Abstract:
A semiconductor device including a substrate having a plurality of active fins, each of the plurality of active fins extending in a first direction, first and second gate structures crossing over the plurality of active fins, the first and second gate structures extending in a second direction different from the first direction, the first and second gate structures spaced apart from each other in the first direction, at least one insulating barrier extending in the first direction and between the plurality of active fins, the insulating barrier separating lower portions of the first and second gate structures from each other, and a gate isolation layer connected to a portion of the insulating barrier, the gate isolation unit separating upper portions of the first and second gate structures from each other may be provided.
Abstract:
A display device and a method of controlling the same. The display device includes a display configured to display an image; and a controller configured to perform image processing on the displayed such that a radius of curvature of the displayed image and a radius of curvature of a visible image are different. The image can be enlarged to a maximum area providing in the display device by applying analogous viewing distance calculation method used in the curved display device with respect to the scaling of the image. Accordingly, the discontinuity of the image can be removed by providing continuous scaling, and the perspective, presence, viewing experience can be enhanced while adaptively correcting the brightness. The display device can display the image having the curvature that the user wants, and thus resemble the curved display device. Further, optical illusion of watching the three-dimensional image can be generated.
Abstract:
A link scheduling method in a system for performing Device-to-Device (D2D) communication includes periodically collecting information indicating whether to perform a medium access from at least one neighboring link determining at least one link expected to perform a medium access in a corresponding traffic slot among links with a higher priority than the terminal based on the collected information, and determining whether to perform the medium access of the terminal by considering only the at least one link expected to perform the medium access.
Abstract:
Disclosed herein are an ultrasonic probe having a backing layer formed of a structure which varies acoustic impedance and a manufacturing method thereof. The ultrasonic probe includes a piezoelectric layer and a backing layer provided on a rear surface of the piezoelectric layer, and the backing layer includes a plurality of kerfs formed on a front surface thereof in a lengthwise direction, the front surface being adjacent to the rear surface of the piezoelectric layer, and the kerfs are formed such that the intervals between the kerfs are varied.
Abstract:
A heat exchanger including a plurality of tubes disposed horizontally, a pair of vertical headers connecting the tubes, and at least one flow distribution baffle mounted to a header at one group of the plurality of tubes such that the flow distribution baffle is positioned between tubes of the one group. Each of the at least one flow distribution baffle is provided with at least one distribution hole allowing a refrigerant to pass therethrough. The heat exchanger prevents unbalanced distribution of the refrigerant when it operates as an evaporator of an outdoor unit.
Abstract:
A display apparatus includes: a display; a receiver configured to receive data of main content from a content provider; and a processor configured to control the receiver to receive image data and reference information about whether sub content is involved along with main content in the image data, control the display to display an image of the main content and the sub content selectively involved in the main content based on the image data received in the receiver, and make the image be displayed by one image process selected corresponding to whether the sub content is involved in the image based on the reference information among a plurality of image processes.
Abstract:
A device operation method and an electronic device for supporting the same are provided. The method includes establishing a communication channel with an external device, receiving request information for requesting to activate a sensor of an electronic device in connection with executing a function of the external device, and activating the sensor in response to the request information.
Abstract:
A semiconductor device includes first and second fin patterns on a substrate and extending apart from each other, a field insulating film on the substrate and surrounding parts of the first and second fin patterns, a first gate structure on the first fin pattern and intersecting the first fin pattern, a second gate structure on the second fin pattern and intersecting the second fin pattern, and a separating structure protruding from a top surface of the field insulating film and separating the first and second gate structures, the field insulating film and the separating structure including a same insulating material.
Abstract:
A heat exchanger includes a plurality of tubes having refrigerant flowing therein and arranged to exchange heat with outside air; and a header having a chamber adapted to distribute the refrigerant to the plurality of tubes, wherein the header includes, a base wall having a plurality of tube insertion holes into which the plurality of tubes are inserted, and a partition wall integrally formed with the base wall and configured to divide the chamber into a plurality of sections corresponding to the plurality of tubes. This structure helps reduce the number of parts of the heat exchanger, simplify processing and assembling, and improving the heat transfer performance by improving the distribution of the refrigerant.
Abstract:
A semiconductor device includes a plurality of main contact plugs and a plurality of dummy contact plugs which pass through an insulating layer on a substrate. A plurality of upper interconnections is on the insulating layer. The plurality of dummy contact plugs include a first dummy contact plug. The plurality of upper interconnections include a first upper interconnection overlapping the first dummy contact plug. A vertical central axis of the first dummy contact plug is located outside the first upper interconnection.