公开(公告)号：US20190324937A1

公开(公告)日：2019-10-24

申请号：US16457382

申请日：2019-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seok-jae Han ,  Gwang-man Lim ,  II-mok Kang ,  Sang-chul Kang ,  Seok-cheon Kwon ,  Seok-chan Lee

IPC: G06F13/40 ,  G06K19/077 ,  G11C5/14 ,  G06K13/08 ,  G06F13/16

Abstract: Provided is a memory card, which includes two pairs of opposite edges, first row terminals arranged adjacent to an insertion-side edge of the memory card, and second row terminals arranged apart from the insertion-side edge of the memory card. The memory card can be easily reset in terms of software without controlling power supply in terms of hardware. Also, the memory card can be smoothly attached and detached during insertion of the memory card into a socket and reduce damage to a device.

公开(公告)号：US20160352048A1

公开(公告)日：2016-12-01

申请号：US15141363

申请日：2016-04-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： In-jae Lee ,  Gwang-man Lim ,  Ki-woong Yoo ,  Soo-Jung Lee

IPC: H01R13/648 ,  H01R31/06 ,  H01R12/73

CPC classification number: H01R13/648 ,  H01R12/732 ,  H01R31/06 ,  H05K5/0282

Abstract: A memory card adaptor may include a plurality of card-side terminals arranged to contact terminals of a memory card, a plurality of socket-side terminals arranged in a first direction to contact terminals of a host socket and including at least two socket-side ground terminals, wiring lines configured to electrically connect the plurality of card-side terminals to the plurality of socket-side terminals in a one-to-one correspondence, a ground frame configured to electrically connect the at least two socket-side ground terminals to each other, and a housing that accommodates the plurality of card-side terminals, the plurality of socket-side terminals, and the wiring lines. The memory card adaptor may have good electrical characteristics, and thus may be able to stably operate even during fast data transmission.

Abstract translation: 存储卡适配器可以包括布置成接触存储卡的端子的多个卡片侧端子，沿着第一方向布置的多个插座侧端子以接触主机插座的端子并且包括至少两个插座侧接地 端子，被配置为将多个卡侧端子电连接到多个插座侧端子的布线一一对应;接地框架，被配置为将至少两个插座侧接地端子电连接到每个 以及容纳多个卡侧端子，多个插座侧端子和布线的壳体。 存储卡适配器可能具有良好的电气特性，因此即使在快速数据传输期间也能够稳定地操作。

公开(公告)号：US10347345B2

公开(公告)日：2019-07-09

申请号：US16215278

申请日：2018-12-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seok-jae Han ,  Il-mok Kang ,  Gwang-man Lim ,  Seok-heon Lee ,  Jae-bum Lee

IPC: G11C16/32 ,  G11C16/30 ,  G06K19/077

Abstract: A memory card is provided to include a substrate having two pairs of edges facing each other, a plurality of first row terminals that are arranged adjacent to an edge at an insertion side of the substrate and include a first voltage power terminal for applying a first voltage and a first ground terminal, a plurality of second row terminals that are spaced farther apart from the edge at the insertion side than the plurality of first row terminals and include a second voltage power terminal for applying a second voltage and first data terminals, and a plurality of third row terminals that are spaced farther apart from the edge at the insertion side than the plurality of second row terminals and include second data terminals.

公开(公告)号：US10037784B2

公开(公告)日：2018-07-31

申请号：US15323582

申请日：2015-07-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seok-jae Han ,  Il-mok Kang ,  Ki-woong Yoo ,  In-jae Lee ,  Gwang-man Lim

IPC: G11C5/14 ,  G06K19/077 ,  G11C5/06 ,  G11C7/10 ,  G11C7/22 ,  H01R12/73 ,  H01R13/66

CPC classification number: G11C5/14 ,  G06K19/07732 ,  G06K19/07743 ,  G11C5/06 ,  G11C5/063 ,  G11C7/10 ,  G11C7/22 ,  H01R12/73 ,  H01R13/6683

Abstract: A memory card and an electronic system including the memory card. The memory card includes: a substrate having two pairs of edges, in which the edges of each pair face each other; a plurality of first row terminals that are arranged adjacent to an edge at an insertion side of the substrate and include a first voltage power terminal; a plurality of second row terminals that are spaced farther apart from the edge at the insertion side than the plurality of first row terminals and include a power terminal of a second voltage. According to the memory card, efficient use of an area may be maximized and an electrically stable power supply may be provided.

