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公开(公告)号：US11076482B2
公开(公告)日：2021-07-27
申请号：US16849622
申请日：2020-04-15
发明人： Jung Soo Kim , Ha Il Kim , Seok Jun Ahn , Soo Ah Lee
摘要： A printed circuit board includes an internal insulating layer, an internal conductive pattern layer disposed on the internal insulating layer and including a line portion and a bonding pad portion, and an external insulating layer disposed on the internal conductive pattern layer and the internal insulating layer and having an accommodation groove extending therethrough to expose the bonding pad portion. The bonding pad portion includes a connection pattern extending from the line portion of the internal conductive pattern layer embedded in the external insulating layer, and exposed to the accommodation groove; a land pattern disposed closer to a center portion of the accommodation groove than the connection pattern; and a dam pattern connecting the connection pattern and the land pattern, in which a line width of the dam pattern is narrower than a line width of the land pattern.
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2.发明申请公开(公告)号：US20140096383A1
公开(公告)日：2014-04-10
申请号：US14106013
申请日：2013-12-13
发明人： Yang Je LEE , Il Woon Shin , Going Sik Kim , Doo Pyo Hong , Ha Il Kim , Dong Gi An
IPC分类号： H05K3/42
CPC分类号： H05K3/429 , H05K1/0218 , H05K3/0035 , H05K3/281 , H05K3/4644 , H05K3/4652 , H05K3/4664 , H05K3/4691 , H05K2201/0195 , H05K2201/0715 , H05K2201/09509 , H05K2203/054 , H05K2203/0554 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49169 , Y10T29/49171
摘要： A method of manufacturing a rigid-flexible printed circuit board includes providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns and a first window are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the base substrate; forming a via hole in the rigid region, and, simultaneously, forming a via hole to correspond to the first window in a flexible region; forming outer circuit patterns including areas adjacent to the first window; and applying solder resists in the rigid region to expose portions of external circuit patterns. The region adjacent to the via holes in the flexible region includes additional plating portions for covering the coverlays.
摘要翻译： 一种刚性柔性印刷电路板的制造方法，其特征在于，在其两侧分别形成有内层电路图案和第一窗口的柔性铜箔层叠体的两面分别形成有覆盖层的基板， 在作为基底基板的刚性区域的覆盖层的部分上分层绝缘层和铜箔层; 在刚性区域中形成通孔，同时在柔性区域中形成与第一窗口对应的通孔; 形成包括与所述第一窗口相邻的区域的外部电路图案; 并在刚性区域中施加阻焊剂以暴露部分外部电路图案。 与柔性区域中的通孔相邻的区域包括用于覆盖覆盖层的附加电镀部分。
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公开(公告)号：US20210185806A1
公开(公告)日：2021-06-17
申请号：US16849622
申请日：2020-04-15
发明人： Jung Soo Kim , Ha Il Kim , Seok Jun Ahn , Soo Ah Lee
摘要： A printed circuit board includes an internal insulating layer, an internal conductive pattern layer disposed on the internal insulating layer and including a line portion and a bonding pad portion, and an external insulating layer disposed on the internal conductive pattern layer and the internal insulating layer and having an accommodation groove extending therethrough to expose the bonding pad portion. The bonding pad portion includes a connection pattern extending from the line portion of the internal conductive pattern layer embedded in the external insulating layer, and exposed to the accommodation groove; a land pattern disposed closer to a center portion of the accommodation groove than the connection pattern; and a dam pattern connecting the connection pattern and the land pattern, in which a line width of the dam pattern is narrower than a line width of the land pattern.
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公开(公告)号：US10034368B2
公开(公告)日：2018-07-24
申请号：US15285390
申请日：2016-10-04
发明人： Yang Je Lee , Jae Ho Shin , Ha Il Kim , Dek Gin Yang
摘要： The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.
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公开(公告)号：US09674968B2
公开(公告)日：2017-06-06
申请号：US14695712
申请日：2015-04-24
发明人： Ha Il Kim , Dong Gi An , Su Hyun Park , Young Man Kim , Jong Hyung Kim , Kyung Chul Yu
CPC分类号： H05K3/4691 , H05K1/0278 , H05K1/028 , H05K1/0298 , H05K1/181 , H05K3/10 , H05K3/30 , H05K2201/05 , H05K2201/09018 , H05K2201/09127 , Y10T29/49126 , Y10T29/49131 , Y10T29/49156
摘要： There are provided a rigid flexible printed circuit board and a method of manufacturing the same. The rigid flexible printed circuit board according to an exemplary embodiment of the present disclosure includes: a flexible board including a flexible region, a first rigid region formed at one side of the flexible region, and a second rigid region formed at the other side of the flexible region; a first rigid board formed on the flexible board and formed in the first rigid region and the second rigid region; and a second rigid board formed below the flexible board and formed in the first rigid region.
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公开(公告)号：US09338899B2
公开(公告)日：2016-05-10
申请号：US14106013
申请日：2013-12-13
发明人： Yang Je Lee , Il Woon Shin , Going Sik Kim , Doo Pyo Hong , Ha Il Kim , Dong Gi An
CPC分类号： H05K3/429 , H05K1/0218 , H05K3/0035 , H05K3/281 , H05K3/4644 , H05K3/4652 , H05K3/4664 , H05K3/4691 , H05K2201/0195 , H05K2201/0715 , H05K2201/09509 , H05K2203/054 , H05K2203/0554 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49169 , Y10T29/49171
摘要： A method of manufacturing a rigid-flexible printed circuit board includes providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns and a first window are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the base substrate; forming a via hole in the rigid region, and, simultaneously, forming a via hole to correspond to the first window in a flexible region; forming outer circuit patterns including areas adjacent to the first window; and applying solder resists in the rigid region to expose portions of external circuit patterns. The region adjacent to the via holes in the flexible region includes additional plating portions for covering the coverlays.
摘要翻译： 一种刚性柔性印刷电路板的制造方法，其特征在于，在其两侧分别形成有内层电路图案和第一窗口的柔性铜箔层叠体的两面分别形成有覆盖层的基板， 在作为基底基板的刚性区域的覆盖层的部分上分层绝缘层和铜箔层; 在刚性区域中形成通孔，同时在柔性区域中形成与第一窗口对应的通孔; 形成包括与所述第一窗口相邻的区域的外部电路图案; 并在刚性区域中施加阻焊剂以暴露部分外部电路图案。 与柔性区域中的通孔相邻的区域包括用于覆盖覆盖层的附加电镀部分。
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