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公开(公告)号:US12237357B2
公开(公告)日:2025-02-25
申请号:US17154421
申请日:2021-01-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Ji-Won Lee , Jeong-Jin Cho , Moo-Sup Lim , Sung-Young Seo , Hae-Won Lee
IPC: H01L27/146 , H04N25/77
Abstract: This disclosure relates to image sensors and electronic apparatuses including the same. An image sensor including: a pixel area including shared pixels, wherein each of the shared pixels includes at least two photodiodes that form a group and share a floating diffusion (FD) area; and a transistor (TR) area adjacent to the pixel area, wherein the TR area includes transistor sets corresponding to the shared pixels, wherein, when a first shared pixel and a second shared pixel are arranged adjacent to each other in a first direction, a first TR set corresponding to the first shared pixel and a second TR set corresponding to the second shared pixel share a source region of a first selection TR.
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公开(公告)号:US12237348B2
公开(公告)日:2025-02-25
申请号:US18546684
申请日:2022-02-22
Inventor: Hideaki Togashi , Kaori Takimoto , Masahiro Segami , Kei Nakagawa , Nobuhiro Kawai
IPC: H01L27/146 , H04N25/705 , H04N25/77
Abstract: Imaging devices and ranging devices are disclosed. In one example, an imaging device includes a semiconductor substrate, a first pixel array, a second pixel array, and a control unit. In the first pixel array, a first light receiving pixel on the semiconductor substrate has a stacked structure of a first electrode, a photoelectric conversion layer, and a second electrode (80). It photoelectrically converts light in a first wavelength region including the visible light region. In the second pixel array, a second light receiving pixel is provided at a position overlapping the first light receiving pixel in a thickness direction of the semiconductor substrate. It photoelectrically converts light in a second wavelength region including the infrared light region. The control unit drives and controls the second pixel array based on a signal photoelectrically converted by the first pixel array.
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公开(公告)号:US20250063271A1
公开(公告)日:2025-02-20
申请号:US18933217
申请日:2024-10-31
Applicant: Samsung Electronics Co., Ltd.
Inventor: Keun Joo PARK , Junseok KIM , Yohan ROH , Hyunsurk RYU , Jooyeon WOO , Hyunku LEE
IPC: H04N25/77 , G06F16/23 , G06F16/583 , H04N25/40 , H04N25/683 , H04N25/772 , H04N25/79 , H05B39/04 , H05B47/11 , H05B47/155 , H05B47/16
Abstract: An image processing device includes a vision sensor and a processor. The vision sensor generates a plurality of events in which an intensity of light changes and generates a plurality of timestamps depending on times when the events occur. In addition, the processor may regenerate a timestamp of a pixel where an abnormal event occurs, based on temporal correlation of the events.
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公开(公告)号:US20250063270A1
公开(公告)日:2025-02-20
申请号:US18801828
申请日:2024-08-13
Applicant: SK hynix Inc.
Inventor: Seung Hwan LEE , Jong Hyun RA , Tae Kyoung JUNG
IPC: H04N25/77
Abstract: An image sensing device comprising, a latch array including, a first latch group, a second latch group, a first latch controller generates a first latch control signal to control the first latch group, and a second latch controller generates a second latch control signal to control the second latch group, wherein a second edge of the second latch control signal occurs after a first edge of the first latch control signal.
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公开(公告)号:US20250053798A1
公开(公告)日:2025-02-13
申请号:US18929948
申请日:2024-10-29
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Takayuki IKEDA , Takahiro FUKUTOME
IPC: G06N3/067 , G06N3/04 , G06N3/065 , H01L27/12 , H01L27/146 , H01L29/786 , H04N23/57 , H04N25/75 , H04N25/77
Abstract: An imaging device connected to a neural network is provided. An imaging device having a neuron in a neural network includes a plurality of first pixels, a first circuit, a second circuit, and a third circuit. Each of the plurality of first pixels includes a photoelectric conversion element. The plurality of first pixels is electrically connected to the first circuit. The first circuit is electrically connected to the second circuit. The second circuit is electrically connected to the third circuit. Each of the plurality of first pixels generates an input signal of the neuron. The first circuit, the second circuit, and the third circuit function as the neuron. The third circuit includes an interface connected to the neural network.
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公开(公告)号:US12225307B2
公开(公告)日:2025-02-11
申请号:US17987914
申请日:2022-11-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Viatcheslav Smirnov
Abstract: A reflective module assembly is provided. The reflective module assembly includes a fixed body, a moving body configured to rotate with respect to the fixed body, a reflective member disposed in the moving body, the reflective member configured to change a direction of a path of light incident in a first optical axis direction to a second optical axis direction, three ball members spaced apart from a rotational axis of the moving body, the three ball members configured to rotatably support the moving body, and a groove arrangement disposed on at least one of the moving body and the fixed body, and configured to contact with the three ball members. The three ball members and the groove arrangement form six contact points.
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公开(公告)号:US20250048004A1
公开(公告)日:2025-02-06
申请号:US18719929
申请日:2022-11-15
Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Inventor: KATSUHIKO HANZAWA , DAISUKE SAITO
Abstract: An imaging device that can be reduced in size is provided. An imaging device according to an embodiment of the present disclosure includes a pixel array section configured to output a pixel signal obtained through photoelectric conversion of incident light, a memory array section configured to output a convolution signal indicating a result of a multiply-accumulate operation on an input signal based on the pixel signal, and a common circuit common to at least one of input and output sides of the pixel array section and the memory array section.
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公开(公告)号:US20250047998A1
公开(公告)日:2025-02-06
申请号:US18440175
申请日:2024-02-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kyungah JEONG
Abstract: Provided is an image sensor and a method of operating same, the image sensor including: an analog signal processing circuitry configured to process analog signals and to output digital signals; a digital data processing circuitry including one or more digital circuits configured to process the digital signals; and a control circuit configured to control operations of the one or more digital circuits based on operation schedule information, wherein the operation schedule information includes one or more control time intervals associated with one or more operation sequences of the image sensor.
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公开(公告)号:US20250039581A1
公开(公告)日:2025-01-30
申请号:US18784668
申请日:2024-07-25
Applicant: SK hynix Inc.
Inventor: Jae Hyung JANG
IPC: H04N25/77
Abstract: An image sensing device is provided to include a first pixel including a first single-photon avalanche diode (SPAD) that includes a cathode to receive a first bias voltage; a second pixel including a second SPAD that includes an anode to receive a second bias voltage; and a selection circuit coupled to the first pixel and the second pixel and configured to select the first pixel or the second pixel to produce an output.
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公开(公告)号:US12212867B2
公开(公告)日:2025-01-28
申请号:US17935731
申请日:2022-09-27
Applicant: Sony Semiconductor Solutions Corporation
Inventor: Atsumi Niwa
IPC: H04N25/75 , H01L27/146 , H04N25/47 , H04N25/63 , H04N25/709 , H04N25/77 , H04N25/79
Abstract: There is provided a solid-state image pickup element including: a photodiode configured to convert incident light into a photocurrent; an amplification transistor configured to amplify a voltage between a gate having a potential depending on the photocurrent and a source having a predetermined reference potential and output the amplified voltage from a drain; and a potential supply section configured to supply an anode of the photodiode and a back-gate of the amplification transistor with a predetermined potential lower than the reference potential.