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1.发明授权公开(公告)号：US09521760B2
公开(公告)日：2016-12-13
申请号：US14282490
申请日：2014-05-20
发明人： Yang Je Lee , Jee Hoon Kim , Jae Ho Shin , Hyung Ju Cho
IPC分类号： H05K3/46
CPC分类号： H05K3/4691 , Y10T156/10
摘要： A rigid flexible printed circuit board, having a rigid region and a flexible region, includes, in one embodiment: a base substrate including a portion in the rigid region and a portion in the flexible region; a coverlay formed on the base substrate; a first insulating layer formed on the coverlay and formed in the rigid region; a second insulating layer formed on the first insulating layer; and an outer layer circuit layer formed on the second insulating layer. Also described is a method of manufacturing a rigid flexible printed circuit board having a rigid region and a flexible region.
摘要翻译： 具有刚性区域和柔性区域的刚性柔性印刷电路板在一个实施例中包括：基底衬底，其包括刚性区域中的一部分和柔性区域中的一部分; 覆盖层，形成在基底基板上; 形成在所述覆盖层上并形成在所述刚性区域中的第一绝缘层; 形成在所述第一绝缘层上的第二绝缘层; 以及形成在第二绝缘层上的外层电路层。 还描述了制造具有刚性区域和柔性区域的刚性柔性印刷电路板的方法。
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2.发明申请METHOD OF MANUFACTURING SUBSTRATE FOR LED MODULE AND SUBSTRATE FOR LED MODULE MANUFACTURED BY THE SAME 审中-公开用于LED模块的基板的制造方法及其制造的LED模块的基板公开(公告)号：US20130256709A1
公开(公告)日：2013-10-03
申请号：US13793828
申请日：2013-03-11
发明人： Yang Je Lee , Cheol Ho Heo , Dek Gin Yang , Kyoung Hwan Lim
CPC分类号： H01L33/08 , H01L21/02 , H01L33/62 , H01L2924/0002 , H05K3/0061 , H05K3/0097 , H05K3/06 , H05K2201/09063 , H05K2201/10106 , H05K2201/2054 , H05K2203/0156 , H01L2924/00
摘要： Disclosed herein are a method of manufacturing a substrate for an LED module and a substrate for an LED module manufactured by the same, including: providing a base substrate having metal layers formed on both surfaces thereof; forming circuit patterns on the metal layers; applying a solder resist layer onto the circuit patterns; forming a through hole penetrating through the base substrate; separating the base substrate up and down; and bonding each of the separated base substrates to a parent substrate, thereby preventing light reflectivity of a parent substrate from being degraded due to a resist applying process and a surface treatment process.
摘要翻译： 本发明公开了一种制造LED模块用基板的方法及其制造的LED模块用基板的制造方法，其特征在于，具备：在其两面形成有金属层的基板; 在金属层上形成电路图案; 将阻焊层施加到电路图案上; 形成穿过基底基板的通孔; 上下分离基板; 并且将每个分离的基底基板粘合到母基板，从而防止由于抗蚀剂施加工艺和表面处理工艺而使母基板的光反射率降低。
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3.发明申请METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURED VIA THE SAME 审中-公开制造多层印刷电路板的方法和通过其制造的多层印刷电路板公开(公告)号：US20130256010A1
公开(公告)日：2013-10-03
申请号：US13793618
申请日：2013-03-11
发明人： Jae Youb JUNG , Yang Je Lee
CPC分类号： H05K3/4644 , H05K1/09 , H05K1/115 , H05K3/421 , H05K2201/09518 , H05K2201/09527
摘要： Disclosed herein are a method of manufacturing a multilayer printed circuit board (PCB), a via which is an inner via hole (IVH) having a stable structure so as to easily form a fine pattern, thereby thinning a product, and a multilayer PCB manufactured via the same. The method includes preparing a base substrate including copper foils formed on opposite surfaces or a single surface of the base substrate; forming an insulating layer on the base substrate via a coating process; processing a via hole through the insulating layer formed on the base substrate up to the base substrate; performing fill plating on the via hole; and stacking at least one circuit layer on a metal layer that is formed via the fill plating.
