公开(公告)号：US10970900B2

公开(公告)日：2021-04-06

申请号：US16299728

申请日：2019-03-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jooyoung Kim ,  Hyunwoo Lee

IPC: G06N20/00 ,  G06T11/60 ,  G06F16/438 ,  G06F16/332 ,  G06N3/04 ,  G06F16/338 ,  G06F40/205

Abstract: An artificial intelligence (AI) system using an artificial intelligence model learned according to at least one of machine learning, a neural network, or a deep-learning algorithm, and an application, and a method of controlling an electronic apparatus therefor are provided. The method includes acquiring a text based on a user input, determining a plurality of key terms from the acquired text, acquiring a plurality of first illustrations corresponding to the plurality of key terms, acquiring a second illustration by synthesizing at least two or more first illustration of the plurality of first illustrations, and outputting the acquired second illustration.

公开(公告)号：US20240327136A1

公开(公告)日：2024-10-03

申请号：US18383656

申请日：2023-10-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minkyun LEE ,  Seunggyu Kang ,  Hyunjae Kang ,  Sangmin Kim ,  Youngwook Kim ,  Jaesung Byun ,  Yongjun Ahn ,  Yongjun Ahn ,  Hyunwoo Lee ,  Jeonghun Lim ,  Junhyuk Chang

IPC: B65G47/90 ,  H01L21/677 ,  H01L21/687

CPC classification number: B65G47/90 ,  H01L21/67712 ,  H01L21/67769 ,  H01L21/68707

Abstract: An apparatus includes an elevator, a plurality of storages, a plurality of first robots and a plurality of second robots. The elevator may elevate a vehicle containing a plurality of semiconductor device carriers to position the vehicle at each of a plurality of process floors. At least one of the plurality of storages may be provided at each of the plurality of process floors to store the plurality of semiconductor device carriers. At least one of the plurality of first robots may be provided at each of the plurality of process floors to transfer the vehicle between the elevator and a respective one of the plurality of process floors. At least one of the second robots may be provided at each of the plurality of process floors to transfer at least one of the plurality of semiconductor device carriers between the vehicle and one of the plurality of storages.

公开(公告)号：US12103772B2

公开(公告)日：2024-10-01

申请号：US17847542

申请日：2022-06-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minji Kim ,  Sangmin Kim ,  Youngwook Kim ,  Ginam Park ,  Chuljun Park ,  Sanga Bang ,  Yongjun Ahn ,  Sangkyung Lee ,  Hyunwoo Lee ,  Jeonghun Lim

IPC: B65G1/04 ,  B65G49/06

CPC classification number: B65G1/0478 ,  B65G49/063 ,  B65G2201/0297

Abstract: A wafer storage system includes a main rail, an overhead hoist transport (OHT) on the main rail, the OHT being configured to transfer at least one storage case with wafers, an interface port on at least one side of the main rail, an auxiliary rail on one side of the interface port, the auxiliary rail being parallel to the main rail, and the interface port being between the main rail and the auxiliary rail, an auxiliary transport on the auxiliary rail, the auxiliary transport being configured to move along the auxiliary rail and to move the at least one storage case, a storage shelf on at least one side of the auxiliary transport, the storage shelf being configured to store the at least one storage case, and a worktable on one side of the storage shelf, the storage shelf being between the worktable and the auxiliary transport.

公开(公告)号：US12033879B2

公开(公告)日：2024-07-09

申请号：US17683769

申请日：2022-03-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangmin Kim ,  Youngwook Kim ,  Ginam Park ,  Chuljun Park ,  Jeongjae Bang ,  Jaesung Byun ,  Yongjun Ahn ,  Sangkyung Lee ,  Hyunwoo Lee ,  Junhyuk Chang

IPC: H01L21/677 ,  B65G1/06 ,  B65G1/127 ,  H01L21/673

CPC classification number: H01L21/67766 ,  B65G1/06 ,  B65G1/127 ,  H01L21/67379 ,  H01L21/6773 ,  B65G2201/0297

Abstract: A transfer apparatus includes a lower plate including a lower link arm and a lower support, the lower support being fixed to an upper surface of the lower plate, an upper plate on the lower plate and configured to support a wafer stacking box on an upper surface of the upper plate, the upper plate including an upper link arm, and an upper support that is fixed to the upper surface of the upper plate, and a fixing member that is connected to the upper link arm, the fixing member configured to selectively contact the wafer stacking box. The upper plate is aligned with the lower plate in a first horizontal direction, and is configured to perform linear movement on the lower plate in the first horizontal direction.

