Semiconductor device and method of manufacturing the same

    公开(公告)号:US11652104B2

    公开(公告)日:2023-05-16

    申请号:US16410132

    申请日:2019-05-13

    CPC classification number: H01L27/0924 H01L29/0653 H01L29/785

    Abstract: A semiconductor device including a substrate having a plurality of active fins, each of the plurality of active fins extending in a first direction, first and second gate structures crossing over the plurality of active fins, the first and second gate structures extending in a second direction different from the first direction, the first and second gate structures spaced apart from each other in the first direction, at least one insulating barrier extending in the first direction and between the plurality of active fins, the insulating barrier separating lower portions of the first and second gate structures from each other, and a gate isolation layer connected to a portion of the insulating barrier, the gate isolation unit separating upper portions of the first and second gate structures from each other may be provided.

    Ultrasonic probe and manufacturing method thereof
    4.
    发明授权
    Ultrasonic probe and manufacturing method thereof 有权
    超声波探头及其制造方法

    公开(公告)号:US09153767B2

    公开(公告)日:2015-10-06

    申请号:US13713071

    申请日:2012-12-13

    Inventor: Dong Hyun Kim

    CPC classification number: H01L41/09 G10K11/002 H01L41/31 Y10T29/42

    Abstract: Disclosed herein are an ultrasonic probe having a backing layer formed of a structure which varies acoustic impedance and a manufacturing method thereof. The ultrasonic probe includes a piezoelectric layer and a backing layer provided on a rear surface of the piezoelectric layer, and the backing layer includes a plurality of kerfs formed on a front surface thereof in a lengthwise direction, the front surface being adjacent to the rear surface of the piezoelectric layer, and the kerfs are formed such that the intervals between the kerfs are varied.

    Abstract translation: 这里公开了具有由改变声阻抗的结构形成的背衬层的超声波探头及其制造方法。 超声波探头包括压电层和设置在压电层的后表面上的背衬层,背衬层包括沿其长度方向形成在其前表面上的多个切口,前表面邻近后表面 并且切口形成为使得切口之间的间隔变化。

    HEAT EXCHANGER
    5.
    发明申请
    HEAT EXCHANGER 审中-公开
    热交换器

    公开(公告)号:US20150021003A1

    公开(公告)日:2015-01-22

    申请号:US14328823

    申请日:2014-07-11

    Abstract: A heat exchanger including a plurality of tubes disposed horizontally, a pair of vertical headers connecting the tubes, and at least one flow distribution baffle mounted to a header at one group of the plurality of tubes such that the flow distribution baffle is positioned between tubes of the one group. Each of the at least one flow distribution baffle is provided with at least one distribution hole allowing a refrigerant to pass therethrough. The heat exchanger prevents unbalanced distribution of the refrigerant when it operates as an evaporator of an outdoor unit.

    Abstract translation: 一种热交换器,包括水平放置的多个管,连接管的一对垂直集管和至少一个分配挡板,其安装在多个管中的一组的集管上,使得流量分配挡板位于 一组。 所述至少一个分流挡板中的每一个设置有允许制冷剂通过的至少一个分配孔。 当制冷剂作为室外机的蒸发器工作时,热交换器防止制冷剂的不平衡分配。

    Heat exchanger, header for the same and manufacturing method thereof

    公开(公告)号:US10527366B2

    公开(公告)日:2020-01-07

    申请号:US15698984

    申请日:2017-09-08

    Abstract: A heat exchanger includes a plurality of tubes having refrigerant flowing therein and arranged to exchange heat with outside air; and a header having a chamber adapted to distribute the refrigerant to the plurality of tubes, wherein the header includes, a base wall having a plurality of tube insertion holes into which the plurality of tubes are inserted, and a partition wall integrally formed with the base wall and configured to divide the chamber into a plurality of sections corresponding to the plurality of tubes. This structure helps reduce the number of parts of the heat exchanger, simplify processing and assembling, and improving the heat transfer performance by improving the distribution of the refrigerant.

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