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公开(公告)号：US20240162228A1
公开(公告)日：2024-05-16
申请号：US18219875
申请日：2023-07-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dongkyu LEE , Hyungjoo NA , Jinchan YUN , Cheoljin YUN , Kyuman HWANG
IPC: H01L27/092 , H01L21/822 , H01L21/8238 , H01L29/06 , H01L29/417 , H01L29/423 , H01L29/66 , H01L29/775
CPC classification number: H01L27/0922 , H01L21/8221 , H01L21/823807 , H01L21/823814 , H01L21/823871 , H01L21/823878 , H01L29/0673 , H01L29/41733 , H01L29/42392 , H01L29/66439 , H01L29/66545 , H01L29/775
Abstract: A three-dimensional semiconductor device includes a lower connection structure; a device structure; and an upper connection structure sequentially disposed along a first direction, wherein the device structure includes a substrate on the lower connection structure; first and second source/drain patterns on the substrate; a separation pattern adjacent in a second direction to the source/drain patterns, the second direction being parallel to a bottom surface of the substrate; and a through conductive pattern adjacent in a third direction to the separation pattern, the third direction being parallel to the bottom surface of the substrate and intersecting the second direction, the through conductive pattern connects the lower connection structure and the upper connection structure to each other, and the through conductive pattern is connected either through the lower connection structure to the first source/drain pattern or through the upper connection structure to the second source/drain pattern.
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2.发明公开公开(公告)号：US20230230840A1
公开(公告)日：2023-07-20
申请号：US17874766
申请日：2022-07-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongkyu LEE , Songyun KANG , Hiroshi SASAKI , Younseon WANG
IPC: H01L21/3065 , H01L21/311 , H01J37/32
CPC classification number: H01L21/3065 , H01L21/31116 , H01J37/32449 , H01J2237/334
Abstract: A method of fabricating a semiconductor device comprises forming a mold layer on a substrate, forming a hardmask layer on the mold layer such that a portion of the mold layer is exposed, and using the hardmask layer to perform on the mold layer a cryogenic etching process. The cryogenic etching process includes supplying a chamber with a process gas including first and second process gases, and generating a plasma from the process gas. Radicals of the first process gas etch the exposed portion of the mold layer. Ammonium salt is produced based on the radicals etching the exposed portion of the mold layer. The second process gas includes an R—OH compound. The R is hydrogen, a C1 to C5 alkyl group, a C2 to C6 alkenyl group, a C2 to C6 alkynyl group, or a phenyl group. The second process gas reduces a production rate of the ammonium salt.
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3.发明申请公开(公告)号：US20230132283A1
公开(公告)日：2023-04-27
申请号：US17973041
申请日：2022-10-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seungcheol LEE , Byungsung KANG , Kyoungho CHOI , Dongeup HAM , Sewook PARK , Chanyeol PARK , Dongkyu LEE , Dongsun LIM , Suengyoon JOUNG
IPC: H04W8/00
Abstract: According to an embodiment, an electronic device includes a communication module and at least one processor connected to the communication module. The at least one processor is configured to, upon executing an application stored in the electronic device, identify at least one external electronic device registered in the application, identify at least one communication protocol supported by the at least one external electronic device among a plurality of communication protocols, and adjust a scan time corresponding to a first communication protocol among the plurality of communication protocols based on the at least one communication protocol.
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公开(公告)号：US20190097831A1
公开(公告)日：2019-03-28
申请号：US16143805
申请日：2018-09-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yongwook KIM , Dongkyu LEE
CPC classification number: H04L12/2823 , E06B7/28 , G08B21/18 , H04L67/025 , H04L2012/2841 , H04W4/14
Abstract: An electronic device is disclosed. The electronic device includes: a first communication unit and a second communication unit; a processor; and a memory, wherein the memory includes instructions causing the processor to control the first communication unit to receive first identification information for the door and first opening/closing state information of the door from a server, control the second communication unit to receive second communication unit to receive second door identification information and second opening/closing state information of the door from a door, and identify information on an electronic device involved in a change in an opening/closing state of the door based on the first identification information for the door, the first opening/closing state information of the door, the second door identification information, and the second opening/closing state information of the door. Other various embodiments are possible.
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公开(公告)号：US20180048953A1
公开(公告)日：2018-02-15
申请号：US15665989
申请日：2017-08-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sang-Il PARK , Dongkyu LEE
CPC classification number: H04R1/1041 , G06F3/162 , G06F3/165 , H04R1/1016 , H04R1/1033 , H04R1/1058 , H04R5/0335 , H04R2201/107 , H04R2420/07
Abstract: An electronic device is provided. The electronic device includes a housing having a wearable shape configured to be worn on a human body, a coupling device disposed to at least one area of the housing and changeable from a first state to a second state so that the housing is coupled to an external object, an input signal generating device for generating an input signal when the coupling device is changed to the second state, and a control circuit configured to execute at least one instruction on the basis of at least one input signal generated from the input signal generating device.