公开(公告)号：US09859660B2

公开(公告)日：2018-01-02

申请号：US15141363

申请日：2016-04-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： In-jae Lee ,  Gwang-man Lim ,  Ki-woong Yoo ,  Soo-Jung Lee

IPC: H01R31/06 ,  H01R13/652 ,  H01R13/648 ,  H01R12/73 ,  H05K5/02

CPC classification number: H01R13/648 ,  H01R12/732 ,  H01R31/06 ,  H05K5/0282

Abstract: A memory card adaptor may include a plurality of card-side terminals arranged to contact terminals of a memory card, a plurality of socket-side terminals arranged in a first direction to contact terminals of a host socket and including at least two socket-side ground terminals, wiring lines configured to electrically connect the plurality of card-side terminals to the plurality of socket-side terminals in a one-to-one correspondence, a ground frame configured to electrically connect the at least two socket-side ground terminals to each other, and a housing that accommodates the plurality of card-side terminals, the plurality of socket-side terminals, and the wiring lines. The memory card adaptor may have good electrical characteristics, and thus may be able to stably operate even during fast data transmission.

公开(公告)号：US20150054144A1

公开(公告)日：2015-02-26

申请号：US14528572

申请日：2014-10-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chul Park ,  Hyeong-seob Kim ,  Kun-dae Yeom ,  Gwang-man Lim

IPC: H01L23/495 ,  H01L25/065

CPC classification number: H01L23/49541 ,  H01L23/49575 ,  H01L23/50 ,  H01L23/535 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01075 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48175 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: Provided sa a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package.

Abstract translation: 提供了包括多个半导体芯片的半导体封装以及连接到半导体芯片的分离的引线组。 引线暴露于半导体封装的外部。 多个引线可以包括用于第一芯片组的第一引线组和用于第二芯片组的第二引线组。 第一和第二芯片组是封装的一部分。

公开(公告)号：US10380055B2

公开(公告)日：2019-08-13

申请号：US15322987

申请日：2015-06-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seok-jae Han ,  Gwang-man Lim ,  Il-mok Kang ,  Sang-chul Kang ,  Seok-cheon Kwon ,  Seok-chan Lee

IPC: G06F13/12 ,  G06F13/40 ,  G06K13/08 ,  G06K19/077 ,  G06F13/16 ,  G11C5/14

Abstract: Provided is a memory card, which includes two pairs of opposite edges, first row terminals arranged adjacent to an insertion-side edge of the memory card, and second row terminals arranged apart from the insertion-side edge of the memory card. The memory card can be easily reset in terms of software without controlling power supply in terms of hardware. Also, the memory card can be smoothly attached and detached during insertion of the memory card into a socket and reduce damage to a device.

公开(公告)号：US10224110B2

公开(公告)日：2019-03-05

申请号：US15989070

申请日：2018-05-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seok-jae Han ,  Il-mok Kang ,  Gwang-man Lim ,  Seok-heon Lee ,  Jae-bum Lee

IPC: G11C16/32 ,  G11C16/30 ,  G06K19/077

Abstract: A memory card is provided to include a substrate having two pairs of edges facing each other, a plurality of first row terminals that are arranged adjacent to an edge at an insertion side of the substrate and include a first voltage power terminal for applying a first voltage and a first ground terminal, a plurality of second row terminals that are spaced farther apart from the edge at the insertion side than the plurality of first row terminals and include a second voltage power terminal for applying a second voltage and first data terminals, and a plurality of third row terminals that are spaced farther apart from the edge at the insertion side than the plurality of second row terminals and include second data terminals.

公开(公告)号：US09455217B2

公开(公告)日：2016-09-27

申请号：US14528572

申请日：2014-10-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chul Park ,  Hyeong-seob Kim ,  Kun-dae Yeom ,  Gwang-man Lim

IPC: H01L23/495 ,  H01L23/50 ,  H01L23/535 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/49541 ,  H01L23/49575 ,  H01L23/50 ,  H01L23/535 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01075 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48175 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package.

Abstract translation: 提供了包括多个半导体芯片的半导体封装以及连接到半导体芯片的分离的引线组。 引线暴露于半导体封装的外部。 多个引线可以包括用于第一芯片组的第一引线组和用于第二芯片组的第二引线组。 第一和第二芯片组是封装的一部分。

公开(公告)号：US08901750B2

公开(公告)日：2014-12-02

申请号：US14250934

申请日：2014-04-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chul Park ,  Hyeong-seob Kim ,  Kun-dae Yeom ,  Gwang-man Lim

IPC: H01L23/02 ,  H01L23/535 ,  H01L23/495 ,  H01L23/50 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/49541 ,  H01L23/49575 ,  H01L23/50 ,  H01L23/535 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01075 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48175 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package.