Abstract:
An manufacturing method of a display device may include the following steps: forming a transistor on a substrate; forming an insulating layer on the transistor; forming a conductive layer including silver on the insulating layer; forming a photosensitive member on the conductive layer; forming an electrode of a light-emitting element by etching the conductive layer; performing plasma treatment on a structure that comprises the electrode, the plasma treatment using a gas including a halogen; and removing a product that is resulted from the plasma treatment.
Abstract:
An manufacturing method of a display device may include the following steps: forming a transistor on a substrate; forming an insulating layer on the transistor; forming a conductive layer including silver on the insulating layer; forming a photosensitive member on the conductive layer; forming an electrode of a light-emitting element by etching the conductive layer; performing plasma treatment on a structure that comprises the electrode, the plasma treatment using a gas including a halogen; and removing a product that is resulted from the plasma treatment.
Abstract:
A display device includes: a first pixel electrode disposed in a first emission area, on a substrate; an insulating layer covering edges of the first pixel electrode; a first light-emitting layer disposed on the first pixel electrode and the insulating layer; a first common electrode disposed on the first light-emitting layer; banks disposed on the insulating layer and surrounding the first emission area; and a first organic pattern surrounding the first emission area, disposed on the banks, and including the same material as the first light-emitting layer. Side surfaces of each of the banks are spaced apart from side surfaces of the insulating layer.
Abstract:
A display device includes the following elements: a semiconductor layer positioned on a substrate; a first gate insulating layer positioned on the semiconductor layer; a first gate conductive layer positioned on the first gate insulating layer; a second gate insulating layer positioned on the first gate conductive layer; a second gate conductive layer positioned on the second gate insulating layer; a first insulating layer positioned on the second gate conductive layer; a first contact hole passing through the first insulating layer, the second gate insulating layer, and the first gate insulating layer; a second contact hole passing through the first insulating layer; and a third contact hole passing through the first insulating layer and the second gate insulating layer. A cross-section of the first insulating layer in a plane perpendicular to the substrate has a curved profile.
Abstract:
There is provided a method of manufacturing an oxide thin film transistor (TFT). The method includes forming a gate electrode on a substrate, forming a gate insulating layer on the gate electrode, forming an oxide semiconductor layer including a channel layer on the gate insulating layer, forming a source electrode and a drain electrode separated from each other on the oxide semiconductor layer, first plasma processing the substrate on which the source electrode and the drain electrode are formed at a carbon (C) atmosphere, secondly plasma processing the substrate at a nitrogen oxide atmosphere, and sequentially forming a first protective layer and a second protective layer on the substrate.
Abstract:
A display device includes a display area, anon-display area, and a pad part in the non-display area and exposed to outside the display device. The pad part includes a conductive part, and an insulating part defining an opening exposing the conductive part to outside the pad part. The insulating part includes in order from the conductive part a first insulating layer defining a first opening, and a second insulating layer facing the first insulating layer and defining a second opening which is wider than the first opening.
Abstract:
A light emitting display device includes a substrate, a transistor, a first insulating layer, a second insulating layer, a pixel electrode, a conductive member, a third insulating layer, and a light emitting material layer. The transistor overlaps the substrate. The first insulating layer overlaps the transistor. The second insulating layer overlaps the first insulating layer. The pixel electrode directly contacts the second insulating layer and is electrically connected to the transistor. The conductive member directly contacts at least one of the first insulating layer and the second insulating layer. The third insulating layer overlaps the second insulating layer, includes a hole, and includes an opening. The hole exposes the pixel electrode. The opening exposes the conductive member. The light emitting material layer overlaps the pixel electrode inside the hole, overlaps the third insulating layer, and has a discontinuity inside the opening.
Abstract:
A transistor array panel is manufactured by a method that reduces or obviates the need for highly selective etching agents or complex processes requiring multiple photomasks to create contact holes. The panel includes: a substrate; a buffer layer positioned on the substrate; a semiconductor layer positioned on the buffer layer; an intermediate insulating layer positioned on the semiconductor layer; and an upper conductive layer positioned on the intermediate insulating layer, wherein the semiconductor layer includes a first contact hole, the intermediate insulating layer includes a second contact hole positioned in an overlapping relationship with the first contact hole, and the upper conductive layer is in contact with a side surface of the semiconductor layer in the first contact hole.
Abstract:
A display device may include a substrate, an active pattern layer, a gate insulating layer, a first metal pattern layer, an interlayer insulating layer, a second metal pattern layer, and a passivation film. The active pattern layer may be disposed on the substrate. The gate insulating layer may be disposed on the active pattern layer. The first metal pattern layer may be disposed on the gate insulating layer. The interlayer insulating layer may be disposed on the first metal pattern layer. The second metal pattern layer may be disposed on the interlayer insulating layer. The passivation film may be disposed on the side wall of the second metal pattern layer.
Abstract:
A transparent electrode pattern includes a first electrode including a first lower conductive layer and a first upper conductive layer located on the first lower conductive layer and a second electrode spaced apart from the first electrode and including a second lower conductive layer and a second upper conductive layer positioned on the second lower conductive layer. The first and second lower conductive layers may include a metal nanowire. The first and second upper conductive layers may include a transparent conductive material that is dry-etchable.