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Patent Agency Ranking
公开(公告)号：US20240258351A1
公开(公告)日：2024-08-01
申请号：US18631933
申请日：2024-04-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Taesung LEE , Dongmin KEUM , Bumsuk KIM , Jinho KIM , Junsung PARK , Kwanghee LEE , Dongkyu LEE , Yunki LEE
IPC: H01L27/146 , H04N23/67
CPC classification number: H01L27/14627 , H01L27/14621 , H01L27/14643 , H04N23/672
Abstract: An image sensor includes a normal pixel, a first auto-focus (AF) pixel, and a second AF pixel, each of the normal pixel, the first AF pixel and the second AF pixel including a photodiode. The image sensor further includes a normal microlens disposed on the normal pixel, and a first AF microlens disposed on the first AF pixel and the second AF pixel. The photodiode of the normal pixel, the photodiode of the first AF pixel, and the photodiode of the second AF pixel are respectively disposed in photo-detecting areas of a semiconductor substrate. A height of the first AF microlens in a vertical direction from a top surface of the semiconductor substrate is greater than a height of the normal microlens in the vertical direction from the top surface of the semiconductor substrate.
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公开(公告)号：US20210296399A1
公开(公告)日：2021-09-23
申请号：US17339297
申请日：2021-06-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dongkyu LEE
Abstract: A variable resistance memory device and a method of manufacturing the same, the variable resistance memory device including a substrate including a first memory region and a second memory region; a plurality of first memory cells on the first memory region; and a plurality of second memory cells on the second memory region, wherein each of the first memory cells includes a first resistance element and a selection element, each of the second memory cells includes a second resistance element, and a maximum value of a variable resistance of the second resistance element is less than a maximum value of a variable resistance of the first resistance element.
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公开(公告)号：US20200323104A1
公开(公告)日：2020-10-08
申请号：US16650550
申请日：2017-10-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Taeyoung KIM , Sehyun LEE , Hyeonji KA , Yunpil YEOM , Dongkyu LEE
Abstract: An electronic device according to various embodiments comprises: a case for accommodating at least one electronic part; an upper cover for covering at least one part of an upper end of the case; and a connector, which is arranged on the upper cover, for electrically connecting an external module and the at least one electronic part, wherein the upper cover can guide heat generated from the at least one electronic part such that the heat is discharged to the outside along a side part of the upper cover. Additional other embodiments are possible.
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公开(公告)号：US20220325911A1
公开(公告)日：2022-10-13
申请号：US17728360
申请日：2022-04-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Taeil KIM , Sukho LEE , Jejin LEE , Donghan KO , Sangho YOO , Dongkyu LEE , Jaeyang LEE , Changyong LEE , Dongil JUNG , Sangyoon HAN
Abstract: An air conditioner including: a compressor; a heat exchanger fluidly connected to the compressor; a pressure sensor provided in a first flow path connecting an outlet of the compressor to an inlet of the first heat exchanger; a temperature sensor provided in a second flow path connected to an outlet of the heat exchanger; and a processor connected to the compressor, the pressure sensor, and the temperature sensor. The processor configured to: acquire a reference index value based on a first reference pressure measured by the pressure sensor and a first reference temperature measured by the temperature sensor, acquire a measurement index value based on a first measurement pressure measured by the pressure sensor and a first measurement temperature measured by the temperature sensor, and display a shortage of a refrigerant of the air conditioner based on the reference index value and the measurement index value.
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公开(公告)号：US20220114802A1
公开(公告)日：2022-04-14
申请号：US17274282
申请日：2019-09-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongkyu LEE , Yongwook KIM , Yongju YU , Kiyoung KWON , Jimin KIM , Chulkwi KIM
Abstract: According to an embodiment of the disclosure, an electronic device may include a communication interface, a dynamic vision sensor (DVS) to generate bit data for each of a plurality of image frames, based on change in illuminance, a processor electrically connected with the communication interface and the DVS, and a memory electrically connected with the processor. The memory may store instructions, and the instructions may cause the processor to filter out at least a partial frame of the plurality of image frames, based on a ratio of the number of a bit value, which is included in the bit data and corresponds to each pixel, to the number of total pixels constituting each of the plurality of image frames, and recognize a shape of a surrounding object of the electronic device, based on another frame of the plurality of image frames. Moreover, various embodiment found through the disclosure are possible.
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