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公开(公告)号：US09383879B2
公开(公告)日：2016-07-05
申请号：US14457101
申请日：2014-08-11
发明人： Hyun Chul Jung , Sang Hoon Park , Jang Bae Son , Tae Hoon Kim
CPC分类号： G06F3/044 , G06F2203/04112
摘要： Disclosed herein is a touch sensor using a metal electrode. More specifically, the present invention relates to a touch sensor capable of implementing reliability of the metal electrode and having economical efficiency even under a condition of high temperature and humidity by forming a first protection layer including a heterocycle compound on metal fine lines forming the electrode pattern.
摘要翻译： 这里公开了使用金属电极的触摸传感器。 更具体地说，本发明涉及一种能够实现金属电极的可靠性并且即使在高温和高湿条件下也具有经济效益的触摸传感器，其通过在形成电极图案的金属细线上形成包含杂环化合物的第一保护层 。
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公开(公告)号：US09005456B2
公开(公告)日：2015-04-14
申请号：US14070291
申请日：2013-11-01
发明人： Kwang Sun You , Seung Ryeol Lee , Sang Hoon Park , Kyung Jin Heo , Jae Ho Shin , Joong Hyuk Jung
CPC分类号： H05K3/007 , H05K3/0032 , H05K3/4007 , H05K3/4652 , H05K3/4697 , H05K2201/09472 , H05K2203/061 , H05K2203/308
摘要： Disclosed herein is a method for manufacturing a printed circuit board, wherein a protective film for stripping and a metal layer closely adhered to the protective film for stripping are formed on an inner layer pad to protect the inner layer pad at the time of laser processing related to cavity processing and applying an etchant, thereby making it possible to improve reliability of a product.
摘要翻译： 本发明公开了一种制造印刷电路板的方法，其中在内层衬垫上形成用于剥离的保护膜和紧密附着在剥离用保护膜上的金属层，以在激光加工时保护内层衬垫 对腔体加工和施加蚀刻剂，从而可以提高产品的可靠性。
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公开(公告)号：US20150090578A1
公开(公告)日：2015-04-02
申请号：US14132559
申请日：2013-12-18
发明人： Jang Bae SON , Kang Heon Hur , Sang Hoon Park , Hyun Chul Jung
IPC分类号： H03K17/96
CPC分类号： G06F3/044 , G06F2203/04103
摘要： There is provided a touch panel including: a substrate; mesh pattern electrodes formed on the substrate; and hard coating layers formed on the substrate and filling air gaps of the mesh pattern electrode.
摘要翻译： 提供了一种触摸面板，包括：基板; 形成在基板上的网状图案电极; 以及形成在基板上并填充网状图案电极的空气间隙的硬涂层。
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公开(公告)号：US20140254121A1
公开(公告)日：2014-09-11
申请号：US14158127
申请日：2014-01-17
IPC分类号： H05K1/02
CPC分类号： H05K1/0271 , H05K1/113 , H05K3/3436 , H05K2201/09781 , H05K2201/10674
摘要： Disclosed herein is a printed circuit board having an insulating layer crack preventing port. The printed circuit board includes: an insulating layer part having at least one pair of insulating layers stacked therein; circuit patterns formed on the insulating layers, respectively; and crack preventing ports formed at positions at which they are not affected by the respective circuit patterns of the insulating layer part and supporting the insulating layer part from external impact.
摘要翻译： 这里公开了具有绝缘层防裂口的印刷电路板。 印刷电路板包括：绝缘层部分，其中堆叠有至少一对绝缘层; 分别形成在绝缘层上的电路图案; 以及形成在不受绝缘层部分的各个电路图案影响的位置处形成的防裂端口，并且支撑绝缘层部件免受外部冲击。
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公开(公告)号：US20140124474A1
公开(公告)日：2014-05-08
申请号：US14070291
申请日：2013-11-01
发明人： Kwang Sun You , Seung Ryeol Lee , Sang Hoon Park , Kyung Jin Heo , Jae Ho Shin , Joong Hyuk Jung
IPC分类号： H05K3/00
CPC分类号： H05K3/007 , H05K3/0032 , H05K3/4007 , H05K3/4652 , H05K3/4697 , H05K2201/09472 , H05K2203/061 , H05K2203/308
摘要： Disclosed herein is a method for manufacturing a printed circuit board, wherein a protective film for stripping and a metal layer closely adhered to the protective film for stripping are formed on an inner layer pad to protect the inner layer pad at the time of laser processing related to cavity processing and applying an etchant, thereby making it possible to improve reliability of a product.
摘要翻译： 本发明公开了一种制造印刷电路板的方法，其中在内层衬垫上形成用于剥离的保护膜和紧密附着在剥离用保护膜上的金属层，以在激光加工时保护内层衬垫 对腔体加工和施加蚀刻剂，从而可以提高产品的可靠性。
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