Solid-state imaging element and solid-state imaging device

    公开(公告)号:US11910624B2

    公开(公告)日:2024-02-20

    申请号:US18081889

    申请日:2022-12-15

    IPC分类号: H10K30/30 H10K39/32

    CPC分类号: H10K30/353 H10K39/32

    摘要: A solid-state imaging element including: a photoelectric conversion layer, a first electrode and a second electrode opposed to each other with the photoelectric conversion layer interposed therebetween, a semiconductor layer provided between the first electrode and the photoelectric conversion layer, an accumulation electrode opposed to the photoelectric conversion layer with the semiconductor layer interposed therebetween, an insulating film provided between the accumulation electrode and the semiconductor layer, and a barrier layer provided between the semiconductor layer and the photoelectric conversion layer.

    Solid-state imaging element and solid-state imaging device

    公开(公告)号:US11552268B2

    公开(公告)日:2023-01-10

    申请号:US16979992

    申请日:2019-03-04

    IPC分类号: H01L51/42 H01L27/30

    摘要: A solid-state imaging element including: a photoelectric conversion layer, a first electrode and a second electrode opposed to each other with the photoelectric conversion layer interposed therebetween, a semiconductor layer provided between the first electrode and the photoelectric conversion layer, an accumulation electrode opposed to the photoelectric conversion layer with the semiconductor layer interposed therebetween, an insulating film provided between the accumulation electrode and the semiconductor layer, and a barrier layer provided between the semiconductor layer and the photoelectric conversion layer.

    Imaging element, laminated imaging element, and solid-state imaging device

    公开(公告)号:US11101303B2

    公开(公告)日:2021-08-24

    申请号:US16639406

    申请日:2018-05-11

    IPC分类号: H01L27/146

    摘要: An imaging element (photoelectric conversion element) includes a photoelectric conversion unit formed by laminating a first electrode 21, a photoelectric conversion layer 23A, and a second electrode 22. Between the first electrode 21 and the photoelectric conversion layer 23A, a composite oxide layer 23B containing indium-gallium-zinc composite oxide is formed. The composite oxide layer 23B includes a first layer 23B1 adjacent to the first electrode 21 and a second layer 23B2 adjacent to the photoelectric conversion layer 23A. The first layer 23B1 has a higher indium composition than the second layer 23B2, or the first layer 23B1 has a higher gallium composition than the second layer 23B2, or the first layer 23B1 has a higher zinc composition than the second layer 23B2.

    Photoelectric conversion element, Method of manufacturing the same, solid state image sensor, electronic device, and solar cell

    公开(公告)号:US11264580B2

    公开(公告)日:2022-03-01

    申请号:US15773675

    申请日:2016-11-10

    发明人: Yukio Kaneda

    摘要: The present technology relates to, in a photoelectric conversion element using a photoelectric conversion film, the photoelectric conversion element and a method of manufacturing the same, a solid state image sensor, an electronic device, and a solar cell, for enabling improvement of quantum efficiency. The photoelectric conversion element includes two electrodes constituting an anode and a cathode, and a photoelectric conversion layer arranged between the two electrodes, and at least one electrode side of the two electrodes is doped with an impurity at impurity density of 1e16/cm3 or more in the photoelectric conversion layer. The present technology can be applied to, for example, a solid state image sensor, an electronic device, a solar cell and the like.

    Solid-state image sensor for phase difference detection, method of manufacturing the same, and electronic device

    公开(公告)号:US11183530B2

    公开(公告)日:2021-11-23

    申请号:US16516871

    申请日:2019-07-19

    发明人: Yukio Kaneda

    摘要: A more preferable pixel for detecting a focal point may be formed by using a photoelectric converting film. A solid-state image sensor includes a first pixel including a photoelectric converting unit formed of a photoelectric converting film and first and second electrodes which interpose the same from above and below in which at least one of the first and second electrodes is a separated electrode separated for each pixel, and a second pixel including the photoelectric converting unit in which the separated electrode is formed to have a planar size smaller than that of the first pixel and a third electrode extending at least to a boundary of the pixel is formed in a region which is vacant due to a smaller planar size. The present disclosure is applicable to the solid-state image sensor and the like, for example.

    Solid-state imaging device and electronic apparatus

    公开(公告)号:US12125858B2

    公开(公告)日:2024-10-22

    申请号:US17755950

    申请日:2020-11-02

    IPC分类号: H01L27/146 H04N25/77

    摘要: A solid-state imaging device capable of achieving higher image quality is provided.
    Provided is a solid-state imaging device including a semiconductor substrate, a first photoelectric conversion unit that is provided above the semiconductor substrate and that converts light into charge, and a second photoelectric conversion unit that is provided above the first photoelectric conversion unit and that converts light into charge. Each of the first photoelectric conversion unit and the second photoelectric conversion unit includes at least a first electrode, a second electrode, and a photoelectric conversion film disposed between the first electrode and the second electrode. The first electrode of the second photoelectric conversion unit and a charge accumulation unit formed in the semiconductor substrate are electrically connected to each other via a conductive portion penetrating at least the first photoelectric conversion unit. An insulation film portion is disposed at least on a part of an outer circumference of the conductive portion. The insulation film portion includes at least one layer of an insulation film. The at least one layer of the insulation film has fixed charge of a type identical to a type of charge accumulated in the charge accumulation unit.

    Imaging device and solid-state image sensor

    公开(公告)号:US11532672B2

    公开(公告)日:2022-12-20

    申请号:US17252774

    申请日:2019-06-07

    摘要: An imaging device includes a first electrode, a charge accumulating electrode arranged with a space from the first electrode, an isolation electrode arranged with a space from the first electrode and the charge accumulating electrode and surrounding the charge accumulating electrode, a photoelectric conversion layer formed in contact with the first electrode and above the charge accumulating electrode with an insulating layer interposed therebetween, and a second electrode formed on the photoelectric conversion layer. The isolation electrode includes a first isolation electrode and a second isolation electrode arranged with a space from the first isolation electrode, and the first isolation electrode is positioned between the first electrode and the second isolation electrode.