公开(公告)号：US20190237432A1

公开(公告)日：2019-08-01

申请号：US16377352

申请日：2019-04-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chul Park ,  Seonggwan Lee ,  Minkyeong Park

IPC: H01L25/065 ,  H01L25/04 ,  H01L25/07 ,  H01L25/11 ,  H01L25/075

Abstract: A semiconductor package includes a substrate including a signal pattern on an upper surface thereof, a chip stack on the substrate, and a first semiconductor chip and one or more spacers between the substrate and the chip stack. The chip stack includes one or more second semiconductor chips stacked on the substrate. The one or more spacers and the first semiconductor chip are adjacent to respective corners of a lowermost second semiconductor chip, in plan view. The one or more spacers have the same planar shape as the first semiconductor chip.

公开(公告)号：US08770806B2

公开(公告)日：2014-07-08

申请号：US13645056

申请日：2012-10-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Hoe Koo ,  Chul Park ,  Yun Seok Woo ,  Il Seok Lee ,  Dong Il Lim ,  Deok Hee Hee Han

IPC: F21V21/00

CPC classification number: F21K9/00 ,  F21V3/049 ,  F21V3/12 ,  F21V13/02 ,  F21V17/10 ,  F21V17/14 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: A light emitting diode (LED) lighting module is provided including an LED array, and at least one of a diffusing portion and a reflecting portion. The LED array, equipped with at least one LED, may include a side wall which surrounds the at least one LED. The diffusing portion may be detachably coupled to the LED array and may include a diffusion plate which diffuses light emitted from the at least one LED The reflecting portion may be detachably coupled to one of the LED array and the diffusing portion and may reflect light emitted from the at least one LED. The LED array may be selectively coupled with the diffusing portion, the reflecting portion, or both the diffusing portion and the reflecting portion.

Abstract translation: 提供了一种发光二极管（LED）照明模块，其包括LED阵列，以及漫射部分和反射部分中的至少一个。 配备有至少一个LED的LED阵列可以包括围绕至少一个LED的侧壁。 漫射部分可以可拆卸地耦合到LED阵列，并且可以包括漫射板，其漫射从至少一个LED发射的光。反射部分可以可拆卸地耦合到LED阵列和漫射部分中的一个，并且可以反射从 所述至少一个LED。 LED阵列可以选择性地与扩散部分，反射部分或扩散部分和反射部分耦合。

公开(公告)号：US10157883B2

公开(公告)日：2018-12-18

申请号：US15404090

申请日：2017-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chul Park ,  Kilsoo Kim ,  In Lee

IPC: H01L25/065 ,  H01L23/00

Abstract: A semiconductor package comprises a package substrate; a first chip stack and a second chip stack mounted side by side on the package substrate, wherein the first and second chip stacks each include a plurality of semiconductor chips stacked on the package substrate, wherein each of the semiconductor chips includes a plurality of bonding pads provided on a respective edge region thereof, wherein at least some of the plurality of bonding pads are functional pads, and wherein the functional pads occupy a region that is substantially less than an entirety of the respective edge region.

公开(公告)号：US20140225281A1

公开(公告)日：2014-08-14

申请号：US14250934

申请日：2014-04-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chul Park ,  Hyeong-seob Kim ,  Kun-dae Yeom ,  Gwang-man Lim

IPC: H01L23/535 ,  H01L25/065 ,  H01L23/50

CPC classification number: H01L23/49541 ,  H01L23/49575 ,  H01L23/50 ,  H01L23/535 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01075 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48175 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package.

Abstract translation: 提供了包括多个半导体芯片的半导体封装以及连接到半导体芯片的分离的引线组。 引线暴露于半导体封装的外部。 多个引线可以包括用于第一芯片组的第一引线组和用于第二芯片组的第二引线组。 第一和第二芯片组是封装的一部分。

公开(公告)号：US09224432B2

公开(公告)日：2015-12-29

申请号：US14077656

申请日：2013-11-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chul Park

IPC: G11C5/00 ,  G11C5/02 ,  G11C5/06 ,  H05K1/11 ,  H01L23/50 ,  H01L25/18 ,  H05K3/28 ,  H01L23/498

CPC classification number: G11C5/063 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49855 ,  H01L23/50 ,  H01L25/18 ,  H01L2224/10 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06568 ,  H05K1/113 ,  H05K3/284 ,  H05K2201/10212 ,  H01L2924/00014

Abstract: In a semiconductor package, a circuit pattern is arranged in a circuit board and contact pads on the circuit board are connected with the circuit pattern. Contact terminals contact external contact elements on a first surface of the circuit board. An integrated circuit (IC) chip structure is mounted on the circuit board and electrically connected to the inner circuit pattern. An operation controller on the circuit board controls operation of the semiconductor package according to the package users' individual choice.