摘要翻译： 本文公开了一种制造多层印刷电路板（PCB）的方法，通孔是具有稳定结构的内部通孔（IVH），以便容易地形成精细图案，从而使产品变薄，制造多层PCB 通过相同 该方法包括制备包括在相对表面上形成的铜箔或基底基板的单个表面的基底基板; 通过涂覆工艺在基底基板上形成绝缘层; 处理穿过形成在基底基板上的绝缘层直到基底的通孔; 在通孔上进行填充电镀; 并且在经由填充电镀形成的金属层上堆叠至少一个电路层。
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公开(公告)号：US09955580B2
公开(公告)日：2018-04-24
申请号：US15228304
申请日：2016-08-04
发明人： Yang Je Lee , Jae Ho Shin , Dek Gin Yang
CPC分类号： H05K1/0278 , H05K1/0298 , H05K1/118 , H05K3/0026 , H05K3/0058 , H05K3/02 , H05K3/027 , H05K3/285 , H05K3/4644 , H05K3/4691 , H05K2201/0154 , Y10T156/10 , Y10T156/1064 , Y10T156/1082
摘要： A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.
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公开(公告)号：US20130343013A1
公开(公告)日：2013-12-26
申请号：US13921685
申请日：2013-06-19
发明人： Gi Suk Kim , Yang Je Lee , Hee Ju Park , Jong Hyung Kim , Chang Hyun Kim , Kyeong Seon Chae
CPC分类号： H05K1/148 , H04M1/026 , H05K1/0277 , H05K1/0278 , H05K1/0298 , H05K1/0346 , H05K1/14 , H05K3/0017 , H05K3/4691 , H05K5/0026 , H05K2201/0154
摘要： Disclosed herein is a portable terminal, including: a case; a first substrate disposed at one side of the case; a second substrate spaced from the first substrate to form a battery installing space; and a connection substrate electrically connecting between the first substrate and the second substrate and disposed in parallel with a side of the case.
摘要翻译： 本文公开了一种便携式终端，包括：壳体; 设置在所述壳体的一侧的第一基板; 与所述第一基板间隔开以形成电池安装空间的第二基板; 以及连接基板，电连接在第一基板和第二基板之间并与壳体的一侧平行设置。
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公开(公告)号：US20230187830A1
公开(公告)日：2023-06-15
申请号：US17747659
申请日：2022-05-18
发明人： Yang Je Lee , Je Sang Park , Chang Gun Oh , Sang Ho Jeong , Hyun Kyung Park
CPC分类号： H01Q9/0407 , H05K1/115 , H05K1/0243 , H01Q1/22
摘要： An antenna substrate includes a body in which a plurality of insulating layers are stacked, a first antenna layer including a plurality of first pattern layers disposed on the plurality of insulating layers and a plurality of first conductive via layer penetrating through the plurality of insulating layers to connect the plurality of first pattern layers in a stacking direction of the plurality of insulating layers and having a bar shape, and a second antenna layer extending from at least one of an uppermost portion or a lowermost portion of the first antenna layer on the insulating layer of the body.
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公开(公告)号：US10602616B2
公开(公告)日：2020-03-24
申请号：US16438755
申请日：2019-06-12
发明人： Yang Je Lee , Dek Gin Yang , Dong Gi An , Jae Ho Shin
摘要： The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
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公开(公告)号：US10368445B2
公开(公告)日：2019-07-30
申请号：US15398803
申请日：2017-01-05
发明人： Yang Je Lee , Dek Gin Yang , Dong Gi An , Jae Ho Shin
摘要： The present invention provides a multilayer rigid flexible printed circuit board including: a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern; and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
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公开(公告)号：US10299373B2
公开(公告)日：2019-05-21
申请号：US16118558
申请日：2018-08-31
发明人： Yang Je Lee , Jae Ho Shin , Dek Gin Yang
摘要： A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.
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公开(公告)号：US09706658B2
公开(公告)日：2017-07-11
申请号：US15134055
申请日：2016-04-20
发明人： Gi Suk Kim , Yang Je Lee , Hee Ju Park , Jong Hyung Kim , Chang Hyun Kim , Kyeong Seon Chae
CPC分类号： H05K1/148 , H04M1/026 , H05K1/0277 , H05K1/0278 , H05K1/0298 , H05K1/0346 , H05K1/14 , H05K3/0017 , H05K3/4691 , H05K5/0026 , H05K2201/0154
摘要： Disclosed herein is a portable terminal, including: a case; a first substrate disposed at one side of the case; a second substrate spaced from the first substrate to form a battery installing space; and a connection substrate electrically connecting between the first substrate and the second substrate and disposed in parallel with a side of the case.
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