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1.
公开(公告)号:US09087566B2
公开(公告)日:2015-07-21
申请号:US14038932
申请日:2013-09-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Tae Joong Song , Gyu Hong Kim , Jae Ho Park , Gi Young Yang , Jong Hoon Jung
IPC: G06F12/00 , G11C7/12 , G11C11/419
CPC classification number: G11C7/12 , G06F12/00 , G11C11/419
Abstract: Semiconductor memory devices are provided. Each of the semiconductor memory devices may include first and second memory cells. The first memory cell may be connected to a bit line and a complementary bit line. Moreover, each of the semiconductor memory devices may include a discharge circuit connected to the first memory cell via the bit line and the complementary bit line. The discharge circuit may be configured to discharge the first memory cell during a read or write operation of the second memory cell.
Abstract translation: 提供半导体存储器件。 每个半导体存储器件可以包括第一和第二存储单元。 第一存储单元可以连接到位线和互补位线。 此外,每个半导体存储器件可以包括通过位线和互补位线连接到第一存储单元的放电电路。 放电电路可以被配置为在第二存储单元的读取或写入操作期间对第一存储单元进行放电。
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公开(公告)号:US20230343788A1
公开(公告)日:2023-10-26
申请号:US18344794
申请日:2023-06-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Gi Young Yang , Hyeon Gyu You , Ga Room Kim , Jin Young Lim , In Gyum Kim , Hak Chul Jung
IPC: H01L27/118 , G06F30/392 , H01L27/02 , G11C5/06 , H01L23/528 , G11C11/412
CPC classification number: H01L27/11807 , G06F30/392 , H01L27/0207 , G11C5/06 , H01L23/528 , G11C11/412
Abstract: An integrated circuit including a first active region and a second active region extending in a first direction and spaced apart from each other in a second direction intersecting the first direction; a power rail and a ground rail extending in the first direction and spaced apart from the first and second active regions and each other in the second direction; source/drain contacts extending in the second direction on at least a portion of the first or second active region, gate structures extending in the second direction and on at least a portion of the first and second active regions, a power rail configured to supply power through source/drain contact vias, and a ground rail configured to supply a ground voltage through source/drain contact vias.
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公开(公告)号:US11973081B2
公开(公告)日:2024-04-30
申请号:US17561887
申请日:2021-12-24
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyeon Gyu You , In Gyum Kim , Gi Young Yang , Ji Su Yu , Jin Young Lim , Hak Chul Jung
IPC: H01L27/118 , H01L27/02
CPC classification number: H01L27/11807 , H01L27/0207 , H01L2027/11812 , H01L2027/1182 , H01L2027/11866 , H01L2027/11875 , H01L2027/11881 , H01L2027/11887
Abstract: An integrated circuit includes a first standard cell including a first first-type transistor, a first second-type transistor, a third second-type transistor, and a third first-type transistor, a second standard cell including a second first-type transistor, a second second-type transistor, a fourth second-type transistor and a fourth first-type transistor, a plurality of wiring layers which are disposed on the first and second standard cells and includes a first wiring layer, a second wiring layer, and a third wiring layer sequentially stacked. A source contact of the first first-type transistor and a source contact of the second first-type transistor are electrically connected through a first power rail of the plurality of wiring layers, and a source contact of the third first-type transistor and a source contact of the fourth first-type transistor are electrically connected through a second power rail of the plurality of wiring layers.
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4.
公开(公告)号:US20140101395A1
公开(公告)日:2014-04-10
申请号:US14038932
申请日:2013-09-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Tae Joong Song , Gyu Hong Kim , Jae Ho Park , Gi Young Yang , Jong Hoon Jung
CPC classification number: G11C7/12 , G06F12/00 , G11C11/419
Abstract: Semiconductor memory devices are provided. Each of the semiconductor memory devices may include first and second memory cells. The first memory cell may be connected to a bit line and a complementary bit line. Moreover, each of the semiconductor memory devices may include a discharge circuit connected to the first memory cell via the bit line and the complementary bit line. The discharge circuit may be configured to discharge the first memory cell during a read or write operation of the second memory cell.
Abstract translation: 提供半导体存储器件。 每个半导体存储器件可以包括第一和第二存储单元。 第一存储单元可以连接到位线和互补位线。 此外,每个半导体存储器件可以包括通过位线和互补位线连接到第一存储单元的放电电路。 放电电路可以被配置为在第二存储单元的读取或写入操作期间对第一存储单元进行放电。
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公开(公告)号:US11735592B2
公开(公告)日:2023-08-22
申请号:US17029475
申请日:2020-09-23
Applicant: Samsung Electronics Co., Ltd.
Inventor: Gi Young Yang , Hyeon Gyu You , Ga Room Kim , Jin Young Lim , In Gyum Kim , Hak Chul Jung
IPC: H01L23/52 , H01L27/118 , G06F30/392 , H01L27/02 , G11C5/06 , H01L23/528 , G11C11/412
CPC classification number: H01L27/11807 , G06F30/392 , G11C5/06 , G11C11/412 , H01L23/528 , H01L27/0207
Abstract: An integrated circuit including a first active region and a second active region extending in a first direction and spaced apart from each other in a second direction intersecting the first direction; a power rail and a ground rail extending in the first direction and spaced apart from the first and second active regions and each other in the second direction; source/drain contacts extending in the second direction on at least a portion of the first or second active region, gate structures extending in the second direction and on at least a portion of the first and second active regions, a power rail configured to supply power through source/drain contact vias, and a ground rail configured to supply a ground voltage through source/drain contact vias.
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公开(公告)号:US11244961B2
公开(公告)日:2022-02-08
申请号:US16888677
申请日:2020-05-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyeon Gyu You , In Gyum Kim , Gi Young Yang , Ji Su Yu , Jin Young Lim , Hak Chul Jung
IPC: H01L27/118 , H01L27/02
Abstract: An integrated circuit includes a first standard cell including a first first-type transistor, a first second-type transistor, a third second-type transistor, and a third first-type transistor, a second standard cell including a second first-type transistor, a second second-type transistor, a fourth second-type transistor and a fourth first-type transistor, a plurality of wiring layers which are disposed on the first and second standard cells and includes a first wiring layer, a second wiring layer, and a third wiring layer sequentially stacked. A source contact of the first first-type transistor and a source contact of the second first-type transistor are electrically connected through a first power rail of the plurality of wiring layers, and a source contact of the third first-type transistor and a source contact of the fourth first-type transistor are electrically connected through a second power rail of the plurality of wiring layers.
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