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    Low-cost flexible film package module and method of manufacturing the same
    2.
    发明授权
    Low-cost flexible film package module and method of manufacturing the same 有权
    低成本的柔性薄膜封装模块及其制造方法

    公开(公告)号：US07109575B2

    公开(公告)日：2006-09-19

    申请号：US10862337

    申请日：2004-06-08

    申请人： Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

    发明人： Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

    IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/12 ,  H01L23/52 ,  H01L29/40

    CPC分类号： G02F1/13452 ,  H01L23/5387 ,  H01L2224/16 ,  H01L2924/07811 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/068 ,  H05K2201/10681 ,  H01L2924/00

    摘要： Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package module for specific applications. The lower-cost flexible film package module includes a tape film that combines both a first insulating substrate, typically formed from a higher-cost polyimide material, and a second insulating substrate, typically formed from an insulating material or materials that are less expensive and/or provide modified performance when compared with the first insulating material. Both the first and second substrates will include complementary circuit patterns that will be electrically and physically connected to allow the composite substrate to function as a unitary substrate. The first and second substrates will also include connection regions that may be adapted for connection to printed circuit boards and/or electronic devices such as liquid crystal displays.

    摘要翻译： 提供了一种柔性膜封装模块及其制造方法，其可以适于以更低成本制造和/或适应特定应用的柔性膜封装模块的特性。 较低成本的柔性膜封装模块包括一个胶带，其将通常由较高成本的聚酰亚胺材料形成的第一绝缘基板和通常由绝缘材料形成的第二绝缘基板或较便宜的材料和/ 或者与第一绝缘材料相比提供改进的性能。 第一和第二基板都将包括互补的电路图案，其将被电和物理连接，以允许复合基板作为整体基板。 第一和第二基板还将包括可适于连接到印刷电路板和/或诸如液晶显示器的电子设备的连接区域。

    Low-cost flexible film package module and method of manufacturing the same
    4.
    发明申请
    Low-cost flexible film package module and method of manufacturing the same 有权
    低成本的柔性薄膜封装模块及其制造方法

    公开(公告)号：US20050040504A1

    公开(公告)日：2005-02-24

    申请号：US10862337

    申请日：2004-06-08

    申请人： Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

    发明人： Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

    IPC分类号： H01L21/60 ,  G02F1/13 ,  G02F1/1345 ,  H01L23/538 ,  H05K1/11 ,  H05K1/14 ,  H01L23/02

    CPC分类号： G02F1/13452 ,  H01L23/5387 ,  H01L2224/16 ,  H01L2924/07811 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/068 ,  H05K2201/10681 ,  H01L2924/00

    摘要： Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package module for specific applications. The lower-cost flexible film package module includes a tape film that combines both a first insulating substrate, typically formed from a higher-cost polyimide material, and a second insulating substrate, typically formed from an insulating material or materials that are less expensive and/or provide modified performance when compared with the first insulating material. Both the first and second substrates will include complementary circuit patterns that will be electrically and physically connected to allow the composite substrate to function as a unitary substrate. The first and second substrates will also include connection regions that may be adapted for connection to printed circuit boards and/or electronic devices such as liquid crystal displays.

    摘要翻译： 提供了一种柔性膜封装模块及其制造方法，其可以适于以更低成本制造和/或适应特定应用的柔性膜封装模块的特性。 较低成本的柔性膜封装模块包括一个胶带，其将通常由较高成本的聚酰亚胺材料形成的第一绝缘基板和通常由绝缘材料形成的第二绝缘基板或较便宜的材料和/ 或者与第一绝缘材料相比提供改进的性能。 第一和第二基板都将包括互补的电路图案，其将被电和物理连接，以允许复合基板作为整体基板。 第一和第二基板还将包括可适于连接到印刷电路板和/或诸如液晶显示器的电子设备的连接区域。

    Low-cost flexible film package module and method of manufacturing the same
    5.
    发明申请
    Low-cost flexible film package module and method of manufacturing the same 审中-公开