Abstract translation: 在半导体封装中，电路图案布置在电路板中，并且电路板上的接触焊盘与电路图案相连。 接触端子接触电路板第一表面上的外部接触元件。 集成电路（IC）芯片结构安装在电路板上并电连接到内部电路图案。 电路板上的操作控制器根据用户的个人选择来控制半导体封装的操作。

公开(公告)号：US20150054144A1

公开(公告)日：2015-02-26

申请号：US14528572

申请日：2014-10-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chul Park ,  Hyeong-seob Kim ,  Kun-dae Yeom ,  Gwang-man Lim

IPC: H01L23/495 ,  H01L25/065

CPC classification number: H01L23/49541 ,  H01L23/49575 ,  H01L23/50 ,  H01L23/535 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01075 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48175 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: Provided sa a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package.

Abstract translation: 提供了包括多个半导体芯片的半导体封装以及连接到半导体芯片的分离的引线组。 引线暴露于半导体封装的外部。 多个引线可以包括用于第一芯片组的第一引线组和用于第二芯片组的第二引线组。 第一和第二芯片组是封装的一部分。

公开(公告)号：US20140218998A1

公开(公告)日：2014-08-07

申请号：US14077656

申请日：2013-11-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chul Park

IPC: G11C5/06

CPC classification number: G11C5/063 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49855 ,  H01L23/50 ,  H01L25/18 ,  H01L2224/10 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06568 ,  H05K1/113 ,  H05K3/284 ,  H05K2201/10212 ,  H01L2924/00014

Abstract: In a semiconductor package, a circuit pattern is arranged in a circuit board and contact pads on the circuit board are connected with the circuit pattern. Contact terminals contact external contact elements on a first surface of the circuit board. An integrated circuit (IC) chip structure is mounted on the circuit board and electrically connected to the inner circuit pattern. An operation controller on the circuit board controls operation of the semiconductor package according to the package users' individual choice.

Abstract translation: 在半导体封装中，电路图案布置在电路板中，并且电路板上的接触焊盘与电路图案相连。 接触端子接触电路板第一表面上的外部接触元件。 集成电路（IC）芯片结构安装在电路板上并电连接到内部电路图案。 电路板上的操作控制器根据用户的个人选择来控制半导体封装的操作。

公开(公告)号：US10658350B2

公开(公告)日：2020-05-19

申请号：US16137743

申请日：2018-09-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seonggwan Lee ,  Chul Park

IPC: H01L25/18 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A semiconductor package including a substrate including an external terminal; a first semiconductor chip on the substrate and having a first and a second region; at least one second semiconductor chip on the second region of the first semiconductor chip, the at least one second semiconductor chip exposing a top surface of the first region of the first semiconductor chip; and at least one third semiconductor chip on the at least one second semiconductor chip, wherein the first semiconductor chip includes a first pad electrically connected to the at least one second semiconductor chip; a second pad electrically connected to the at least one third semiconductor chip; and a third pad electrically connected to the external terminal, the first pad is on the top surface of the first region, and at least one of the second pad and the third pad is on a top surface of the second region.

公开(公告)号：US09947644B2

公开(公告)日：2018-04-17

申请号：US15268658

申请日：2016-09-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhee Hong ,  Wansoo Park ,  Chul Park

IPC: H01L23/498 ,  H01L25/18 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L25/18 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/85399

Abstract: A semiconductor package is provided. The semiconductor package may include a plurality of memory chips, which are mounted on a top surface of a package substrate, and a plurality of controller chips, which are vertically stacked on at least one of top and bottom surfaces of the package substrate.

公开(公告)号：US10741526B2

公开(公告)日：2020-08-11

申请号：US16377352

申请日：2019-04-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chul Park ,  Seonggwan Lee ,  Minkyeong Park

IPC: H01L25/065 ,  H01L25/04 ,  H01L25/07 ,  H01L25/11 ,  H01L25/075

Abstract: A semiconductor package includes a substrate including a signal pattern on an upper surface thereof, a chip stack on the substrate, and a first semiconductor chip and one or more spacers between the substrate and the chip stack. The chip stack includes one or more second semiconductor chips stacked on the substrate. The one or more spacers and the first semiconductor chip are adjacent to respective corners of a lowermost second semiconductor chip, in plan view. The one or more spacers have the same planar shape as the first semiconductor chip.