公开(公告)号：US20230253227A1

公开(公告)日：2023-08-10

申请号：US17946727

申请日：2022-09-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunggyu Kang ,  Jeonghun Lim ,  Youngwook Kim ,  Chuljun Park ,  Yongjun Ahn ,  Sangkyung Lee ,  Hyunwoo Lee

IPC: H01L21/677 ,  H01L21/67 ,  H02J50/12 ,  H02J50/90

CPC classification number: H01L21/67742 ,  H01L21/67259 ,  H02J50/12 ,  H02J50/90 ,  H01L21/6773 ,  H01L21/67736 ,  H01L21/67294 ,  H01M10/486

Abstract: A substrate transfer system and method includes a mobile robot configured to handle a substrate carrier and comprising a power receiver; a mobile robot interface device configured to handle the substrate carrier and comprising a power feeder configured to supply an electromotive force to the power receiver of the mobile robot; at least one of: a first actuator configured to move the power feeder to adjust a distance between the power feeder and the power receiver and a second actuator configured to move the power receiver to adjust a distance between the power feeder and the power receiver; an identification tag disposed on any one of the mobile robot and the mobile robot interface device; a tag reader configured to recognize the identification tag; and a controller configured to control an operation of the mobile robot and to control an operation of the first and/or second actuator and the controller is further configured to control the first and/or second actuator to adjust the distance between the power feeder and the power receiver.

公开(公告)号：US12153016B2

公开(公告)日：2024-11-26

申请号：US17499479

申请日：2021-10-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dusik Bae ,  Euihyun Roh ,  Sangyoon Shin ,  Yongjun Ahn ,  Youngwook Kim ,  Mira Park ,  Hyunwoo Lee ,  Jeonghun Lim ,  Wonil Choi ,  Sojung Park ,  Jiwoong Shin ,  Sangkyung Lee ,  Dongchol Choi

IPC: G08B21/10 ,  G01N1/14 ,  G01N27/22 ,  G01N27/27 ,  G01N27/64 ,  H01L21/67

Abstract: A detection device includes a transfer device to travel along a rail while gripping a carrier, and a detection structure mounted on the carrier. The detection structure includes a collector to suck in air, a detector connected to the collector, the detector including a plurality of sensors, a plurality of sensor control boards receiving electrical signals from the plurality of sensors, the plurality of sensor control boards generating, based on the electrical signals, type data and concentration data regarding pollutants included in the air sucked in by the collector, and a communication control board connected to the plurality of sensor control boards.

公开(公告)号：US20240372260A1

公开(公告)日：2024-11-07

申请号：US18777785

申请日：2024-07-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Munjin JEONG ,  Yitae KANG ,  Jaeyoung YANG ,  Yoonjung KIM ,  Hyunwoo Lee

IPC: H01Q9/04 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q21/28

Abstract: An electronic device includes a housing including a conductive portion, a printed circuit board inside the housing, and a conductive antenna member which is inside the housing and electrically connects the printed circuit board to the housing. The conductive antenna member includes a contact at which the conductive antenna member is secured to and electrically connected to the conductive portion of the housing, and the contact including a curved portion.

公开(公告)号：US20130258968A1

公开(公告)日：2013-10-03

申请号：US13850132

申请日：2013-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Kiseob Hong ,  Hyunwoo Lee ,  Jaehee Cho

IPC: H04W72/08

CPC classification number: H04W72/085 ,  H04L1/0003 ,  H04L1/0009 ,  H04L1/0019 ,  H04W52/262

Abstract: An uplink resource allocation method and apparatus determine Modulation and Coding Scheme (MCS) level dynamically based on an MCS index table in a wireless communication system. The dynamic uplink resource allocation method of the present disclosure includes normalizing an uplink transmission power; selecting one of a current Modulation and Coding Scheme (MCS) index table and at least one candidate MCS index table; and determining a MCS level using the normalized transmission power and the selected MCS index table. The dynamic uplink resource allocation method and apparatus of the present disclosure is capable of determining the MCS level depending on the MCS index table selected optimally in consideration of the number of users and uplink resource utilization ratio of the base station that are varying as time goes, thereby enhancing single user throughput and sector throughput and thus service quality.

Abstract translation: 上行链路资源分配方法和装置基于无线通信系统中的MCS索引表动态地确定调制和编码方案（MCS）级别。 本公开的动态上行链路资源分配方法包括：对上行链路传输功率进行归一化; 选择当前的调制和编码方案（MCS）索引表和至少一个候选MCS索引表中的一个; 以及使用归一化发送功率和所选择的MCS索引表来确定MCS级别。 本公开的动态上行链路资源分配方法和装置能够根据随时间变化的基站的用户数量和上行资源利用率最优选择的MCS索引表来确定MCS级别， 从而提高单用户吞吐量和扇区吞吐量，从而提高服务质量。