    公开(公告)号：US20060268213A1

    公开(公告)日：2006-11-30

    申请号：US11501883

    申请日：2006-08-10

    申请人： Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

    发明人： Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

    IPC分类号： G02F1/1345

    CPC分类号： G02F1/13452 ,  H01L23/5387 ,  H01L2224/16 ,  H01L2924/07811 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/068 ,  H05K2201/10681 ,  H01L2924/00

    摘要： Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package module for specific applications. The lower-cost flexible film package module includes a tape film that combines both a first insulating substrate, typically formed from a higher-cost polyimide material, and a second insulating substrate, typically formed from an insulating material or materials that are less expensive and/or provide modified performance when compared with the first insulating material. Both the first and second substrates will include complementary circuit patterns that will be electrically and physically connected to allow the composite substrate to function as a unitary substrate. The first and second substrates will also include connection regions that may be adapted for connection to printed circuit boards and/or electronic devices such as liquid crystal displays.

    METHOD OF FABRICATING FILM CIRCUIT SUBSTRATE AND METHOD OF FABRICATING CHIP PACKAGE INCLUDING THE SAME
    7.
    发明申请
    METHOD OF FABRICATING FILM CIRCUIT SUBSTRATE AND METHOD OF FABRICATING CHIP PACKAGE INCLUDING THE SAME 审中-公开
    制造薄膜电路基板的方法及其制造方法

    公开(公告)号：US20120021600A1

    公开(公告)日：2012-01-26

    申请号：US13184810

    申请日：2011-07-18

    申请人： Sang-Uk Han ,  Dae-Woo Son ,  Kwan-Jai Lee ,  Ye-Chung Chung ,  Jeong-Kyu Ha ,  Yun-Young Kim

    发明人： Sang-Uk Han ,  Dae-Woo Son ,  Kwan-Jai Lee ,  Ye-Chung Chung ,  Jeong-Kyu Ha ,  Yun-Young Kim

    IPC分类号： H01L21/283

    CPC分类号： H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of fabricating a film circuit substrate and a method of fabricating a chip package. The method of fabricating a film circuit substrate can include providing a base film including a chip packaging area to package a chip and a separation area to separate the two chip packaging areas from each other, the separation area including a cut area and an uncut area; forming a reserve interconnection pattern having a first height on the base film; and forming an interconnection pattern having a second height that is lower than the first height on the out area by selectively etching the reserve interconnection pattern of the cut area.

    摘要翻译： 薄膜电路基板的制造方法以及芯片封装的制造方法。 制造薄膜电路基板的方法可以包括提供包括芯片封装区域以包装芯片的基膜和分离区域，以将两个芯片封装区域彼此分离，分离区域包括切割区域和未切割区域; 在基膜上形成具有第一高度的保留互连图案; 以及通过选择性地蚀刻所述切割区域的预留互连图案，形成具有低于所述外部区域上的所述第一高度的第二高度的互连图案。

    Tape package having test pad on reverse surface and method for testing the same
    10.
    发明授权
    Tape package having test pad on reverse surface and method for testing the same 有权
    带背面测试垫的磁带包装及其测试方法

    公开(公告)号：US07217990B2

    公开(公告)日：2007-05-15

    申请号：US10753828

    申请日：2004-01-05

    申请人： Ye-Chung Chung

    发明人： Ye-Chung Chung

    IPC分类号： H01L23/495

    CPC分类号： H01L22/32 ,  H01L23/49572 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0268 ,  H05K1/0393 ,  H05K2201/0949 ,  H05K2203/1545

    摘要： A tape package in which a test pad is formed on a reverse surface is provided. The test pad is disposed on a reverse surface of a base film through a through hole of the base film. Accordingly, shapes of the test pads are standardized so that a universal probe card can be used. A pitch between the test pads is wide so that the accuracy in an electric test of the tape package is increased. A total length of the tape package is reduced.

    摘要翻译： 提供其中在反面上形成测试垫的带包装。 测试垫通过基膜的通孔设置在基膜的反面上。 因此，测试垫的形状被标准化，使得可以使用通用探针卡。 测试垫之间的间距是宽的，使得磁带封装的电测试的精度提高。 磁带封装的总长度减小。