: H01L21/67 ,  F16K3/02 ,  F16K3/18 ,  F16K3/314 ,  F16K51/02 ,  H01L21/677

CPC classification number: H01L21/67126 ,  F16K51/02 ,  H01L21/67017 ,  H01L21/67739 ,  F16K3/0281 ,  F16K3/18 ,  F16K3/314

Abstract: A process chamber door for closing or opening an entrance of a process chamber through which a substrate to be process is loaded includes a seal plate including a front surface and a rear surface opposite to each other in a first direction, a connection block connected to the rear surface of the seal plate and including a central portion and two side portions connected to the rear surface of the seal plate, and a shaft connected to the central portion of the connection block. The connection block includes a first hinge groove and a second hinge groove. The first hinge groove is exposed at a bottom surface and a side surface of the connection block and the second hinge groove is exposed at an upper surface and the side surface of the connection block.

公开(公告)号：US11476151B2

公开(公告)日：2022-10-18

申请号：US16825352

申请日：2020-03-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byounghoon Ji ,  Seoyoung Maeng ,  Minjoon Kim ,  Jongyong Bae ,  Jiho Uh ,  Hongtaek Lim ,  Donghoon Han

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687

Abstract: A vacuum chuck includes a pedestal including a first surface on which a substrate may be mounted. The first surface of the substrate may include a vacuum hole to provide a vacuum pressure below the substrate, a vacuum groove connected to the vacuum hole, and a gas hole surrounding the vacuum groove to transmit a bottom gas to the substrate. A vacuum pipe may be provided to connect to the vacuum hole, and a gas pipe may be provided to connect to the gas hole. The diameter of the vacuum hole may be about 2 to about 3 micrometers, and a width of the vacuum groove may be about 1.6 to about 2.5 micrometers.

公开(公告)号：US20210074574A1

公开(公告)日：2021-03-11

申请号：US16825352

申请日：2020-03-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byounghoon Ji ,  Seoyoung Maeng ,  Minjoon Kim ,  Jongyong Bae ,  Jiho Uh ,  Hongtaek Lim ,  Donghoon Han

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/67

Abstract: A vacuum chuck includes a pedestal including a first surface on which a substrate may be mounted. The first surface of the substrate may include a vacuum hole to provide a vacuum pressure below the substrate, a vacuum groove connected to the vacuum hole, and a gas hole surrounding the vacuum groove to transmit a bottom gas to the substrate. A vacuum pipe may be provided to connect to the vacuum hole, and a gas pipe may be provided to connect to the gas hole. The diameter of the vacuum hole may be about 2 to about 3 micrometers, and a width of the vacuum groove may be about 1.6 to about 2.5 micrometers.

公开(公告)号：US20240370043A1

公开(公告)日：2024-11-07

申请号：US18652866

申请日：2024-05-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghun Kim ,  Minjung Kim ,  Taemin Kim ,  Jiho Uh ,  Jinseok Lee ,  Geongu Jang

IPC: G05D7/06 ,  H01L21/67

Abstract: A method of manufacturing using a mass flow controller (MFC) includes closing a valve installed in a flow path of the MFC to prevent a fluid from flowing therein due to a closure of the valve, determining that the fluid is not leaking, determining that the fluid is stabilized, determining that a pressure sensor is normal, calculating a zero point calibration value of the pressure sensor based on a zero point of the pressure sensor, a time when power is supplied to the MFC, and a time when a flow is supplied to the MFC, applying the zero point calibration value to the pressure sensor, and measure the mass flow rate through the flow path with the pressuring sensor and adjusting the valve based on the mass flow rate to regulate the flow of the fluid to a manufacturing device.

公开(公告)号：US20240183702A1

公开(公告)日：2024-06-06

申请号：US18519696

申请日：2023-11-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghun Kim ,  Kyungho Kang ,  Seungmin Ryu ,  Donghoon Park ,  Minseok Seo ,  Jiho Uh ,  Seunglae Cho

IPC: G01F25/00 ,  G01F25/10

CPC classification number: G01F25/0084 ,  G01F25/10

Abstract: A method of calibrating a zero point of a mass flow control device includes closing a valve installed in a main flow path of the mass flow control device to block the main flow path and prevent a fluid from flowing in the main flow path, determining, based on a pressure value measured using a pressure meter installed in the main flow path, whether the fluid has stopped flowing, determining, based on a flowrate value measured by a flowrate sensor provided on a sensor flow path connected to the main flow path, whether the fluid is stable, calculating a zero point calibration value based on a temperature value of the fluid measured by a thermometer installed in the main flow path and the flowrate value measured by the flowrate sensor, and applying the zero point calibration value to a zero point of the flowrate sensor.

公开(公告)号：US20230360881A1

公开(公告)日：2023-11-09

申请号：US18139639

申请日：2023-04-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwangyoung Jung ,  Youngmin Min ,  Jungan Kwon ,  Gillhoon Shin ,  Keechun Shim ,  Daeseong Ha ,  Kyoungsuk Kim ,  Seungmin Ryu ,  Hyunsuk Park ,  Jiho Uh ,  Hyunjoon Ohn ,  Hyeseon Lee

IPC: H01J37/32

CPC classification number: H01J37/32082 ,  H01J2237/334 ,  H01J2237/24585 ,  H01J2237/24564

Abstract: A radio frequency (RF) generator including a carbonization prevention system includes a casing on which an intake fan and an interlock are mounted, an alternating current (AC) power supply, a power supply, a power amplifier (PA), a coupler provided between the PA and the RF output connector, and a control board that controls an amount of DC power output to the PA according to the calculated values. The carbonization prevention system detects smoke generated in the casing, measures a temperature and a humidity in the casing, and generates and transmits a control signal to the control board and an operation control signal to the interlock according to a reading result.

公开(公告)号：US20230130512A1

公开(公告)日：2023-04-27

申请号：US17747270

申请日：2022-05-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kangmin Park ,  Hyungho Kim ,  Dongwoo Wi ,  Hyunsoo Chun ,  Jiho Uh

IPC: H01L21/677 ,  H01L21/67

Abstract: A process chamber door for closing or opening an entrance of a process chamber through which a substrate to be process is loaded includes a seal plate including a front surface and a rear surface opposite to each other in a first direction, a connection block connected to the rear surface of the seal plate and including a central portion and two side portions connected to the rear surface of the seal plate, and a shaft connected to the central portion of the connection block. The connection block includes a first hinge groove and a second hinge groove. The first hinge groove is exposed at a bottom surface and a side surface of the connection block and the second hinge groove is exposed at an upper surface and the side surface of the connection block.

公开(公告)号：US11600511B2

公开(公告)日：2023-03-07

申请号：US17189392

申请日：2021-03-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kihong Cho ,  Kyuchul Shim ,  Chungho Cho ,  Jiho Uh ,  Jinseok Lee ,  Namki Cho

IPC: H01L21/683 ,  H02N13/00 ,  H01J37/32

Abstract: A substrate processing apparatus including an electrostatic chuck on which a substrate is mountable; a ring surrounding the electrostatic chuck, the ring including a first coupling groove; and a first floating electrode in the first coupling groove of the ring, the first floating electrode having a ring shape, wherein a top surface of the first floating electrode is exposed at the ring, and the first floating electrode has a tapered shape including an inclined surface that is inclined in a downward direction toward the electrostatic chuck.