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1.发明授权公开(公告)号：US09521760B2
公开(公告)日：2016-12-13
申请号：US14282490
申请日：2014-05-20
发明人： Yang Je Lee , Jee Hoon Kim , Jae Ho Shin , Hyung Ju Cho
IPC分类号： H05K3/46
CPC分类号： H05K3/4691 , Y10T156/10
摘要： A rigid flexible printed circuit board, having a rigid region and a flexible region, includes, in one embodiment: a base substrate including a portion in the rigid region and a portion in the flexible region; a coverlay formed on the base substrate; a first insulating layer formed on the coverlay and formed in the rigid region; a second insulating layer formed on the first insulating layer; and an outer layer circuit layer formed on the second insulating layer. Also described is a method of manufacturing a rigid flexible printed circuit board having a rigid region and a flexible region.
摘要翻译： 具有刚性区域和柔性区域的刚性柔性印刷电路板在一个实施例中包括：基底衬底，其包括刚性区域中的一部分和柔性区域中的一部分; 覆盖层，形成在基底基板上; 形成在所述覆盖层上并形成在所述刚性区域中的第一绝缘层; 形成在所述第一绝缘层上的第二绝缘层; 以及形成在第二绝缘层上的外层电路层。 还描述了制造具有刚性区域和柔性区域的刚性柔性印刷电路板的方法。
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2.发明申请公开(公告)号：US20140345911A1
公开(公告)日：2014-11-27
申请号：US14282490
申请日：2014-05-20
发明人： Yang Je LEE , Jee Hoon Kim , Jae Ho Shin , Hyung Ju Cho
CPC分类号： H05K3/4691 , Y10T156/10
摘要： A rigid flexible printed circuit board, having a rigid region and a flexible region, includes, in one embodiment: a base substrate including a portion in the rigid region and a portion in the flexible region; a coverlay formed on the base substrate; a first insulating layer formed on the coverlay and formed in the rigid region; a second insulating layer formed on the first insulating layer; and an outer layer circuit layer formed on the second insulating layer. Also described is a method of manufacturing a rigid flexible printed circuit board having a rigid region and a flexible region.
摘要翻译： 具有刚性区域和柔性区域的刚性柔性印刷电路板在一个实施例中包括：基底衬底，其包括刚性区域中的一部分和柔性区域中的一部分; 覆盖层，形成在基底基板上; 形成在所述覆盖层上并形成在所述刚性区域中的第一绝缘层; 形成在所述第一绝缘层上的第二绝缘层; 以及形成在第二绝缘层上的外层电路层。 还描述了制造具有刚性区域和柔性区域的刚性柔性印刷电路板的方法。
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公开(公告)号：US20240179830A1
公开(公告)日：2024-05-30
申请号：US18106129
申请日：2023-02-06
发明人： Jae Woong Choi , Jae Ho Shin
CPC分类号： H05K1/0224 , H05K1/115 , H05K3/107 , H05K3/188 , H05K2201/09036 , H05K2201/096
摘要： The present disclosure relates to a printed circuit board. The printed circuit board includes a plurality of insulating layers each having a plurality of concave portions; a plurality of conductor pattern layers disposed in a plurality of concave portions of each of the plurality of insulating layers; first and second via holes connected to one of the plurality of concave portions independently of each other and penetrating through at least two of the plurality of insulating layers independently of each other; and first and second via conductors disposed in the first and second via holes, respectively, and connecting two of the plurality of conductor pattern layers independently of each other. An average width of the first via conductor is greater than that of the second via conductor on a cross-section.
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公开(公告)号：US20240155771A1
公开(公告)日：2024-05-09
申请号：US18101660
申请日：2023-01-26
发明人： Jae Ho Shin
CPC分类号： H05K1/186 , H05K1/0298 , H05K1/116 , H05K3/32 , H05K3/4007 , H05K2201/096 , H05K2203/1105 , H05K2203/1305
摘要： A printed circuit board and a method of manufacturing the same are disclosed. The printed circuit board includes: a first core layer including a first insulating layer and a first core; a second core layer including a second insulating layer and a second core; a first element embedded in the first core; a second element embedded in the second core; a first pad and a second pad disposed on the first core layer and connected to the first element; a third pad and a fourth pad disposed on the second core layer and connected to the second element; and first connection layers interposed between one surface of the first core layer and one surface of the second core layer. The first pad and the third pad contact each other, and the first connection layers include at least one material of SiO2, SiN, and SiCN.
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公开(公告)号：US20230140708A1
公开(公告)日：2023-05-04
申请号：US17697162
申请日：2022-03-17
发明人： Jae Ho Shin , Ga Young An
摘要： An electronic component embedded substrate includes: a core layer having a first through portion; an electronic component module including at least one electronic component and a metal layer surrounding at least a portion of the electronic component and disposed in the first penetration portion; and a first encapsulant disposed on the core layer, disposed in at least a portion of the first through portion, and covering at least a portion of the electronic component module.
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公开(公告)号：US11483422B2
公开(公告)日：2022-10-25
申请号：US16788073
申请日：2020-02-11
发明人： Jae Ho Shin
摘要： The present disclosure relates to a printed circuit and an electronic device including the same. The printed circuit board includes a first substrate having a through portion, a second substrate disposed in the through portion of the first substrate, and in which at least a portion of a side surface thereof is surrounded by the first substrate, and a flexible substrate disposed in the through portion of the first substrate and connecting the first and second substrates.
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公开(公告)号：US10034368B2
公开(公告)日：2018-07-24
申请号：US15285390
申请日：2016-10-04
发明人： Yang Je Lee , Jae Ho Shin , Ha Il Kim , Dek Gin Yang
摘要： The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.
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公开(公告)号：US09005456B2
公开(公告)日：2015-04-14
申请号：US14070291
申请日：2013-11-01
发明人： Kwang Sun You , Seung Ryeol Lee , Sang Hoon Park , Kyung Jin Heo , Jae Ho Shin , Joong Hyuk Jung
CPC分类号： H05K3/007 , H05K3/0032 , H05K3/4007 , H05K3/4652 , H05K3/4697 , H05K2201/09472 , H05K2203/061 , H05K2203/308
摘要： Disclosed herein is a method for manufacturing a printed circuit board, wherein a protective film for stripping and a metal layer closely adhered to the protective film for stripping are formed on an inner layer pad to protect the inner layer pad at the time of laser processing related to cavity processing and applying an etchant, thereby making it possible to improve reliability of a product.
摘要翻译： 本发明公开了一种制造印刷电路板的方法，其中在内层衬垫上形成用于剥离的保护膜和紧密附着在剥离用保护膜上的金属层，以在激光加工时保护内层衬垫 对腔体加工和施加蚀刻剂，从而可以提高产品的可靠性。
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9.发明申请MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开多层刚性柔性印刷电路板及其制造方法公开(公告)号：US20140008107A1
公开(公告)日：2014-01-09
申请号：US14024115
申请日：2013-09-11
发明人： Yang Je Lee , Dek Gin Yang , Dong Gi An , Jae Ho Shin
CPC分类号： H05K3/06 , H05K1/0218 , H05K1/0278 , H05K1/028 , H05K1/09 , H05K3/0035 , H05K3/281 , H05K3/386 , H05K3/4644 , H05K3/4652 , H05K3/4691 , H05K2201/0154 , H05K2201/0187 , H05K2201/0707 , H05K2203/0554 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165
摘要： A multilayer rigid flexible printed circuit board including a flexible region including a flexible film having a circuit pattern formed on one or both surfaces thereof and a laser blocking layer formed on the circuit pattern and a rigid region formed adjacent to the flexible region and including a plurality of pattern layers on one or both surfaces of extended portions extended to both sides of the flexible film of the flexible region, and a method for manufacturing the same.
摘要翻译： 一种多层刚性柔性印刷电路板，包括柔性区域，该柔性区域包括在其一个或两个表面上形成有电路图案的柔性膜，以及形成在电路图案上的激光阻挡层和邻近柔性区域形成的包含多个 在延伸部分延伸到柔性区域的柔性膜的两侧的一个或两个表面上的图案层及其制造方法。
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公开(公告)号：US11259404B2
公开(公告)日：2022-02-22
申请号：US16811146
申请日：2020-03-06
发明人： Jun Oh Hwang , Jae Ho Shin , Yun Je Ji
摘要： A printed circuit board includes a first rigid region and a flexible region, connected to the first rigid region and adjacent thereto in a first direction. The first rigid region has a thickness greater than a thickness of the flexible region, and the flexible region has a plurality of curved portions.
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